半導體工廠自動化:技術的問題與市場預測
市場調查報告書
商品編碼
1266891

半導體工廠自動化:技術的問題與市場預測

Semiconductor Factory Automation: Technology Issues and Market Forecasts

出版日期: | 出版商: Information Network | 英文 | 商品交期: 2-3個工作天內

價格

本報告提供半導體工廠自動化產業調查分析,主要企業和促進因素等資訊。

目錄

第1章 簡介

第2章 摘要整理

第3章 促進因素

  • 簡介
  • 300/450mm晶圓的趨勢
  • 開發費
  • 單一晶圓處理
  • 處理工具趨勢
  • 自動化趨勢
  • 自動晶圓處理的優點

第4章 軟體

  • 簡介
  • CIM的演進
  • 產業的MES
    • MES的功能
    • MES的產品
  • 通訊規格
  • Sematech CIM組成架構

第5章 硬體設備

  • 簡介
  • 自動化的要素
    • 工具的自動化
    • Intrabay自動化
    • Interbay自動化
    • 材料管理系統
  • 彈性自動化
  • 可靠性
  • 工具的問題和趨勢
    • 彈性工具介面
    • 真空機器人
    • 自動導引運輸車
    • 機器人控制系統
    • 300mm晶圓搬運
    • 迷你環境和無塵室的問題
  • E-製造業

第6章 市場分析

  • 市場力量
  • 市場預測的前提條件
  • 市場預測
    • 自動傳輸工具市場
    • carrier搬運市場
    • MES軟體市場

第7章 用戶的問題

  • 目前自動化的想法
  • 新工廠的範例
  • 運作中的新工廠
  • 投資報酬率相關的考慮事項
  • 舊範例的8個症狀
  • 使新範例發揮作用

Clean processing has driven the proliferation of wafer-handling automation within process tools. Wafer-handling robot arms in vacuum and atmospheric tools are standard today. Meanwhile, Moore's Law played the primary role in wafer size increases and the automation that is present outside of the process tools.

This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation.

Markets are segmented as:

  • 1. Automated transfer tools (robots, elevators, platforms, etc.),
  • 2. Carrier transport (monorail, AGV, AS/RS, etc.),
  • 3. Manufacturing execution systems (MES) software.

With the move to 450mm wafers - changes in wafer size, weight, fragility, risk of damage or creation of damaging particles - existing wafer handling robots and the drives, motors, linear components and controls that automate these wafer handling tools will need a new generation of components to satisfy the requirements of 450mm wafer handling. The vacuum and atmospheric robotic market is forecast and market shares of vendors presented.

Table of Contents

Chapter 1. Introduction

Chapter 2. Executive Summary

  • 2.1. Summary of Major Issues
  • 2.2. Summary of Market Forecasts

Chapter 3. Driving Forces

  • 3.1. Introduction
  • 3.2. Trend to 300/450mm Wafers
  • 3.3. Development Costs
  • 3.4. Single-Wafer Processing
  • 3.5. Trends in Processing Tools
  • 3.6. Automation Trends
  • 3.7. Benefits of Automated Wafer Handling

Chapter 4. Software

  • 4.1. Introduction
  • 4.2. The Evolution of CIM
  • 4.3. MES in Industry
    • 4.3.1. MES Functionalities
    • 4.3.2. MES Products
  • 4.4. Communication Standards
  • 4.5. Sematech CIM Framework

Chapter 5. Hardware

  • 5.1. Introduction
  • 5.2. Elements of Automation
    • 5.2.1. Tool Automation
    • 5.2.2. Intrabay Automation
    • 5.2.3. Interbay Automation
    • 5.2.4. Material-Control System
  • 5.3. Flexible Automation
  • 5.4. Reliability
  • 5.5. Tool Issues and Trends
    • 5.5.1. Flexible Tool Interface
    • 5.5.2. Vacuum Robotics
    • 5.5.3. AGV
    • 5.5.4. Robot Control Systems
    • 5.5.5. 300-mm Wafer Transport
    • 5.5.6. Mini-Environments and Cleanroom Issues
  • 5.6. E-Manufacturing

Chapter 6. Market Analysis

  • 6.1. Market Forces
  • 6.2. Market Forecast Assumptions
  • 6.3. Market Forecast
    • 6.3.1. Automated Transfer Tool Market
    • 6.3.2. Carrier Transport Market
    • 6.3.3. MES Software Market

Chapter 7. User Issues

  • 7.1. Current Automation Thinking
  • 7.2. The New Factory Paradigm
  • 7.3. The New Factory in Action
  • 7.4. Return on Investment Considerations
  • 7.5. Eight Symptoms of the Old Paradigm
  • 7.6. Putting the New Paradigm to Work

List of Figures

  • 1.1. Advanced CIM System
  • 3.1. Automated Materials Handling System (AMHS) Framework
  • 4.1. Evolution of CIM
  • 4.2. Computer Integrated Fab Environment
  • 4.3. Message Integration in CIM
  • 4.4. Sematech CIM Framework Scope
  • 5.1. Material-Control System
  • 5.2. Traditional and Flexible Automated Material Handling System
  • 5.3. Overhead Monorail Delivery - Cassette in Box, Cassette in SMIF Pod
  • 5.4. Stocker Design and Interfaces
  • 5.5. Layout Of a 45nm 300mm Fab
  • 5.6. Interfaces To Factory Automation Systems
  • 6.1. Semiconductor Equipment Utilization
  • 6.2. Revenue Losses from Wafer Defects
  • 6.3. Market Shares of Atmospheric Robot Suppliers
  • 6.4. Market Shares of Vacuum Robot Suppliers
  • 6.6. Worldwide Market Shares of Carrier Transport Suppliers
  • 6.7. Worldwide Market of Shares MES Software Suppliers

List of Tables

  • 5.1. Evolution Of Factory Metrics
  • 6.1. Three-Year Savings for Automation
  • 6.2. Cost of Alternative Automated Systems
  • 6.3. Three-year Costs for Alternative Automated Systems
  • 6.4. Worldwide Forecast of Automated Transfer Tools
  • 6.5. Bill Of Materials For Atmospheric Automation Tool
  • 6.6. Bill Of Materials For PVD Vacuum Tool
  • 6.7. Process Tool Automation For 300mm Fabs
  • 6.8. Worldwide Forecast of Carrier Transport Market
  • 6.9. 300mm Fab Construction Plans
  • 6.10. Worldwide Forecast of MES Software