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市場調查報告書
半導體工廠的自動化:技術及市場預測
Semiconductor Factory Automation: Technology Issues and Market Forecasts
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半導體工廠的自動化:技術及市場預測 是由出版商The Information Network在2011年01月所出版的。
這份英文市場調查報告書包含155 PAGES 價格從美金2495起跳。
在尖端科技領域調查公司中具有世界級高度評價的美國調查公司The Information Network，將報告書” Semiconductor Factory Automation: Technology Issues and Market Forecasts”即時（訂購當時更新內容）呈現給您。
本報告提供半導體工廠自動化業界分析，主力企業，再加上決定半導體工廠朝自動化方向前進的因素分析。其市場區分為以下各類。
- 1. 自動運輸設備(機器人，電梯，月台等等)
- 2. 營運商運輸(戰軌列車，AGV，AS/RS等)
- 3. 製造執行系統(MES)軟體
本報告書內容概述如下。
1. 簡介
2. 摘要整理
3. 推進力
- 朝300MM晶圓發展的趨勢
- 開發成本
- 單一晶圓過程
- 過程工具的趨勢
- 自動化的趨勢
- 自動晶圓的優點
4. 軟體
- CIM的發展
- MES
- 通訊規格
- SEMATECH CIM framework
5. 硬體設備
- 自動化的要素
- 彈性自動化
- 可靠性
- 工具的問題與趨勢
- E-manufacturing(產業電子化)
6. 市場分析
- 市場影響因素
- 市場預測的前提條件
- 市場預測(自動運輸工具市場，營運商運輸市場，MES軟體市場)
7. 使用者相關問題
- 關於自動化的當今見解
- 工廠相關的新範例
- 開始運作的新工廠
- 關於ＲＯＩ的見解
- 舊範例的八個預兆
- 新範例的有效利用
Abstract
Automation plays a critical role in the manufacturing of semiconductors. The
majority of modern semiconductor fabrication facilities, or fabs, manufacture
IC chips on circular silicon wafers with diameters of 150mm, or 6 inches, and
200mm, or 8 inches. More recently the industry has begun to adopt wafers with
diameter sizes of 300mm, or 12 inches. A production manufacturing batch or lot
for 150mm and 200mm wafer sizes consists of 25 wafers, contained in either an
open cassette or a fully enclosed pod called SMIF, or standard mechanical
interface. Production lots for 300mm manufacturing typically consist of 25
wafers contained in a FOUP, or front-opening unified pod. Both SMIF and FOUP
technologies isolate the wafers from their surroundings by creating an
ultra-clean "mini-environment" within the pod. One wafer may yield hundreds of
chips, and each chip may contain tens or hundreds of millions of microscopic
transistors in leading devices. Chips are used in a wide variety of
applications, ranging from complex logic and memory chips used in a broad
range of computers to application-specific integrated circuits, or ASICs, used
in automobiles and consumer products, to Digital Signal Processing (DSP) and
analog semiconductors used in the mobile Internet market such as for
color-screen multimedia cell phones.
Table of Contents
Chapter 1 Introduction
Chapter 2 Executive Summary
- 2.1 Summary of Major Issues
- 2.2 Summary of Market Forecasts
Chapter 3 Driving Forces
- 3.1 Introduction
- 3.2 Trend to 300 mm Wafers
- 3.3 Development Costs
- 3.4 Single-Wafer Processing
- 3.5 Trends in Processing Tools
- 3.6 Automation Trends
- 3.7 Benefits of Automated Wafer Handling
Chapter 4 Software
- 4.1 Introduction
- 4.2 The Evolution of CIM
- 4.3 MES in Industry
- 4.3.1 MES Functionalities
- 4.3.2 MES Products
- 4.4 Communication Standards
- 4.5 Sematech CIM Framework
Chapter 5 Hardware
- 5.1 Introduction
- 5.2 Elements of Automation
- 5.2.1 Tool Automation
- 5.2.2 Intrabay Automation
- 5.2.3 Interbay Automation
- 5.2.4 Material-Control System
- 5.3 Flexible Automation
- 5.4 Reliability
- 5.5 Tool Issues and Trends
- 5.5.1 Flexible Tool Interface
- 5.5.2 Vacuum Robotics
- 5.5.3 AGV
- 5.5.4 CMP
- 5.5.5 300-mm Wafer Transport
- 5.5.6 Mini-Environments and Cleanroom Issues
- 5.6 E-Manufacturing
Chapter 6 Market Analysis
- 6.1 Market Forces
- 6.2 Market Forecast Assumptions
- 6.3 Market Forecast
- 6.3.1 Automated Transfer Tool Market
- 6.3.2 Carrier Transport Market
- 6.3.3 MES Software Market
Chapter 7 Issues 7-1
- 7.1 Current Automation Thinking
- 7.2 The New Factory Paradigm
- 7.3 The New Factory in Action
- 7.4 Return on Investment Considerations
- 7.5 Eight Symptoms of the Old Paradigm
- 7.6 Putting the New Paradigm to Work
LIST OF FIGURES
- 1.1 Advanced CIM System
- 3.1 Automated Materials Handling System (AMHS) Framework
- 4.1 Evolution of CIM
- 4.2 Computer Integrated Fab Environment
- 4.3 Message Integration in CIM
- 4.4 Sematech CIM Framework Scope
- 5.1 Material-Control System
- 5.2 Traditional and Flexible Automated Material Handling System
- 5.3 Overhead Monorail Delivery - Cassette in Box, Cassette in SMIF Pod
- 5.4 Stocker Design and Interfaces
- 5.5 Layout Of a 45nm 300mm Fab
- 5.6 Interfaces To Factory Automation Systems
- 6.1 Semiconductor Equipment Utilization
- 6.2 Revenue Losses from Wafer Defects
- 6.3 Market Shares of Automated Wafer Transfer Suppliers
- 6.4 Worldwide Market Shares of Carrier Transport Suppliers
- 6.5 Worldwide Market of Shares MES Software Suppliers
- 6.6 Worldwide Market Shares Of Fab System Integration Software
LIST OF TABLES
- 5.1 Evolution Of Factory Metrics
- 6.1 Three-Year Savings for Automation
- 6.2 Cost of Alternative Automated Systems
- 6.3 Three-year Costs for Alternative Automated Systems Worldwide Forecast
of Automated Transfer Tools
- 6.5 Process Tool Automation For 300mm Fabs
- 6.6 Worldwide Forecast of Carrier Transport Market
- 6.7 Worldwide Fab Installation Forecast
- 6.8 Worldwide Forecast of MES Software
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