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市場調查報告書

液晶顯示器的生產技術

LCD Market: Technology Directions and Market Analysis

出版商 Information Network 商品編碼 4966
出版日期 內容資訊 英文 250 PAGES
商品交期: 最快1-2個工作天內
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液晶顯示器的生產技術 LCD Market: Technology Directions and Market Analysis
出版日期: 2016年11月01日 內容資訊: 英文 250 PAGES
簡介

身為今日工業發展上不可或缺的重要元素,顯示器產業正日漸茁壯,尤其是導入液晶技術後,顯示器的發展更被賦予更多的可能性。

專業市調公司The Information Network,調查分析了液晶顯示器的生產與其他相關技術後,出版了一本綜合報告書”LCD Processing: Challenges, Directions, Markets”。內容包含液晶顯示器的技術趨勢、產品資料、應用實例,以及原料及設備供應商的分析等,並對AMLCD(主動矩陣液晶顯示器)設備與其原料市場等進行預測。內容綱要摘記如下:

1.前言

2.概要

  • 介紹
  • 市場機會

3.企業資訊(日本/美國/其他)

  • 液晶顯示器生產商
  • 原料供應商
  • 設備供應商

4.AMLCD(主動矩陣液晶顯示器)工廠

  • 工廠後勤調查
  • 無塵室
  • 自動化
  • 主動與被動矩陣液晶

5.必要設備與趨勢

  • 全球微蝕刻技術(Microlithography)
  • CVD設備與濺鍍設備(Sputtering)
  • 快速高溫處理(Rapid Thermal Processing)
  • 蝕刻(Etching)
  • 切割(Stripping)
  • 清潔(Cleaning)
  • 測試
  • 修理

6.必要原料與趨勢

  • IC晶片基板
    • 種類材料
    • 材料特性
    • 有關尺寸、厚薄的趨勢
    • 有關表面特性的趨勢
    • 耐高溫度
  • 液晶
  • 配向膜(Alignment Layer)
  • 彩色濾光片(Color Filter)
  • 偏光片(Polarizer Films)

7.市場預測

  • 液晶顯示器市場預測
  • 打入市場
  • 原料市場預測
  • 周邊設備市場-預測與趨勢
  • 市場預測—幾個假設
目錄

TFT-LCD (thin film transistor-liquid crystal display) market growth has been stymied by a slowdown in PC monitors, notebooks and tablets. Although 4K LCD TVs, smartphones and automotive displays are driving forces for the market, the display market nevertheless is forecast to be flat to down in 2015. Dwindling TFT LCD display revenues, declining panel demand in the PC sector, along with ongoing panel-price erosion are the primary reasons for overall FPD revenue declines this year. Applied Materials led the LCD equipment market in 2014, but the overall equipment market is forecast to drop more than 10% in 2015.

This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for LCDs, equipment and materials is presented along with market share of vendors.

Table of Contents

Chapter 1 - Introduction

Chapter 2 - Executive Summary

  • 2.1. Introduction
  • 2.2. Market Opportunities

Chapter 3 - Profiles of Japanese Companies

  • 3.1. Equipment Manufacturers
  • 3.2. Material Manufacturers
  • 3.3. LCD Manufacturers

Chapter 4 - Profiles of US Companies

  • 4.1. Equipment Manufacturers
  • 4.2. Material Manufacturers
  • 4.3. LCD Manufacturers

Chapter 5 - Profiles of ROW Companies

  • 5.1. Equipment Manufacturers
  • 5.2. Material Manufacturers
  • 5.3. LCD Manufacturers
  • 5.4. Mainland China

Chapter 6 - The AMLCD Factory

  • 6.1. Factory Logistics
    • 6.1.1. Investment Needs
    • 6.1.2. Capacity
    • 6.1.3. Plant Size
  • 6.2. Cleanrooms
  • 6.3. Automation
  • 6.4. Active Matrix LCD Production Trends
    • 6.4.1. TFT-LCD
      • 6.4.1.1. IPS
      • 6.4.1.2. MVA
      • 6.4.1.3. PVA
    • 6.4.2. Passive Matrix LCD
    • 6.4.3. Ferroelectric LCDs
  • 6.5. Electrophoretic Display
  • 6.6. Plastic LCDs
  • 6.7. Organic Light-Emitting Diode (OLED)

Chapter 7 - Equipment Requirements and Trends

  • 7.1. Introduction
  • 7.2. Microlithography
    • 7.2.1. Proximity Printing
    • 7.2.2. Scanning Projection
    • 7.2.3. Step-and-Repeat
      • Image Field Stitching
      • Overlay
  • 7.3. Deposition
    • 7.3.1. CVD
    • 7.3.2. Sputtering
  • 7.4. Rapid Thermal Processing
  • 7.5. Etch/Strip/Clean
    • 7.5.1. Etching
      • Plasma Etching
      • Wet Chemical Etching
    • 7.5.2. Photoresist Stripping
    • 7.5.3. Cleaning
  • 7.6. Inspection Systems
  • 7.7. Test Systems
    • 7.7.1. Technology Capabilities
      • Voltage/Capacitance Imaging
      • Ohmic/Continuity Test
      • Charge Sensing
      • Forward Admittance Sensing
      • E-Beam Test
    • 7.7.2. Yield Improvements
  • 7.8. Repair

Chapter 8 - Material Requirements and Trends

  • 8.1. Substrates
    • 8.1.1. Material Types
    • 8.1.2. Quality Issues
    • 8.1.3. Trends
      • Larger Substrates
      • Thinner Substrates
      • Better Surface
      • Higher Temperature Capability
      • Manufacturers
  • 8.2. Liquid Crystals
    • 8.2.1. Introduction
    • 8.2.2. OLEDs and Light-Emitting Polymers
  • 8.3. Alignment Layer
    • 8.3.1. Material Properties
    • 8.3.2. Material Trends
  • 8.4. Color Filters
    • 8.4.1. Materials
  • 8.5. Polarizer Films
    • 8.5.1. Material Properties and Trends

Chapter 9 - Market Forecast

  • 9.1. Getting To Market
  • 9.2. Market Forecast Assumptions
  • 9.3. LCD Market Forecast
  • 9.4. Equipment Market Forecast and Trends
    • 9.4.1. Lithography
    • 9.4.2. Plasma Etching and Stripping
    • 9.4.3. Thin Film Deposition
    • 9.4.4. Wet Etching and Cleaning
    • 9.4.5. Photoresist Processing
    • 9.4.6. Inspection/Repair
    • 9.4.7. Total Equipment Market
  • 9.5. Materials Market Forecast and Trends

List of Tables

  • 6.1: Investment for Large-size TFT-LCD Panel Plants
  • 6.2: Causes of Defects in TFT LCD Manufacturing
  • 7.1: Common Wafer Processing Chemicals
  • 7.2: Advantages and Disadvantages of Various Cleaning Methods
  • 8.1: Desired Nematic LC Material Characteristics
  • 8.2: Performance Of LEPs
  • 8.3: Characteristics of Aligning Materials
  • 9.1: Worldwide LCD Display Market Forecast
  • 9.2: Major LCD Panel Makers Market Share 2006-present
  • 9.3: Major LCD Panel Makers Capacity
  • 9.4: Worldwide TFT-LCD Stepper/Scanner Market Forecast
  • 9.5: Worldwide Market Forecast of TFT-LCD Plasma Etching Systems
  • 9.6: Forecast of Worldwide TFT-LCD Thin Film Deposition Equipment Market
  • 9.7: Forecast of Worldwide TFT-LCD Wet Etching and Cleaning Equipment Market
  • 9.8: Forecast of Worldwide TFT-LCD Photoresist Processing Equipment Market
  • 9.9: Forecast of Worldwide TFT-LCD Inspection/Repair Equipment Market
  • 9.10: Forecast of Worldwide TFT-LCD Equipment Market
  • 9.11: Worldwide Equipment Market Shares
  • 9.12: TFT-LCD Material And Component Revenues

List of Figures

  • 6.1: FPD Stocker and Lifter
  • 6.2: Amorphous Silicon AM Fabrication Process
  • 6.3: AMLCD Cross Section
  • 6.4: Electrophoretic Display Cross Section
  • 6.5: Schematic of a 2-Layer OLED
  • 7.1: Schematic of Step-and-Repeat Aligner
  • 7.2: Schematic of Hot-Wall LPCVD Reactors
  • 7.3: Schematic of PECVD Techniques
  • 7.4: Diagram of Magnetron Sputtering Source
  • 7.5: Diagram of Rapid Thermal Processor
  • 7.6: Process Flow for Cell/Module Inspection
  • 8.1: Light-Emitting Polymer Structure
  • 8.2: LEP Structure Cross Section
  • 8.3: Ink-Jet Printing Of LEP Structure
  • 8.4: Comparison of Color Filter Methods
  • 9.1: Worldwide Large Panel Display Market Forecast
  • 9.2: Worldwide LCD PC Monitor Market Forecast
  • 9.3: Worldwide Large-Size TFT Shipments By Region
  • 9.4: North American LCD TV Shipments
  • 9.5: North American Plasma TV Shipments
  • 9.6: Worldwide TFT-LCD Equipment Market Growth
  • 9.7: Cost Structure of a 17-inch LCD Monitor Panel
  • 9.8: Worldwide Large Area LCD Glass Market Demand
  • 9.9: Worldwide Large Area LCD Glass Market Share
  • 9.10: Worldwide Large Area LCD Glass Market Share 5G and Above
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