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市場調查報告書

IC 流程中的群組化工具:技術及市場分析與預測

Cluster Tools In IC Processing: Technology and Market Forecasts

出版商 The Information Network
出版日期 2011年01月 商品編碼 4963
內容資訊 英文  
價格
US $ 2495 PDF by E-mail
US $ 2595 PDF by E-mail & Hard Copy


IC 流程中的群組化工具:技術及市場分析與預測 是由出版商The Information Network在2011年01月所出版的。 這份英文市場調查報告書價格從美金2495起跳。

目錄

Abstract

Modular, multichamber, integrated process systems -- cluster tools -- have achieved worldwide recognition, and have become widely accepted worldwide as a key concept for VLSI manufacturing.

The rationale behind the cluster concept is to:

  • Reduce cycle times
  • Reduce wafer handling by operators
  • Reduced particulate contamination
  • Reduced molecular contamination
  • Ability to initiate difficult processes

The perceived advantages of cluster tools comes at a time when the semiconductor industry has been is a sustained growth period, when rising costs has increased the cost of a 35,000 sq. ft. fab to $3 billion.

However, despite the claims for the advantages of cluster tools, quantitative data have been largely unproven. Open architectures, which will open the flood gates for standardization in the equipment industry, have not been established sufficiently to prove their value. As a result, closed architecture systems will continue to be sold throughout the timeframe of this study, even though they may not necessarily provide the lowest cost or best technology for a specific process. The attainment of a high reliability factor has prevented any successful implementation of automation in an IC facility. The advent of powerful, inexpensive microcomputers with high-speed data acquisition and processing capabilities has enabled manufacturers to build equipment with sufficient intelligence to monitor a variety of parameters. Advances in the field of remote sensing and control components has also enabled these functions to be measured with greater accuracy. A host or mode computer can provide better wafer process control and tracking as well as accurate diagnostic information should a problem occur.

Future cluster tools will implement much more sophisticated monitoring to assure process functionality and provide a means of detecting and correcting problems. To assure proper process completion and sequence, diagnostic tools are being incorporated inside process modules for real-time communication feedback. These tools will require highly developed internal system diagnostic capability; highly integrated equipment will require intensive sensing technology.

This report addresses these technical issues, presenting an analysis of the industry, the key players, and the driving forces directing the cluster tool concept. Markets are analyzed and are segmented by flexible and non-flexible cluster tools.

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

  • 2.1 Summary of Technical Issues
  • 2.2 Summary of Market Forecast

Chapter 3 Interface Standards

  • 3.1 SEMI/MESC
    • SECS I and SECS II
  • 3.3 High-Speed Secs Message Services (HSMS) Standard
  • 3.4 GEM
  • 3.5 Standards Directions

Chapter 4 The Cluster Concept

  • 4.1 Definitions
  • 4.2 Device Technology and Integrated Processing
  • 4.3 Main Functional Units
    • 4.3.1 Central Handling Platform
    • 4.3.2 Cassette Stations
    • 4.3.3 Extension Modules
    • 4.3.4 Single Process Modules
    • 4.3.5 Batch Modules
    • 4.3.6 Multiple Process Modules
  • 4.4 Cluster Tool Communications
    • 4.4.1 Cluster Tool Controller
    • 4.4.2 Transport Module Controller
    • 4.4.3 Process Module Controller
    • 4.4.4 Control Software
    • 4.4.5 Human Interface Software
    • 4.4.6 Networking Software
  • 4.5 Vacuum System Design

Chapter 5 Commercial Cluster Tools

  • 5.1 Cluster Tools and Suppliers
    • AIO
    • Alcatel
    • Anelva
    • Apex
    • Applied Materials
    • ASM
    • ASML
    • Aviza Technology
    • BLE Laboratory Equipment
    • Brooks Automation
    • Convac-APT
    • Couger Labs
    • DaiNippon Screen
    • Ebara
    • FSI International
    • Genmark
    • Genus
    • Ginitech
    • Hitachi
    • IPS
    • Jipelec
    • Jusung Engineering
    • Kanematsu Semiconductor
    • Kokusai
    • Kornic
    • Lam Research
    • Mattson Technology
    • Modern Industries
    • Modular Process Technology
    • Novellus Systems
    • Oxford Instruments Plasma Technology
    • Primaxx
    • Rorze
    • Samsung Electronics
    • SC Fluids
    • Semitool
    • Sentech
    • Surface Technology Systems
    • Suss MicroTec AG
    • Tegal
    • Tek-Vac
    • Thermo Electron Corp.
    • Tokyo Electron
    • Trikon Technologies
    • Ulvac
    • Unaxis
    • Vactronics Lab Equipment
    • Veeco
  • 5.2 Process Modules and Suppliers
    • AXIC
    • Nanaometrics
    • Nicolet
    • Nova Measuring Instruments
    • Pfeiffer Vacuum
    • XMR

Chapter 6 Cluster Tool Process Trends

  • 6.1 Introduction
  • 6.2 Deposition - Plasma Etch
  • 6.3 Deposition - Rapid Thermal Processing
  • 6.4 Lithography - Resist Processing
  • 6.5 Diagnostics - Process
  • 6.6 CMP Polish - Clean

Chapter 7 Cluster Tool Issues

  • 7.1 Introduction
  • 7.2 Equipment Reliability
  • 7.3 Equipment Maintainability
  • 7.4 Challenges
  • 7.5 Opportunities

Chapter 8 Economic and Human Resource Issues

  • 8.1 Introduction
  • 8.2 Economic Justification
    • 8.2.1 Background
    • 8.2.2 Cost Justification
    • 8.2.3 Reserves
    • 8.2.4 Personnel Costs
    • 8.2.5 Other ROI Considerations
  • 8.3 Human Resources Impact
    • 8.3.1 Background
    • 8.3.2 Direct Labor
    • 8.3.3 Equipment Support
    • 8.3.4 Process Engineering
    • 8.3.5 Operations Staff

Chapter 9 Market Forecast

  • 9.1 Introduction
  • 9.2 Market Forecast Assumptions
  • 9.3 Market Forecast
    • 9.3.1 Total Available Equipment Market
    • 9.3.2 Flexible Cluster Tool Market
    • 9.3.3 Non-Flexible Cluster Tool Market
    • 9.3.4 Total Cluster Tool Market

FIGURES

  • 3.1 Trend in Use of SECS by Equipment Manufacturers
  • 4.1 Basic Cluster Tool Architecture
  • 4.2 Basic Cluster Tool Architecture
  • 4.3 Communication Architecture in a Cluster Tool
  • 5.1 Anelva's Cu CVD Process Tool
  • 5.2 Process Chambers in Applied Materials'
  • EPI Centura System
  • 5.3 Brooks Automation's Gemini Express 8000
  • 5.4 Process Chambers in Hitachi's M600 Etcher
  • 8.1 Segmentation of Operator Processing Functions
  • 9.1 Shares of the Total Available Market
  • 9.2 Market Forecast of Flexible Cluster Tools
  • 9.3 Market Shares of Flexible Cluster Tools
  • 9.4 Market Forecast of Non-Flexible Cluster Tools
  • 9.5 Market Shares of Non-Flexible Cluster Tools
  • 9.6 Cluster Tools vs Total Available Market
  • 9.7 Cluster Tools vs Total Available Market
  • 9.8 Cluster Tools as % of TAM

TABLES

  • 3.1 Corporate Participants in SEMI/MESC
  • 4.1 Model for DRAM Production Line
  • 9.1 Total Available Equipment Market Forecast
  • 9.2 Total Cluster Tool Equipment Market Forecast
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