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市場調查報告書

光罩生產、瑕疵檢查及修復市場分析及課題

Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues

出版商 Information Network 商品編碼 4962
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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光罩生產、瑕疵檢查及修復市場分析及課題 Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues
出版日期: 2016年11月01日 內容資訊: 英文
簡介

本報告為,匯整光罩生產、瑕疵檢查及修復設備之技術課題、供應商策略及機會、市場預測等,以下列摘要形式闡述。

第1章 簡介

第2章 實施概要

  • 主要課題概要
  • 市場機會概要

第3章 技術課題

  • 光罩生產
    • 光罩基板
    • 光罩成品
  • 光罩生產設備
    • 電子束系統
    • 雷射圖形產生工具
  • 光罩檢查
    • 光罩瑕疵
  • 光罩修復
    • 雷射修復
    • 聚焦離子束修復
    • 其他修復方式

第4章 用戶ー供應商策略

  • 確立用戶需求
    • 光罩生產
    • 微米光罩製作
    • 光罩檢查設備
    • 光罩修復雷射 vs. FIB
    • PSM(相位移光)
    • OPC(光學鄰近修正)
    • NGL技術課題
  • 競合供應商之商業機會

第5章 市場預測

  • 影響市場因素
    • 概要
    • IC電路加工技術趨勢
    • 光罩及倍縮光罩需求之相關要件
    • 快速周轉設備
    • e光束及X光直接寫入之影響
  • 市場預測及先決條件
  • 光罩生產、檢查及修復
  • 光罩成品市場
    • 倍縮光罩/光罩設備

圖表

目錄

Each new generation of IC devices brings about a corresponding decrease in linewidths and minimum feature sizes. The technological trends and innovations in IC fabrication processes directly influence the market for masks and mask making equipment. This report examines and projects the technologies involved, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.

This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.

Table of Contents

Chapter 1 - Introduction

  • 1.1. The Need For This Report

Chapter 2 - Executive Summary

  • 2.1. Summary of Major Issues
  • 2.2. Summary of Market Opportunities

Chapter 3 - Technology Issues

  • 3.1. Mask Making
    • 3.1.1. Mask Blanks
    • 3.1.2. Completed Masks
  • 3.2. Mask Making Equipment
    • 3.2.1. Electron Beam Systems
    • 3.2.2. Laser Pattern Generators
  • 3.3. Mask Inspection
    • 3.3.1. Mask Defects
      • Transmission Variations
      • Transparent Defects
      • Nuisance Defects
      • CD Variations
      • Reflectivity Variations
  • 3.4. Mask Repair
    • 3.4.1. Laser Repair
    • 3.4.2. Focused Ion Beam Repair
    • 3.4.3. Other Repair Methods

Chapter 4 - User-Vendor Strategies

  • 4.1. Establishing User Needs
    • 4.1.1. Mask Making - Merchant or Captive
    • 4.1.2. Submicron Mask Making Equipment - Laser vs E-Beam
    • 4.1.3. Mask Inspection Equipment
    • 4.1.4. Mask Repair - Laser vs FIB
    • 4.1.5. Phase-Shift Masks
    • 4.1.6. Optical Proximity Correction
    • 4.1.7. NGL Technology Challenges
      • 4.1.7.1. X-Ray Masks
      • 4.1.7.2. EPL Masks
      • 4.1.7.3. EUVL Masks
  • 4.2. Competitive Vendor Opportunities

Chapter 5 - Market Forecast

  • 5.1. Driving Forces
    • 5.1.1. Introduction
    • 5.1.2. Trends in IC Processing Technology
    • 5.1.3. Mask and Reticle Requirements
    • 5.1.4. Fast Turnaround Devices
    • 5.1.5. Impact of Direct Write E-Beam and X-Ray
  • 5.2. Market Forecast Assumptions
  • 5.3. Mask Making, Inspection, and Repair
    • 5.3.1. Completed Mask Market
    • 5.3.2. Reticle/Mask Manufacturing Equipment

List of Figures

  • 3.1: Light Transmittance of Glasses
  • 3.2: Photomask Fabrication Flow
  • 3.3: Optical Photomask Fabrication Flow
  • 3.4: SCAPLEL Photomask Fabrication Flow
  • 3.5: MaskRigger Software in a Mask Fabrication Process
  • 3.6: Schematic of a Laser Pattern Generator
  • 3.7: Mulith Reference Distribution Aerial Image Formation
  • 3.8: Die-to-Die and Die-to-Database Inspection
  • 3.9: Defect Inspection Practices
  • 3.10: Percentage of Yield Losses
  • 3.11: Yield for Masks
  • 3.12: Yield for Binary Masks
  • 3.13: Schematic of a Focused Ion Beam System
  • 3.14: Illustration of Clear and Opaque Mask Repair
  • 4.1: Write Time Versus Device Complexity
  • 4.2: Subwavelength Gap
  • 4.3: Lithography Requiements
  • 4.4: Phase-Shifting Masks
  • 4.5: iN Phase Mask Design
  • 4.6: Illustration of OPC
  • 4.7: Main NGL Mask Formats
  • 4.8: Mask Costs Versus Feature Size
  • 5.1: Increasing Mask Complexity
  • 5.2: Production Costs for Maskmaking
  • 5.3: Capital Expenditures and Revenues
  • 5.4: Photomask Functionality
  • 5.5: Worldwide Merchant Mask Making Market Shares
  • 5.6: North American Merchant Mask Making Market Shares
  • 5.7: European Merchant Mask Making Market Shares
  • 5.8: Pacific Rim Merchant Mask Making Market Shares
  • 5.9: Japan Merchant Mask Making Market Shares
  • 5.10: Mask Inspection Market Shares
  • 5.11: Mask Metrology Market Shares
  • 5.12: Mask Repair Market Shares
  • 5-13: Photomask Repair Methods

List of Tables

  • 4.1: FIB and Laser Repair Comparison
  • 4.2: NGL Mask Formats
  • 4.3: Cost of Reticle/X-Ray Mask
  • 4.4: Phase Shift Mask and X-Ray Mask Manufacturing
  • 5.1: Roadmap of Mask Inspection
  • 5.2: IC Lithographic Requirements
  • 5.3: Increasing Mask Complexity
  • 5.4: Worldwide Mask Making Market by Feature Size
  • 5.5: Captive Mask Shops
  • 5.6: Worldwide Mask Making Equipment Market Forecast
  • 5.7: Mask Inspection Market Forecast
  • 5.8: Mask Metrology Market Forecast
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