Sub-100nm微影術:市場分析與策略性問題

本報告提供Sub-100nm微影術市場相關調查分析，微影術的問題與趨勢，市場預測等資訊。

目錄

第1章 簡介

第2章 摘要整理

第3章 微影術的問題和趨勢

• 光學系統
  • 簡介
  • 深紫外線(DUV)
• EUV
• 奈米界內印刷微影術
• X光微影術
• 電子束微影術
• 離子束微影術

第4章 用戶 - 供應商策略

• 微影術的需求決策
• 供應商的基準
• 競爭環境
• class1無塵室設備
• 未來工廠的設備
• 機會

第5章 市場預測

• 促進因素
  • 技術趨勢
  • 經濟趨勢
  • 光學的限制
• 市場預測的前提條件
• 市場預測
  • 背景
  • 微影術市場預測
  • 市場佔有率
• EUV顧客Insertion

Lithography tools are essential if chipmakers are to follow their shrinkage roadmap. Intel, Samsung and TSMC have all set out shrinkage roadmaps for 5nm nodes and below, aiming to deliver chips with superior performance at a lower cost.

ASML is the dominant leader in the semiconductor lithography sector, with Nikon and Canon its chief competitors, and the only manufacturer of EUV lithography.

Chipmakers remain committed to their leading-edge roadmap: ASML's main business drivers are chipmakers' leading-edge roadmaps, which detail the timeline for the development of smaller and more complex semiconductors. We believe chipmakers will increasingly use ASML's extreme ultraviolet lithography (EUV) tool in their manufacturing processes. Our research has found that the main buyers of EUV this year and next year will be TSMC, Samsung and, potentially, Intel: all three are still committed to their roadmaps.

Foundry / logic some customers are leveraging EUV to reduce the number of steps for specific layer; however other layers continue to add additional steps. For DRAM, our conversation highlighted that more complex patterning schemes (vs. foundry / logic) should result in EUV adoption targeted at very specific layers that can provide cost reductions. We note that this will be more vendor dependent and based on design schemes.

Table of Contents

Chapter 1 Introduction

• 1.1. The Need For This Report

Chapter 2 Executive Summary

• 2.1. Summary of Major Issues
• 2.2. Summary of Market Opportunities

Chapter 3 Lithography Issues And Trends

• 3.1. Optical Systems
  • 3.1.1. Introduction
  • 3.1.2. Deep Ultraviolet (DUV)
• 3.2. EUV
• 3.3. Nano-Imprint Lithography
• 3.4. X-Ray Lithography
• 3.3. Electron Beam Lithography
• 3.4. Ion Beam Lithography

Chapter 4 User - Supplier Strategies

• 4.1. Determining Lithography Needs
• 4.2. Benchmarking a Vendor
  • 4.2.1. Pricing
  • 4.2.2. Vendor Commitment and Attitudes
  • 4.2.3. Vendor Capabilities
  • 4.2.4. System Capabilities
  • 4.2.5. Vendor Feedback During Equipment Evaluation
  • 4.2.6. Vendor Feedback During Device Production
• 4.3. Competitive Environment
• 4.4. Equipment For Class 1 Cleanrooms
• 4.5. Equipment For the Factory of the Future
• 4.6. Opportunities

Chapter 5 Market Forecast

• 5.1. Driving Forces
  • 5.1.1. Technical Trends
  • 5.1.2. Economic Trends
  • 5.1.3. Optical Limitations
• 5.2. Market Forecast Assumptions
• 5.3. Market Forecast
  • 5.3.1. Background
  • 5.3.2. Lithography Market Forecast
  • 5.3.3. Market Shares
• 5.4. EUV Customer Insertion

LIST OF TABLES

• 2.1. Comparison Between DUV And EUV For Multiple Patterning
• 3.1. Characteristics Of I-Line Stepper
• 3.2. Comparison Of Different DUV Lithography Systems
• 3.2. Characteristics of X-Ray Systems
• 5.1. Worldwide Capital Spending
• 5.2. DRAM Lithographic Requirements
• 5.3. Worldwide Optical Stepper Market Forecast - Revenues
• 5.4. Worldwide Optical Stepper Market Forecast - Units
• 5.5. Worldwide Optical Stepper Market Forecast - ASPs
• 5.6. Worldwide Stepper Market Shares
• 5.7. EUV Customer's Technology Roadmaps

LIST OF FIGURES

• 3.1. Evolution Of Lithography Systems
• 3.2. Excimer Laser Evolution
• 3.3. Schematic Of EUV System
• 3.4. Thermoplastic Nanoimprint Lithography Process
• 3.5. Step and Flash Nanoimprint Lithography Process
• 3.6. Illustration of X-Ray Lithography
• 3.7. Schematic Of Scalpel Electron Beam System
• 3.8. Multi-Source E-Beam Lithography
• 3.9. Ion Projection Lithography System
• 4.1. Technology Nodes Through
• 4.2. EUV Cost Of Ownership
• 4.3. Imprint Cost Of Ownership
• 5.1. Lithography Market Vs Equipment Market
• 5.2. DUV Immersion Vs EUV
• 5.3. Lithography Extensions
• 5.4. Lithography Cost of Ownership
• 5.5. Segmentation of Stepper/Scan Shipments
• 5.6. Market Shares of Vendors (Units)
• 5.7. Unit Market Shares of Vendors
• 5.8. Worldwide I-Line Market Shares
• 5.9. Worldwide 248nm Market Shares
• 5.10. Worldwide 193nm Dry Market Shares
• 5.11. Worldwide 193nm Wet Market Shares
• 5.12. Market Shares of Vendors (Revenues)