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市場調查報告書

次微米微影技術:市場分析與策略問題

Sub 100-nm Lithography: Market Analysis and Strategic Issues

出版商 Information Network 商品編碼 4961
出版日期 內容資訊 英文 150 PAGES
商品交期: 最快1-2個工作天內
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次微米微影技術:市場分析與策略問題 Sub 100-nm Lithography: Market Analysis and Strategic Issues
出版日期: 2016年11月01日 內容資訊: 英文 150 PAGES
簡介

通訊與線路、電腦工業分類的市場調査得到來自全球高評價的 The Information Network(總公司:賓州)提供次微米微影技術市場與策略挑戰相關調查・分析所製作的報告 “Sub 100-nm Lithography: Market Analysis and Strategic Issues”已發行。

本報告針對光學系統、X光系統、電子光束與離子光束等各種微光技術動向與課題,提供供應商策略與今後預測,目錄介紹如下。

第 1 章介紹

第 2 章摘要整理

第 3 章微影技術課題與動向

  • 光學系統
    • 投射式對準機
    • 光刻步進機&重複式步進對準機
    • 248nm DUV光阻
    • 193nm DUV光阻
    • Mix-and-Match
  • 157nm DUV 與光阻
  • EUV
  • X光系統
    • 來源
    • 光罩
    • 光刻步進機
    • 光阻
  • 電子束系統
  • 粒子束系統
    • 直接描寫
    • 粒子道光罩
    • 粒子投影
  • 新技術
    • Mulith Reference Distribution Aerial Image Formation
    • 全息圖
    • X光雷射
    • 原子微影技術
    • 微透鏡
    • 奈米壓印
    • EWL Lithography
  • 微影技術所有成本分析
    • 概要
    • 所有成本模式
    • 所有成本計算結果
    • 單獨計算成本
  • 總結

第 4 章供應商策略

  • 微影技術需求定義
  • 供應商基準
    • 價格
    • 供應商承諾與態度
    • 供應商能力
    • 系統性能
    • 設備評估中的供應商反映
    • 設備生産中的供應商反映
  • 競爭環境
  • Class1無塵室設備
  • 未來型工廠設備
  • 市場機會

第 5 章市場預測

  • 影響因素
    • 技術動向
    • 經濟動向
    • 光学技術的極限
  • 市場預測相關假設
  • 市場預測
目錄

The continued improvements in lithography have been the driving force that has upheld Moore's Law. Shorter wavelengths, better lenses, and adaptive optics have all contributed to this success story, which has allowed commercial chips to be fabricated with 14nm feature sizes

This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide lithography markets are analyzed and projected by type (EUV, DUV, and optical), and market shares by vendor for each type.

Table of Contents

Chapter 1 - Introduction

  • 1.1. The Need For This Report

Chapter 2 - Executive Summary

  • 2.1. Summary of Major Issues
  • 2.2. Summary of Market Opportunities

Chapter 3 - Lithography Issues And Trends

  • 3.1. Optical Systems
    • 3.1.1. Introduction
    • 3.1.2. Step-and-Repeat Aligners
    • 3.1.3. Deep Ultraviolet (DUV)
  • 3.2. EUV
  • 3.5. Nano-Imprint Lithography
  • 3.4. X-Ray Lithography
  • 3.3. Electron Beam Lithography
  • 3.4. Ion Beam Lithography

Chapter 4 - User-Supplier Strategies

  • 4.1. Determining Lithography Needs
  • 4.2. Benchmarking a Vendor
    • 4.2.1. Pricing
    • 4.2.2. Vendor Commitment and Attitudes
    • 4.2.3. Vendor Capabilities
    • 4.2.4. System Capabilities
    • 4.2.5. Vendor Feedback During Equipment Evaluation
    • 4.2.6. Vendor Feedback During Device Production
  • 4.3. Competitive Environment
  • 4.4. Equipment For Class 1 Cleanrooms
  • 4.5. Equipment For the Factory of the Future
  • 4.6. Opportunities

Chapter 5 - Market Forecast

  • 5.1. Driving Forces
    • 5.1.1. Technical Trends
    • 5.1.2. Economic Trends
    • 5.1.3. Optical Limitations
  • 5.2. Market Forecast Assumptions
  • 5.3. Market Forecast

List of Tables

  • 3.1: Wavelength “Generations”
  • 3.2: Characteristics of X-Ray Systems
  • 5.1: Worldwide Capital Spending
  • 5.2: DRAM Lithographic Requirements
  • 5.3: Worldwide Optical Stepper Market
  • 5.4: Worldwide Stepper Market Shares

List of Figures

  • 1.1: Lithographic Equipment Requirements for DRAMs
  • 3.1: Lithography Options For MPUs/DRAMs
  • 3.2: Lithography Options For Flash
  • 3.3: Illustration of Stepper Exposure System
  • 3.4: Lens Arrangement For Submicron Features
  • 3.5: Excimer Laser Evolution
  • 3.6: EUV Lithography
  • 3.7: Thermoplastic Nanoimprint Lithography Process
  • 3.8: Step And Flash Nanoimprint Lithography Process
  • 3.9: Illustration of X-Ray Lithography
  • 3.10: Schematic Of Scalpel Electron Beam System
  • 3.11: Multi-Source E-Beam Lithography
  • 3.12: Ion Projection Lithography System
  • 4.1: Manufacturing Costs Per Exposure Station
  • 5.1: Lithography Market Vs Equipment Market
  • 5.2: Lithography Double Exposure Technique
  • 5.3: Lithography Requirements
  • 5.4: Lithography Extensions
  • 5.5: Lithography Cost of Ownership
  • 5.6: Segmentation of Stepper/Scan Shipments
  • 5.7: Market Shares of Vendors (Units)
  • 5.8: Unit Market Shares of Vendors
  • 5.9: Worldwide I-Line Market Shares
  • 5.10: Worldwide 248nm Market Shares
  • 5.11: Worldwide 193nm Dry Market Shares
  • 5.12: Worldwide 193nm Wet Market Shares
  • 5.13: Market Shares of Vendors (Revenues)
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