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市場調查報告書

生產覆晶晶片用光刻及蝕刻市場

FLIP CHIP/WLP MANUFACTURING AND MARKET ANALYSIS

出版商 Information Network 商品編碼 42277
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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生產覆晶晶片用光刻及蝕刻市場 FLIP CHIP/WLP MANUFACTURING AND MARKET ANALYSIS
出版日期: 2016年11月01日 內容資訊: 英文
簡介

目前的覆晶構裝的年複合成長率為28%,這主要是受惠於光刻及蝕刻市場。

在通訊及集積迴路、電腦工業領域的市場調查上獲得全球高度評價的 The Information Network(總公司位於賓州)調查分析了生產覆晶晶片所用光刻及蝕刻的市場,並將之有條理地彙整成報告"Lithography and Etch Market Analysis For Flip Chip Manufacturing"來發行。

本報告提供覆晶,光刻,UBM蝕刻各領域技術方面及成本方面的相關課題與趨勢的詳細調查分析,同時也加進覆晶及WLP市場的成長要素和有關市場機會的分析,為您概述為以下內容。

第1章 介紹

第2章 摘要整理

第3章 覆晶的相關課題與趨勢

  • 介紹
  • 晶圓凸塊(晶圓植球)
    • 錫鉛凸塊
    • 金凸塊
    • 銅柱凸塊
    • 銅柱螺絲凸塊
    • C4NP
  • 晶圓級構裝(WLP)
  • 焊墊重布
  • 晶圓凸塊(晶圓植球)的成本
    • 晶圓重布與凸塊成本
    • WLCSP(晶圓級構裝)的隱性成本
    • 每個高品質晶粒的WLCSP成本
    • 晶圓構裝填注底膠

第4章 光刻的相關課題與趨勢

  • 相關課題
    • 技術的效能
    • 設備投資
    • 消費品的成本
    • 容許量
    • 是否容易使用
    • 彈性
    • 機器的支援
    • 解析度
    • 錫鉛凸塊功能
    • 金凸塊功能
  • 曝光系統
    • 介紹
  • 競爭技術
    • 噴墨式printing
    • 網板印刷
    • 無電鍍金屬鍍膜法

第5章 UBM蝕刻的相關課題與趨勢

  • 介紹
  • 技術層面的課題與趨勢
    • 流程
    • 蝕刻過程
    • 化學蝕刻
  • 批次式 vs 單次晶圓蝕刻

第6章 市場分析

  • 覆晶及WLP市場的成長要素
    • 小型晶粒用WLP
    • 中型晶粒用WLP
    • 大型晶粒用WLP
  • 市場機會
  • 相關課題
  • 覆晶市場
  • 光刻市場
    • Aligners vs Steppers
    • 市場分析
  • wet蝕刻市場

圖表

目錄

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods. In the world of high-speed/high-performance IC and package design, flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing.

This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Flip Chip/WLP Issues and Trends

  • 3.1 Introduction
  • 3.2 Wafer Bumping
    • 3.2.1 Solder Bumps
      • 3.2.1.1 Metallurgy
      • 3.2.1.2 Deposition Of UBM
      • 3.2.1.3 Sputter Etching
      • 3.2.1.4 Photolithography
      • 3.2.1.5 Solder Deposition
      • 3.2.1.6 Resist Strip
      • 3.2.1.7 UBM Wet Etch
      • 3.2.1.8 Reflow
      • 3.2.1.9 Flux Issues
    • 3.2.2 Gold Bumps
      • 3.2.2.1 Bump Processing
      • 3.2.2.2 Bonding
      • 3.2.2.3 Coplanarity
      • 3.2.2.4 Conductivity
      • 3.2.2.5 Thermal Properties
      • 3.2.2.6 Size
      • 3.2.2.7 Reliability
      • 3.2.2.8 Cost Issues
    • 3.2.3 Copper Pillar Bumps
    • 3.2.4 Copper Stud Bumping
    • 3.2.5 C4NP
  • 3.3 Wafer Level Packaging
  • 3.4 Pad Redistribution
  • 3.5 Wafer Bumping Costs
    • 3.5.1 Wafer Redistribution And Wafer Bumping Costs
    • 3.5.2 WLCSP Hidden Costs
    • 3.5.3 WLCSP Cost Per Good Die
    • 3.5.4 Wafer-Level Underfill Costs

Chapter 4 Lithography Issues And Trends

  • 4.1 Issues
    • 4.1.1 Technical Performance
    • 4.1.2 Capital Investment
    • 4.1.3 Cost Of Consumables
    • 4.1.4 Throughput
    • 4.1.5 Ease Of Use
    • 4.1.6 Flexibility
    • 4.1.7 Equipment Support
    • 4.1.8 Resolution
    • 4.1.9 Solder Bumping Capabilities
    • 4.1.10 Gold Bumping Capabilities
  • 4.2 Exposure Systems
    • 4.2.1 Introduction
      • 4.2.1.1 Reduction Steppers
      • 4.2.1.2 Full-Field Projection
      • 4.2.1.3 Mask Aligners
      • 4.2.1.4 1X Steppers
  • 4.3 Competitive Technologies
    • 4.3.1 Inkjet Printing
    • 4.3.2 Stencil/Screen Printing
    • 4.3.3 Electroless Metal Deposition

Chapter 5 UBM Etch Issues And Trends

  • 5.1 Introduction
  • 5.2 Technology Issues And Trends
    • 5.2.1 Process Flow
    • 5.2.2 Etch Process
    • 5.2.3 Etch Chemistry
  • 5.3 Batch Versus Single-Wafer Etching

Chapter 6 Metallization Issues and Trends

  • 6.1 Introduction
  • 6.2 Sputtering Metallization
    • 6.2.1 Gold Bump
    • 6.2.2 Solder Bumping
      • 6.2.2.1 T i / Cu and TiW / Cu
      • 6.2.2.2 Al / NiV / Cu
      • 6.2.2.3 T i / N i (V) and TiW / Ni ( V )
      • 6.2.2.4 Cr / Cr-Cu / Cu

Chapter 7 Market Analysis

  • 7.1 Market Drivers For Flip Chip And WLP
    • 7.1.1 WLP For Small Die
    • 7.1.2 WLP For Medium Die
    • 7.1.3 WLP For Large Die
  • 7.2 Market Opportunities
  • 7.3 Challenges
  • 7.4 Flip Chip Market
    • 7.4.1 Market Dynamics
    • 7.4.2 Market Forecast
  • 7.5 Lithography Market
    • 7.5.1 Aligners Vs. Steppers
    • 7.5.2 Market Analysis
  • 7.6 Wet Etch Market
  • 7.7 Deposition Market

List of Tables

  • 3.1 Common UBM Stacks For Solder And Gold Bumping
  • 3.2 Solder Bumping Guidelines
  • 3.3 Gold Bumping Guidelines
  • 3.4 Copper Bumping Guidelines
  • 3.5 Comparison Of Solder Bumping Processes
  • 4.1 Key Challenges For WLP Lithography
  • 4.2 Lithography Tools By Vendor
  • 5.1 UBM Film Etchants
  • 5.2 Advantages Of Spin Processing
  • 6.1 Common UBM Stacks For Gold And Solder Bumping
  • 7.1 WLP Demand by Device (Units)
  • 7.2 WLP Demand by Device (Wafers)
  • 7.3 Comparison Of Mask Aligners Versus Steppers
  • 7.4 Worldwide Lithography Forecast
  • 7.5 Worldwide Forecast For UBM Etch Tools
  • 7.6 Worldwide Forecast For UBM Etchants
  • 7.7 Worldwide Forecast For Deposition Tools

List of Figures

  • 3.1 C4 Chip Connections
  • 3.2 Wafer Bump Technology Roadmap
  • 3.3 Comparison Of Copper Pillar, Flip Chip, And WLP
  • 3.4 Solder Bumping Process
  • 3.5 Three Process Flows For Solder Bumping
  • 3.6 Gold Bumping Process
  • 3.7 Cost Per Gold Bumped Wafer
  • 3.8 Copper Stud Bump
  • 3.9 Breakdown Of Stud Bumping Costs
  • 3.10 C4NP Process Description
  • 3.11 Pillar-WLPCSP Process
  • 3.12 Pad Redistribution Process
  • 4.1 Laser-Projection Imaging
  • 4.2 Solder Jet Technology
  • 4.3 Principle Of Screen Printing
  • 4.4 Principle Of Inkjet Printing
  • 4.5 Electroless Under Bump Metallization
  • 5.1 Electroplated Solder Bumping Process
  • 7.1 WLP Applications By Die Size
  • 7.2 WLP Applications
  • 7.3 Flip Chip Market - 2012
  • 7.4 Flip Chip Market - 2017
  • 7.5 Historic Lithography Market Shares
  • 7.6 Lithography Market Shares
  • 7.7 Wet Etch Market Shares
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