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市場調查報告書

利基市場上的化學物質及材料供應商市場和策略

Markets and Strategies for Chemical and Material Suppliers in Niche Markets

出版商 Information Network 商品編碼 123278
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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利基市場上的化學物質及材料供應商市場和策略 Markets and Strategies for Chemical and Material Suppliers in Niche Markets
出版日期: 2016年11月01日 內容資訊: 英文
簡介

本報告書內容包括:太陽能、MEMS、高亮度LED、HDD用薄膜導線/頭燈、晶圓加工等領域中的化學物質及材料供應商市場的趨勢彙整、各市場的趨勢和今後的預測和展望、內容綱要摘記如下:

第1章 介紹

第2章 太陽能

  • 介紹
  • 結晶・多結晶電池的製造
    • 矽成長和載體媒介搬運工具
    • 蝕刻和噴砂
    • 防止反射鍍膜
  • 薄膜電池的製造
    • 微結晶矽氣相沉積
    • 微結晶矽氣相沉積
    • CdTe
    • CIGS
    • GaA
  • 材料供應商市場
    • 結晶・多結晶電池
    • 薄膜電池
    • 化學物質及材料
  • 奈米材料
    • 無機奈米結晶
    • CdSe及CdTe奈米管
    • 量子點
    • 奈米複合材料和量子點的合成
    • 量子井
    • 有機聚合物 - 富勒烯
    • 離子有機聚合物
    • CIGS
    • 色素増感太陽能電池
    • 太陽能電池專用奈米材料市場的分析

第3章 MEMS

  • MEMS市場基礎建設
  • 主要用途和市場預測
    • MEMS設備市場預測
    • MEMS系統市場預測
    • 材料供應商市場

第4章 高亮度LED(HB-LED)

  • 高亮度LED技術及應用上近年的進歩
  • 結構材料
    • 螢光物質
    • 基板
  • OLED的製造
  • 全球的OLED市場展望
  • 全球的高亮度LED市場展望

第5章 HDD用薄膜導線/頭燈

  • HDD趨勢
  • 墨頭市場預測
  • 頭燈加工
  • 頭燈製造
  • 氣相沉積課題
  • CMP的課題
  • CMP研磨墊市場

第6章 晶圓等級過程

  • 介紹
  • 生產覆晶晶片/WLP加工上的課題和趨勢
  • 金屬化的課題和趨勢
  • UBM蝕刻的課題和趨勢
    • 蝕刻過程
    • 蝕刻物質
  • WLP市場分析

圖表

目錄

In this report we identify and forecast areas of related technologies where a small or mid-sized chemical and material companies can compete: Solar, MEMS, LEDs, HDD, and WLP.

As a result, the small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

Table of Contents

Chapter 1 Introduction

Chapter 2 Solar

  • 2.1 Introduction
  • 2.2 Crystalline and Polycrystalline Cell Manufacturing
    • 2.2.1 Silicon Growing and Wafering
    • 2.2.2 Etching and Texturig
    • 2.2.3 Anti-Reflection Coatings
  • 2.3 Thin Film Cell Manufacturing
    • 2.3.1 Amorphous Silicon Deposition
    • 2.3.2 Microcrystalline Silicon Deposition
    • 2.3.3 CdTe - Cadmium Telluride Deposition
    • 2.3.4 CIGS - Copper Indium Gallium Selenide Deposition
    • 2.3.5 GaAs - Gallium Arsenide
  • 2.4 Markets for Materials Suppliers
    • 2.4.1 Crystalline and Polycrystalline Cell Forecast
    • 2.4.2 Thin Film Cell Forecast
    • 2.4.3 Chemicals and Materials Forecast
  • 2.5 Nanomaterials As Solar Conversion
    • 2.5.1 Inorganic Nanocrystals
    • 2.5.2 CdSe And CdTe Nanorods
    • 2.5.3 Quantum Dots
    • 2.5.4 Nanocomposite - Quantum Dot Combination
    • 2.5.5 Quantum Wells
    • 2.5.6 Organic Polymers - Fullerenes
    • 2.5.7 Ionic Organic Polymers
    • 2.5.8 CIGS
    • 2.5.9 Dye-Sensitized Solar Cells
    • 2.5.10 Analysis Of Nanomaterial Markets For Solar Cells

Chapter 3 MEMs

  • 3.1 The MEMS Market Infrastructure
  • 3.2 Forecast Of The Key Applications And Markets
    • 3.2.1 MEMS Device Market Forecast
    • 3.2.2 MEMS System Market Forecast
    • 3.3.2 Markets for Materials Suppliers

Chapter 4 HB-LEDs

  • 4.1 Recent Progress in High Brightness LED Technology and Applications
  • 4.2 Materials of Construction
    • 4.2.1 Phosphor
    • 4.2.2 Substrate
  • 4.3 OLED Manufacturing
  • 4.4 Outlook for the Worldwide OLED Market
  • 4.5 Outlook for the Worldwide HB-LED Market

Chapter 5 Thin Film Read/Write Heads for HDD

  • 5.1 Trends in HDDs
  • 5.2 Recording Head Market Forecast
  • 5.3 Head Processing
  • 5.4 Head Fabrication -
  • 5.5 Deposition Challenges
  • 5.6 CMP Challenges
  • 5.7 CMP Slurry Market
    • 5.7.1 Ceria Slurry For Glass Disk Market
    • 5.7.2 Oxide Slurry For Metal Disk Market
    • 5.7.3 Oxide Slurry For Thin Film Head Market

Chapter 6 Wafer Level Processing (WLP)

  • 6.1 Introduction
  • 6.2 Flip Chip/WLP Processing Issues and Trends
    • 6.2.1 Wafer Bumping
    • 6.2.2 Wafer Level Packaging
    • 6.2.3 Pad Redistribution
    • 6.2.4 Wafer Bumping Costs
  • 6.3 Metallization Issues and Trends
    • 6.3.1 Gold Bumping Metallization
    • 6.3.2 Solder Bumping Metallization
  • 6.4 UBM Etch Issues And Trends
    • 6.4.1 Etch Process
    • 6.4.2 Etch Chemistry
  • 6.5 Analysis of WLP Market

List of Figures

  • 2.1 Diagram Of Solar Cell
  • 2.2 Cross Section Of A Solar Cell Under Illumination
  • 2.3 Polysilicon Manufacturing And Supply Chain
  • 2.4 Cross-Sectional Schematic Diagram Of The InGaP/InGaAs/Ge ATJ Cell
  • 2.5 Percentage Gas Costs For Amorphous Silicon Solar Cell
  • 3.1 MEMs Chemicals Forecast
  • 3.2 MEMs Photomasks Forecast
  • 3.3 MEMs Substrate Forecast
  • 3.4 Forecast of MEMs Wafer Size
  • 4.1 Operation of LED
  • 4.2 Market drivers for LED Biz and Applications
  • 4.3 SSL vs. Classical Technologies
  • 4.4 LED Performance vs. Traditional Light Sources
  • 4.5 Regular LED (white) Front-End Steps
  • 4.6 Packaged LED Cost Basis - 2009
  • 4.7 Packaged LED Cost Basis - 2013
  • 4.8 Regular LED (White) Production Costs For 100k Wafers/Year
  • 4.9 HB LED (White) Production Costs For 100k Wafers/Year
  • 4.10 LED Cost Model: Impact Of Substrate Choice
  • 4.11 Main Manufacturing Steps For GaN-Based Led
  • 4.12 Schematic Of AMOLED
  • 4-13 Active Matrix OLED Capacity And Demand Forecast
  • 5.1 Hard Disk Drive Roadmap
  • 5.2 Decrease In Average Price Of Storage
  • 5.3 Heads Per Drive
  • 5.4 Market Forecast Of Recording Head Consumption
  • 5.5 Heads Per Drive Forecast
  • 5.6 Thin Film Head Structure
  • 5.7 Critical Features In Thin Film Head Structure
  • 5.8 Spin Valve Head Structure
  • 5.9 Cross-Sectional View TFH Stacks
  • 5.10 Cross-Sectional View Of A TFH Design
  • 5.11 CMP Slurry System For TFH Wafer Polishing
  • 5-12 Total Slurry Consumption For HDD Forecast
  • 6.1 Solder Bumping Process
  • 6.2 Pillar-WLP CSP Process
  • 6.3 Pad Redistribution Process

List of Tables

  • 2.1 Historic Solar Cell Production By Region
  • 2.2 Solar Cell Forecast
  • 2.3 Market Share Of Solar Cells By Technology
  • 2.4 Cost Comparison Of Thin Film Technologies
  • 2.5 Polysilicon Production Capacities By Company
  • 2.6 Affect Of Substrate Material On Cigs Solar Efficiency
  • 2.7 Forecast Of Transparent Electrodes For Photovoltaics
  • 2.8 Solar Materials Forecast - Crystalline Silicon Cells
  • 3.1 MEMS Device Market Forecast
  • 3.2 MEMS System Markets Forecast
  • 4.1 Color, Wavelength Material Of LED
  • 4.2 Comparison of LED, HB-LED, UHB-LED Characteristics
  • 4.3 Production Method for Various LEDs
  • 4.4 Comparison Of $/Klm For LED Made On Various 2" Susbtrates
  • 4.5 Forecast Of Sapphire Substrate Size Distribution By Area
  • 4.6 Sapphire Substrate Market Forecast
  • 4-7 Projected Costs Of OLED Lighting Panels (Sheet Processed) Stage
  • 4-8 Projected Costs Of OLED Lighting Panels (Web Processed) Stage
  • 4.9 Global LED Market Forecast
  • 5.1 Slurry And Abrasive Suppliers And Products
  • 5.2 Worldwide Ceria Slurry For Glass Media Market Forecast
  • 5.3 Worldwide Oxide Slurry For Metal Market Forecast
  • 5.4 Worldwide Oxide Slurry For Thin Film Heads Market Forecast
  • 6.1 Common UBM Stacks For Solder And Gold Bumping
  • 6.2 Solder Bumping Guidelines
  • 6.3 ITRS Pin Counts For Different Applications
  • 6.4 Pillar-WLP CSP Guidelines
  • 6.5 Pad Redistribution Guidelines
  • 6.6 Common UBM Stacks For Gold And Solder Bumping
  • 6.7 UBM Film Etchants
  • 6.8 WLP Demand By Device (Units)
  • 6.9 WLP Demand By Device (Wafers)
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