中小半導體設備廠商的利基市場和策略

Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies

出版商	The Information Network
出版日期	2011年08月	商品編碼	122068
內容資訊	英文
價格	US $ 2495 PDF by E-mail US $ 2595 PDF by E-mail and Hard Copy

簡介
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相關商品

中小半導體設備廠商的利基市場和策略 是由出版商The Information Network在2011年08月所出版的。這份英文市場調查報告書價格從美金2495起跳。

簡介

本報告書內容包括:中小半導體設備廠商的趨勢和策略分析、300mm晶圓加工的利基市場、SUB 3mm晶圓設備的利基市場上各個趨勢及分類對今後的展望和課題等彙整、內容綱要摘記如下:

第1章　介紹

第2章　300mm晶圓加工的利基市場

介紹
晶圓等級過程
- 介紹
- 覆晶晶片／WLP加工上的課題和趨勢
- 石板印刷上的課題和趨勢
- UBM蝕刻的課題和趨勢
- 金屬化的課題和趨勢
- 市場分析
3-D TSV
- 重要課題的檢證
- 成本構造
- 重要加工技術
- 重要開發分類的評價
- TSV設備預測
不揮發性記憶體設備MRAM、RRAM、及FeRAM
- MRAM的加工必要條件
- RRAM的加工必要條件
- FeRAM的加工必要條件
- 商品化的準則
超薄型晶圓
- 超薄型晶圓的應用
- 基板的薄膜化
- 背部金屬化必要條件
- 表面應力去除
- 超薄型晶圓市場

第3章　SUB 3mm晶圓設備的利基市場

介紹
MEMS
- 市場基礎建設
- 應用和市場預測
- 設備及材料供應商市場
高亮度LED（HB-LED）
- 高亮度LED技術及應用的近年進步
- 加工設備
- 有機EL製造
- 全球的有機EL市場展望
- 全球的高亮度LED市場展望
化合物半導體
- GaA設備
- 設備趨勢
- 晶圓尺寸
- GaA IC市場預測
- 和SiGe的競爭
HDD用薄膜導線／頭燈
- HDD趨勢
- 墨頭市場預測
- 頭燈加工
- 頭燈製造
- CMP的課題
- 石板印刷的課題
巨大超音波
- 巨大超音波設備的基本構造
- AIN Layer品質必要條件
- 巨大超音波及FBAR濾光片設備的必要條件
- 巨大超音波市場

圖表

2.1 Introduction
2.2 Wafer Level Processing (WLP)
- 2.2.1 Introduction
- 2.2.2 Flip Chip/WLP Processing Issues and Trends
  - Wafer Bumping
  - Wafer Level Packaging
  - Pad Redistribution
  - Wafer Bumping Costs
- 2.2.3 Lithography Issues And Trends
- 2.2.4 UBM Etch Issues And Trends
- 2.2.5 Metallization Issues and Trends
  - Gold Bumping Metallization
  - Solder Bumping Metallization
- 2.2.6 Analysis of WLP Market
2.3 3-D TSV
- 2.3.1 Insight Into Critical Issues
- 2.3.2 Cost Structure
- 2.3.3 Critical Processing Technologies
- 2.3.4 Evaluation Of Critical Development Segments
- 2.3.5 TSV Device Forecast
2.4 Non-volatile Memory Devices MRAM, RRAM and FeRAM
- 2.4.1 Processing Requirements for MRAMs
- 2.4.2 Processing Requirements for RRAMs
- 2.4.3 Processing Requirements for FeRAMs
- 2.4.4 Roadmap for Commercialization
2.5 Ultrathin Wafers
- 2.5.1 Applications for Ultrathin Wafers
- 2.5.2 Substrate Thinning
- 2.5.3 Backside Metallization Requirements
- 2.5.4 Surface Stress Relief
- 2.5.5 Ultrathin Wafer Market

Chapter 3 - Niche Markets for EQUIPMENT for SUB 300mm Wafers

3.1 Introduction
3.2 MEMs
- 3.2.1 The MEMS Market Infrastructure
- 3.2.2 Forecast Of The Key Applications And Markets
  - MEMS Device Market Forecast
  - MEMS System Market Forecast
- 3.2.3 Markets for Equipment and Materials Suppliers
3.3 HB-LEDs
- 3.3.1 Recent Progress in High Brightness LED Technology and Applications
- 3.3.2 Processing Equipment
- 3.3.3 Materials of Construction
- 3.3.4 OLED Manufacturing
- 3.3.5 Outlook for the Worldwide OLED Market
- 3.3.6 Outlook for the Worldwide HB-LED Market
3.4 Compound Semiconductors
- 3.4.1 GaAs Devices
- 3.4.2 Equipment Trends
- 3.4.3 Wafer Sizes
- 3.4.4 GaAs IC Market Forecast
- 3.4.5 Competing Against SiGe
3.5 Thin Film Read/Write Heads for HDD
- 3.5.1 Trends in HDDs
- 3.5.2 Recording Head Market Forecast
- 3.5.3 Head Processing
- 3.5.4 Head Fabrication - CMP, Deposition, Lithography
- 3.5.5 CMP Challenges
- 3.5.6 Lithography Challenges
3.6 Bulk Acoustic Wave (BAW)
- 3.6.1 Basic Elements of the BAW Device
- 3.6.2 AlN Layer Quality Requirements
- 3.6.3 Equipment Requirements for BAW and FBAR Filtering Devices
- 3.6.4 Bulk Acoustic Wave (BAW) Market

TABLES

2.1. Common UBM Stacks For Solder And Gold Bumping
2.2. Solder Bumping Guidelines
2.3. ITRS Pin Counts For Different Applications
2.4. Pillar-WLP CSP Guidelines
2.5. Pad Redistribution Guidelines
2.6. UBM Film Etchants
2.7. Common UBM Stacks For Gold And Solder Bumping
2.8. WLP Demand By Device (Units)
2.9. WLP Demand By Device (Wafers)
2.1. Forecast Of TSV Devices By Wafers
3.1. MEMS Device Markets
3.2. MEMS System Markets
3.3. MEMS Equipment Markets
3.4. Color, Wavelength Material Of LED
3.5. Comparison of LED, HB-LED, UHB-LED Characteristics
3.6. Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
3.7. Process Control Metrics
3.8. Production Method for Various LEDs
3.9. GaAs IC Market Forecast
3.1. Comparison Of Piezoelectric Materials For BAW Applications

FIGURES

2.1. Solder Bumping Process
2.2. Pillar-WLPCSP Process
2.3. Pad Redistribution Process
2.4. Via First (iTSV) Cost Of Ownership
2.5. Via First (iTSV) Cost Of Ownership Front And Back Side
2.6. Via First (iTSV) Process Flow
2.7. iTSV Versus pTSV Cost Of Ownership
2.8. Effect Of TSV Depth And Diameter On Cost
2.9. Illustration Of Bosch Process
2.1. Process And Equipment Flow For EMC3D Consortium Members
2.11. Various TSV Integration Schemes
2.12. Forecast OF TSV Devices By Wafers
3.1. Operation of LED
3.2. Market drivers for LED Biz and Applications
3.3. SSL vs. Classical Technologies
3.4. LED Performance vs. Traditional Light Sources
3.5. Pareto Analysis Of SSL Manufacturing Costs
3.6. Nanoimprint Lithography System
3.7. Regular LED (white) Front-End Steps
3.8. Schematic of AMOLED
3.9. Active Matrix OLED Capacity and Demand Forecast
3.1. 2008 LED Market by Sector
3.11. Worldwide LED Market Forecast 2007-2012
3.12. Schematic of GaAs MESFET
3.13. Schematic of GaAs HEMT Device
3.14. Schematic of GaAs HBT Device
3.15. Schematic of GaAs HBT Device
3.16. pHEMT MMIC Process Flow Chart
3.17. 0.15 Micron 3MI Process Cross Section
3.18. InGaP HBT Process
3.19. Worldwide SiGe Market Forecast
3.2. Hard Disk Drive Roadmap
3.21. Decrease In Average Price Of Storage
3.22. Heads Per Drive -- 2000-2010
3.23. Increase In Areal Density
3.24. Market Forecast Of Recording Head Consumption
3.25. Heads Per Drive Forecast
3.26. Thin Film Head Structure
3.27. Critical Features In Thin Film Head Structure
3.28. Spin Valve Head Structure
3.29. Cross-Sectional View TFH Stacks
3.3. Cross-Sectional View Of A TFH Design
3.31. CMP Slurry System For Tfh Wafer Polishing
3.32. Critical Feature Trends In Thin Film Heads
3.33. Application Space For Rf Filters
3.34. FBAR Diagram
3.35. BAW-SMR Diagram
3.36. Worldwide BAW Forecast

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中小半導體設備廠商的利基市場和策略

Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies