查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
LED/OLED 照明市場：市場分析、製造趨勢
市場調查報告書
商品編碼
1266876

LED/OLED 照明市場：市場分析、製造趨勢

LED and OLED Lighting: Market Analysis and Manufacturing Trends
出版日期: | 出版商: Information Network | 英文 | 商品交期: 2-3個工作天內

價格

本報告研究和分析了全球 LED 和 OLED 照明市場，提供了高亮度 LED (HB LED)、背光 LED 和 OLED 的趨勢和前景。

內容

第一章介紹

第2章高亮度LED技術及應用的最新進展

  • LED：工作原理
  • 知識產權地圖
  • LED製造技術和成本
  • LED 市場通用照明

第三章加工設備

  • 介紹
  • 沉積
    • 用於 SSL 的 MOCVD - 生產力挑戰和解決方案
    • 低溫遠程等離子體化學氣相沉積 (RPCVD)
  • 化學機械平面化
  • 缺陷檢查、測試
  • 光刻
    • 步進器

第 4 章結構材料

  • 介紹
  • 用於普通照明的基於 GaN 的 LED
    • 如何提高白光 LED 的效率
    • LED 基板的上市時間
  • LED熒光粉的製造問題
    • 目前的 LED 熒光粉製造
    • LED 熒光粉成本

第 5 章高亮度 LED 封裝和組裝問題

  • 高亮度 LED 封裝
    • 結合
    • 芯片/球鍵合
    • 劃線
  • 晶圓級封裝 HB LED
  • 熱量問題
  • 測試、檢查

第 6 章作為創新驅動力的國家計劃

  • DOE 固態照明製造計劃
  • DOE 固態照明計劃的使命和目標
  • LED相關國家重大研究計劃
  • SSL 製造面臨的挑戰

第七章OLED照明

  • 照明設備製造商的機遇
  • OLED 的工作原理
  • OLED 照明和 OLED 顯示器之間的區別
  • OLED照明技術的優勢
  • OLED 性能指標

第8章OLED製造

  • 用於 OLED 照明的氣相沉積設備和工藝
    • 真空蒸發或真空熱蒸發 (VTE)
    • 有機氣相沉積 (OVPD)
    • 噴墨打印
    • 卷對卷 (R2R)
  • 一般 OLED 製造成本考慮因素
  • 光刻
  • 基板，封裝
    • 基板和封裝材料的選擇
    • 基材塗層
    • 透明電極
    • 封裝
  • 檢驗、質量控制

第九章全球OLED市場展望

  • 介紹
  • 無源矩陣產能及需求
  • 有源矩陣生產能力和需求
  • OLED 照明的成本問題

第10章全球高亮度LED市場展望

  • 高亮度 LED 技術
  • HB LED 市場概況和趨勢
    • SSL 市場驅動力
    • 用於筆記本電腦的 LED 背光
    • 用於液晶電視的 LED 背光
    • 用於其他應用的 LED 背光
    • LED 照明市場
    • LED主動式戶外顯示屏市場
    • LED 信號市場
    • LED 汽車市場
    • LED 移動市場

The High Brightness Light Emitting Diode (HB LED) market is exploding as unit shipments continue their upward growth. LEDs are creating a niche market for conventional suppliers of semiconductor processing tools. Markets for HB LEDs, backlight LEDs, and OLEDs are forecast.

Table of Contents

Chapter 1 Introduction

Chapter 2 Recent Progress in High Brightness LED Technology and Applications

  • 2.1 LED: Theory of Operation
  • 2.2 Intellectual Property Map
  • 2.3 LED Manufacturing Technologies & Costs
  • 2.4 LED Market General Illumination

Chapter 3 Processing Equipment

  • 3.1 Introduction
  • 3.2 Deposition
    • 3.2.1 MOCVD for SSL - Productivity Challenges and Solutions
    • 3.2.2 Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
  • 3.3 Chemical Mechanical Planarization
  • 3.4 Defect Inspection and Testing
  • 3.5 Lithography
    • 3.5.1 Steppers

Chapter 4 Materials of Construction

  • 4.1 Introduction
  • 4.2 GaN-based LED for General Lighting
    • 4.2.1 Methods to Improve White LED Efficiency
    • 4.2.2 Time-to-Market for LED substrates
  • 4.3 LED Phosphor Manufacturing Issues
    • 4.3.1 Current LED Phosphor Manufacturing
    • 4.3.2 LED Phosphor Cost

Chapter 5 Packaging and Assembly Issues for High Brightness LEDs

  • 5.1 Packaging for HB LEDs
    • 5.1.1 Bonding
    • 5.1.2 Die/Ball Bonding
    • 5.1.3 Scribing
  • 5.2 Wafer Level Packaging HB LEDs
  • 5.3 Thermal Issues
  • 5.4 Test and Inspection

Chapter 6 National Programs As Innovation Drivers

  • 6.1 DOE Solid-State Lighting Manufacturing Initiative
  • 6.2 DOE Solid-State Lighting Program Mission and Goal
  • 6.3 Major National Research Programs Pertaining to LEDs
  • 6.4 Challenges Facing SSL Manufacturing

Chapter 7 OLED Lighting

  • 7.1 Opportunities for Luminaire Manufacturers
  • 7.2 How Does an OLED Work
  • 7.3 Differences Between OLED Lighting and OLED Display
  • 7.4 Benefits of OLED Lighting Technology
  • 7.5 OLED Performance Metrics

Chapter 8 OLED Manufacturing

  • 8.1 Deposition Equipment and Processes for OLED Lighting
    • 8.1.1 Vacuum Deposition Or Vacuum Thermal Evaporation (VTE)
    • 8.1.2 Organic Vapor Deposition (OVPD)
    • 8.1.3 Inkjet Printing
    • 8.1.4 Roll-to-Roll (R2R)
  • 8.2 General OLED Manufacturing Cost Considerations
  • 8.3 Lithography
  • 8.4 Substrates and Encapsulation
    • 8.4.1 Substrate and Encapsulation Material Selection
    • 8.4.2 Substrate Coatings
    • 8.4.3 Transparent Electrodes
    • 8.4.4 Encapsulation
  • 8.5 Inspection and Quality Control

Chapter 9 Outlook for the Worldwide OLED Market

  • 9.1 Introduction
  • 9.2 Passive Matrix Capacity and Demand
  • 9.3 Active Matrix Capacity and Demand
  • 9.4 Cost Challenges for OLED Lighting

Chapter 10 Outlook for the Worldwide High-Brightness LED Market

  • 10.1 HB LED Technology
  • 10.2 HB LED Market Overview and trends
    • 10.2.1 Market Drivers for SSL
    • 10.2.2 LED Backlights for Notebook PCs
    • 10.2.3 LED Backlights for LCD TVs
    • 10.2.4 LED Backlights for Other Applications
    • 10.2.5 LED Lighting Market
    • 10.2.6 LED Active Outdoor Display Market
    • 10.2.7 LED Signal Market
    • 10.2.8 LED Automotive Market
    • 10.2.9 LED Mobile Market

List of Tables

  • 2.1 Color, Wavelength Material Of LED
  • 2.2 Light Source Comparison
  • 2.3 Comparison of LED, HB-LED, UHB-LED Characteristics
  • 3.1 Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
  • 3.2 Process Control Metrics
  • 4.1 Production Method for Various LEDs
  • 4.2 LED Cost Model: Impact of Substrate Choice
  • 4.3 Comparison of $/klm for LED Made on Various 2" Substrates
  • 5.1 Properties of Die Bonding Processes
  • 7.1 Efficiency of Emitter Materials
  • 7.2 Status of Technology Towards Lighting Targets
  • 7.3 Cost Targets for Panels
  • 7.4 Cost Comparison OLED Display vs Lighting
  • 8.1 Cost Targets for Panels Produced by Traditional Methods
  • 10.1 Forecast of LED Backlights for Notebook PCs
  • 10.2 Forecast of LED Backlights for LCD TVs
  • 10.3 Forecast of LED Backlights for Other Application
  • 10.4 Forecast of LED Lighting Market
  • 10.5 Forecast of LED Active Outdoor Display Market
  • 10.6 Forecast of LED Signal Market
  • 10.7 Forecast of LED Automotive Market
  • 10.8 Forecast of LED Mobile Market
  • 10.9 Top 10 LED Vendors

List of Figures

  • 2.1 Operation of LED
  • 2.2 Key Intellectual Property Relationships
  • 2.3 DOE Roadmap
  • 2.4 Relative Manufacturing Costs
  • 2.5 Pareto Analysis Of SSL Manufacturing Costs
  • 2.6 Market drivers for LED Biz and Applications
  • 2.7 SSL vs. Classical Technologies
  • 2.8 LED Performance vs. Traditional Light Sources
  • 2.9 Energy Production and Use Comparison
  • 2.10 Worldwide LED Market Forecast
  • 3.1 SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
  • 3.2 Larger Wafer Size: GaN LEDs
  • 3.3 Global Shipments of MOCVD Tools By Vendor
  • 3.4 Global Shipments of MOCVD Tools By Region
  • 3.5 Diagram of RPCVD Reactor
  • 3.6 Comparison between MOCVD and RPCVD
  • 3.7 CMP Process
  • 3.8 Nanoimprint Lithography System
  • 3.9 The Phlatlight Chip
  • 4.1 Regular LED (white) Front-End Steps
  • 4.2 Current Blocking Layer
  • 4.3 Regular LED (white) Production Costs for 100k wafers/year
  • 4.4 HB LED (white) Production Costs for 100k wafers/year
  • 4.5 Main Manufacturing Steps for GaN-based LED
  • 4.6 Regular LED (white) Back-End
  • 4.7 Methods to Improve White LED Efficiency
  • 4.8 Phosphor Coating - Four Approaches
  • 5.1 Hybrid Integration Approach to HD-LED Package
  • 5.2 Chain Wire Bond
  • 5.3 HB-LED with Silicon Carrier Submount
  • 5.4 Silicon interposer for MEMS / LED Applications
  • 5.5 High Brightness LED
  • 5.6 SMD Package Cost Structure
  • 5.7 Packaging Changes Result in Optical Improvements
  • 5.8 Substrate Solutions for HB/HP LEDs
  • 6.1 DOE Solid-State Lighting Program Strategy
  • 6.2 DOE Efficacy Targets
  • 6.3 Congressional Appropriations
  • 6.4 SSL R&D Project Funding
  • 6.5 Price Targets
  • 7.1 OLED Lighting Stack
  • 8.1 Schematic of VTE Deposition System
  • 8.2 Schematic of OVPD Deposition System
  • 8.3 Comparison Between VTE and OVPD Technology
  • 8.4 Schematic of Inkjet Deposition System
  • 8.5 Schematic of R2R Deposition System
  • 8.6 Illustration of Planarization Layer on OLED
  • 9.1 Schematic of PMOLED
  • 9.2 PMOLED Stack/Driving Architecture
  • 9.3 Schematic of AMOLED
  • 9.4 Passive Matrix OLED Capacity and Demand
  • 9.5 Active Matrix OLED Capacity and Demand
  • 10.1 LED Market by Sector
  • 10.2 Worldwide LED Market Forecast