固態照明市場與製造成本削減趨勢 是由出版商The Information Network在2011年04月所出版的。
這份英文市場調查報告書價格從美金2495起跳。
高亮度發光二極體(HB-LED)市場預測2009年到2012年，出貨數將增加一倍。
本報告提供高亮度LED的技術趨勢與應用的相關驗證，設備與材料，包裝與組裝時的課題，彙整有機發光二極體市場的趨勢，國家的配合，今後的預測等等資料，為您概述為以下內容。
第1章 介紹
第2章 高亮度LED技術與最新應用趨勢
- LED:工作理論
- 智慧財產權流程
- LED製造技術和成本
- LED市場的一般照明
第3章 加工設備
- 介紹
- 固態照明(SSL)用MOCVD:生產率的相關課題和解決辦法
- 低溫等離子化學氣相沈積
- 品管測試及檢驗
- 光刻
第4章 結構材料
- 介紹
- 一般照明用氮化鎵發光二極體LED(GaN基LED)
- LED螢光粉製造上的相關課題
第5章 高亮度LED的包裝和裝配上的相關課題
第6章 作為促進革新因素的國家計劃
- DoE的製造獎勵辦法
- 計劃任務與目標
- 關於LED的研究計劃
- SSL製造面臨的相關課題
第7章 有機發光二極體(OLED)照明
- 照明業者的機會
- 為了促進有機發光二極體市場成長的重要課題
- 製造法和設備需求
- 主要材料是否容易取得
- 有機發光二極體的成本
第8章 有機發光二極體的製造
- 有機發光二極體的真空蒸鍍設備與工程
- 一般有機發光二極體製造成本
- Roll-to-Roll有機發光二極體
- 光刻
- 基板與構裝
- 檢驗和品管
第9章 全球有機發光二極體市場的預測
- 介紹
- 被動式矩陣容量和需求
- 主動式矩陣容量和需求
- 有機發光二極體成本上的相關課題
第10章 全球高亮度LED市場今後的預測
- 技術趨勢:2000∼2009年
- 2008年的市場概要與趨勢
- 推動市場的要素
- 筆記型電腦用LED背光
- 液晶電視用LED背光
- 其他LED背光
- LED照明市場
- LED活動式戶外顯示器
- LED信號
- 汽車用LED
- 行動電話用LED
圖表
Abstract
The High Brightness Light Emitting Diode (HB LED) market is expected to
explode as unit shipments more than double between 2009 and 2012 according to
the report “The Solid State Lighting Revolution: Market Analysis And
Insight On Reducing Manufacturing Costs.”
“The rapid increase in the market for HB LEDs used in various
applications such as notebook backlights and automobile headlights is also
spurring heavy capital investments by LED makers, noted Dr. Robert Castellano,
president of The Information Network. “LEDs are creating a niche market
for conventional suppliers of semiconductor processing tools and a lucrative
market for MOCVD suppliers.”
Veeco, a leading supplier of MOCVD tools, notes in an investor presentation
that a consensus of forecasts from six sell-side analysts forecasts a doubling
in MOCVD demand, from 208 tools in 2009 to 415 tools in 2011.
Our analysis indicates that in 2009, each MOCVD tool was capable of processing
about 30 million LEDs. In 2011, based on the same throughput, there will be a
cumulative supply deficit of 15.5 million LED units, unless MOCVD equipment
suppliers increase throughput and yields to reduce CoO. The U.S. DOE' s Solid
State Lighting Manufacturing Roadmap targets a factor of two improvement in
cost-of-ownership for manufacturing equipment every five years. If suppliers
are successful, enhancements in processing time, uniformity, repeatability,
temperature control, and flow geometries will mitigate the supply deficit.
“Clearly it is not within the best interests of MOCVD tool suppliers to
improve CoO as it will reduce sales,” added Dr. Castellano. “But
competition is the key enabler, which will force suppliers to enhance their
tool capabilities.”
The HB LEDs are currently a $5 billion niche market compared to the $250
million semiconductor market. The consensus forecast of 415 MOCVD tools
represents a market of greater than $1 billion based on an average selling
price of $2.5 million for each MOCVD tool. MOCVD represents 8% of the typical
cost breakdown for a packaged LED. Other front-end tools represent more than
3% of the cost and equates to an additional $500 million market for
lithography and metrology tools. The biggest sector, 65%, represents back-end
processes such as substrate removal, chip separation, and packaging.
The backlight sectors will exhibit the fastest growth in the HB LED market
with an overall compound annual growth rate (CAGR) of more than 40%, led by
the LCD TV sector exhibiting a CAGR of 300.3% between 2007 and 2012.
Table of Contents
Chapter 1 - Introduction
Chapter 2 - Recent Progress in High Brightness LED Technology and Applications
- 2.1 LED: Theory of Operation
- 2.2 Intellectual Property Map
- 2.3 LED Manufacturing Technologies & Costs
- 2.4 LED Market General Illumination
Chapter 3 - Processing Equipment
- 3.1 Introduction
- 3.2 MOCVD for SSL - Productivity Challenges and Solutions
- 3.3 Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
- 3.3.1 RPCVD Process Advantages
- 3.4 Defect Inspection and Testing
- 3.5 Lithography
- 3.5.1 Steppers
- 3.5.2 Nanoimprint
- 3.5.3 Nanopatterning of LED Wafers
Chapter 4 - Materials of Construction
- 4.1 Introduction
- 4.2 GaN-based LED for General Lighting
- 4.2.1 Methods to Improve White LED Efficiency
- 4.2.2 Time-to-Market for LED substrates
- 4.3 LED Phosphor Manufacturing Issues
- 4.3.1 Current LED Phosphor Manufacturing
- 4.3.2 LED Phosphor Cost
Chapter 5 - Packaging and Assembly Issues for High Brightness LEDs
- 5.1 Packaging for HB LEDs
- 5.1.1 Bonding
- 5.1.2 Die/Ball Bonding
- 5.1.3 Scribing
- 5.2 Wafer Level Packaging HB LEDs
- 5.3 Thermal Issues
- 5.4 Test for HB LEDs
Chapter 6 - National Programs As Innovation Drivers
- 6.1 DOE Solid-State Lighting Manufacturing Initiative
- 6.2 DOE Solid-State Lighting Program Mission and Goal
- 6.3 Major National Research Programs Pertaining to LEDs
- 6.4 Challenges Facing SSL Manufacturing
- 6.4.1 Inconsistent Color
- 6.4.2 Low Light Output
- 6.4.3 Challenges Facing Market Introduction
Chapter 7 - OLED Lighting
- 7.1 Opportunities for Luminaire Manufacturers
- 7.2 Critical Issues for Continued OLED Market Growth
- 7.3 Manufacturing Options and Equipment Needs
- 7.4 Availability of Critical Materials
- 7.5 OLED Lighting Costs
Chapter 8 - OLED Manufacturing
- 8.1 Deposition Equipment and Processes for OLED Lighting
- 8.2 General OLED Manufacturing Cost Considerations
- 8.3 Roll-to-Roll OLEDs
- 8.4 Lithography
- 8.5 Substrates and Encapsulation
- 8.5.1 Substrate and Encapsulation Material Selection
- 8.5.2 Substrate Coatings
- 8.5.3 Transparent Electrodes
- 8.5.4 Encapsulation
- 8.6 Inspection and Quality Control
Chapter 9 - Outlook for the Worldwide OLED Market
- 9.1 Introduction
- 9.2 Passive Matrix Capacity and Demand
- 9.3 Active Matrix Capacity and Demand
- 9.4 Cost Challenges for OLED Lighting
Chapter 10 - Outlook for the Worldwide High-Brightness LED Market
- 10.1 HB LED Technology
- 10.2 HB LED Market Overview and trends
- 10.2.1 Market Drivers for SSL
- 10.2.2 LED Backlights for Notebook PCs
- 10.2.3 LED Backlights for LCD TVs
- 10.2.4 LED Backlights for Other Applications
- 10.2.5 LED Lighting Market
- 10.2.6 LED Active Outdoor Display Market
- 10.2.7 LED Signal Market
- 10.2.8 LED Automotive Market
- 10.2.9 LED Mobile Market
LIST OF TABLES
- 2.1. Color, Wavelength Material Of LED
- 2.2. Light Source Comparison
- 2.3. Comparison of LED, HB-LED, UHB-LED Characteristics
- 3.1. Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
- 3.2. Process Control Metrics
- 4.1. Production Method for Various LEDs
- 4.2. Comparison of $/klm for LED Made on Various 2" Substrates
- 5.1. Properties Of Die Bonding Processes
- 7.1. Comparison Of Lighting Technologies
- 7.2. OLED Displays vs OLED lighting
- 8.1. Manufacturing Roadmap for Sheet Processing of OLED Lighting Panels
- 8.2. Manufacturing Roadmap for Web Processing of OLED Lighting Panels
- 8.3. Projected Costs of OLED Lighting Panels (Sheet Processed) Stage
- 8.4. Projected Costs of OLED Lighting Panels (Web Processed) Stage
- 10.1. Forecast Of LED Backlights For Notebook PCs
- 10.2. Forecast Of LED Backlights For LCD TVs
- 10.3. Forecast Of LED Backlights For Other Application
- 10.4. Forecast Of LED Lighting Market
- 10.5. Forecast Of LED Active Outdoor Display Market
- 10.6. Forecast Of LED Signal Market
- 10.7. Forecast Of LED Automotive Market
- 10.8. Forecast Of LED Mobile Market
- 10.9. Revenues of Top LED Vendors
LIST OF FIGURES
- 2.1. Operation of LED
- 2.2. Key Intellectual Property Relationships
- 2.3. DOE Roadmap
- 2.4. Relative Manufacturing Costs
- 2.5. Pareto Analysis Of SSL Manufacturing Costs
- 2.6. Market drivers for LED Biz and Applications
- 2.7. SSL vs. Classical Technologies
- 2.8. LED Performance vs. Traditional Light Sources
- 2.9. Energy Production and Use Comparison
- 2.10. White-LEDs for General Lighting Market estimates in $B to 2020
- 2.11. Wafer Needs for General Lighting (2” wafer equivalents,
million units to 2020)
- 3.1. SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
- 3.2. Larger Wafer Size: GaN LEDs
- 3.3. Global Shipments Of MOCVD Tools For 2009-2010 By Vendor
- 3.4. Global Shipments Of MOCVD Tools For 2009-2010 By Region
- 3.5. Diagram of RPCVD Reactor
- 3.6. Comparison between MOCVD and RPCVD
- 3.7. Nanoimprint Lithography System
- 3.8. The Phlatlight Chip
- 4.1. Regular LED (white) Front-End Steps
- 4.2. Current Blocking Layer
- 4.3. Regular LED (white) Production Costs for 100k wafers/year
- 4.4. HB LED (white) Production Costs for 100k wafers/year
- 4.5. LED Cost Model: Impact of Substrate Choice
- 4.6. Main Manufacturing Steps for GaN-based LED
- 4.7. Regular LED (white) Back-End
- 4.8. Methods to Improve White LED Efficiency
- 4.9. Phosphor Coating - Four Approaches
- 5.1. Hybrid Integration Approach to HD-LED Package
- 5.2. Chain Wire Bond
- 5.3. HB-LED with Silicon Carrier Submount
- 5.4. Silicon interposer for MEMS / LED Applications
- 5.5. High Brightness LED
- 5.6. SMD Package Cost Structure
- 5.7. Packaging Changes Result in Optical Improvements
- 5.8. Substrate Solutions for HB/HP LEDs
- 6.1. DOE Solid-State Lighting Program Strategy
- 6.2. DOE Efficacy Targets
- 6.3. Congressional Appropriations
- 6.4. SSL R&D Project Funding
- 6.5. Price Targets
- 7.1. Status of Technology Towards Lighting Targets
- 7.2. Maximizing Internal Quantum Efficiency
- 7.3. Manufacturing Options
- 7.4. Kodak VIST Deposition Source
- 7.5. OLED Lighting Costs - VTE process
- 7.6. OLED Lighting Costs: Glass Substrate
- 8.1. Steps of OLED Production
- 8.2. Industrial Coater Design Approaches
- 8.3. Comparison Cluster vs. In-Line - Gen 2
- 8.4. Comparison Cluster vs. In-Line - Gen 4/5
- 8.5. Process Flow for OLED stack
- 8.6. Comparison of Deposition Sources
- 8.7. Roll-to-Roll OLED Fabrication
- 9.1. Schematic of PMOLED
- 9.2. PMOLED Stack/Driving Architecture
- 9.3. Schematic of AMOLED
- 9.4. Passive Matrix OLED Capacity and Demand Forecast
- 9.5. Active Matrix OLED Capacity and Demand Forecast
- 10.1. LED Market by Sector
- 10.2. Worldwide LED Market Forecast 2008-2014
