全球行動電話用晶片組和連接用半導體的主要十大公司:2011年第3季的廠商市場佔有率

Worldwide Top 10 Mobile Phone Chipset and Connectivity Semiconductor 3Q11 Vendor Shares

出版商	IDC
出版日期	2011年12月	商品編碼	226516
內容資訊	英文 Pages: 4
價格	US $ 2500 PDF by E-mail (Single user license)

簡介
目錄
相關商品

全球行動電話用晶片組和連接用半導體的主要十大公司:2011年第3季的廠商市場佔有率 是由出版商IDC在2011年12月所出版的。這份英文市場調查報告書包含Pages: 4 價格從美金2500起跳。

簡介

本報告提供全球行動電話用晶片組，應用處理器，連接用半導體市場2011年第3季前幾名的供應商排行，為您概述為以下內容。

關於此更新

IDC的見解
- Qualcomm
- Texas Instruments
- MediaTek
- Intel/Infineon
- Broadcom
- ST-Ericsson
- Skyworks
- Marvell
- RF Micro
- Apple
- Spreadtrum

參考資料

相關調查

This IDC update provides the top vendor rankings for the worldwide mobile phone chipset, applications processor, and connectivity semiconductor market for the third calendar quarter of 2011. This is a quarterly deliverable that tracks the top mobile phone semiconductor vendors in several key device categories. The accompanying Excel spreadsheet includes the results of this data deliverable and is broken out by:

The top 10 worldwide mobile phone semiconductor vendors for 3Q11. Select components include chipsets, discrete applications processors, media coprocessors, and connectivity technologies.
The top 10 worldwide mobile phone chipset vendors for 3Q11. Chipsets are defined as air interface-specific components only and include integrated and discrete baseband processors, transceiver and RF components, and power amplifiers.
The top 10 worldwide mobile phone connectivity semiconductor vendors for 3Q11.Connectivity chips include WiFi, Bluetooth, broadcast radio, GPS, WiMAX, mobile TV, and NFC.
The top 6worldwide smart phone applications processor vendors for 3Q11. Applications processors are broken out as discrete devices and integrated solutions that include baseband processing circuitry also.

A draft of this IDC update and Excel data file were sent via email to clients of IDC's Semiconductors: Wireless and Wired Communications research program on December 9, 2011.