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市場調查報告書 - 223369

全球有線寬頻上網半導體市場供應商分析(2011年):尋求xDSL,電纜,FTTx的市場機會

Worldwide Wireline Broadband Access Semiconductors 2011 Vendor Analysis: Leaders and New Entrants Jostle for Opportunity in xDSL, Cable, and FTTx

出版商 IDC
出版日期 內容資訊 英文 11 Pages
價格
本報告書已不再販售
全球有線寬頻上網半導體市場供應商分析(2011年):尋求xDSL,電纜,FTTx的市場機會 Worldwide Wireline Broadband Access Semiconductors 2011 Vendor Analysis: Leaders and New Entrants Jostle for Opportunity in xDSL, Cable, and FTTx
出版日期: 2011年11月10日 內容資訊: 英文 11 Pages

本報告已在2014年01月06日停止出版

簡介

本報告提供全球有線寬頻上網半導體市場,即以巷DSL,電纜,光纖為基礎的PON設備用半導體的主要供應商相關驗證,為您概述為以下內容。

IDC的見解

調查概要

概況

  • xDSL
    • 電纜
    • FTTx
  • 業者簡介
    • Qualcomm-Atheros
    • BroadLight
    • Cortina
    • Broadcom
    • Ikanos
    • Intel
    • Lantiq
    • Marvell
    • PMC-Sierra
  • 寬頻上網技術

未來展望

主要的建議

參考資料

  • 相關調查
  • 摘要

圖表

目錄

This IDC study covers the key semiconductor vendors of digital subscriber line (DSL), cable, and fiber-based passive optical networking (PON) devices for wireline broadband access. Companies included in this study are Broadcom, Cortina, Lantiq, PMC-Sierra, BroadLight, Ikanos, Intel, Marvell, Qualcomm-Atheros, Ralink, and Realtek.

Fiber-based PON access is the most attractive long-term solution for wireline broadband access, and therefore it is growing at the fastest rate among the three technologies, especially in regions of the world that are connecting to the Internet for the first time. Yet vendors of DSL and cable semiconductor devices can maintain and even grow their market share in established markets for wireline broadband access by supporting the latest standards that boost the data rates comparable to PON and by integrating value-added features into the SoC.

"Proliferation of the latest wireline broadband access standards to enable voice, video, and data services over a single connection is creating new opportunities for those semiconductor vendors positioned to take advantage of shifts from one technology to another as well as shifts within each category." - Abhi Dugar, research manager, Semiconductors: Wireless and Wired Communications

Table of Contents


IDC Opinion




In This Study


Situation Overview


  • Digital Subscriber Line (xDSL)

    • Cable

    • Fiber to the x

  • Vendor Profiles

    • Qualcomm-Atheros

    • BroadLight

    • Cortina

    • Broadcom

    • Ikanos

    • Intel

    • Lantiq

    • Marvell

    • PMC-Sierra

  • Broadband Access Technologies

Future Outlook

Essential Guidance


LEARN MORE


  • Related Research

  • Synopsis

Table: Wired Broadband Access Technology and Service Layering by Operator Type

Table: Wired Broadband Access Vendor Competitive Analysis, 2011


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