全球有線寬頻上網半導體市場供應商分析(2011年):尋求xDSL，電纜，FTTx的市場機會 是由出版商IDC在2011年11月所出版的。
這份英文市場調查報告書包含Pages: 11 價格從美金3500起跳。
本報告提供全球有線寬頻上網半導體市場，即以巷DSL，電纜，光纖為基礎的PON設備用半導體的主要供應商相關驗證，為您概述為以下內容。
IDC的見解
調查概要
概況
- xDSL
- 業者簡介
- Qualcomm-Atheros
- BroadLight
- Cortina
- Broadcom
- Ikanos
- Intel
- Lantiq
- Marvell
- PMC-Sierra
- 寬頻上網技術
未來展望
主要的建議
參考資料
圖表
This IDC study covers the key semiconductor vendors of digital subscriber line (DSL), cable, and fiber-based passive optical networking (PON) devices for wireline broadband access. Companies included in this study are Broadcom, Cortina, Lantiq, PMC-Sierra, BroadLight, Ikanos, Intel, Marvell, Qualcomm-Atheros, Ralink, and Realtek.
Fiber-based PON access is the most attractive long-term solution for wireline broadband access, and therefore it is growing at the fastest rate among the three technologies, especially in regions of the world that are connecting to the Internet for the first time. Yet vendors of DSL and cable semiconductor devices can maintain and even grow their market share in established markets for wireline broadband access by supporting the latest standards that boost the data rates comparable to PON and by integrating value-added features into the SoC.
"Proliferation of the latest wireline broadband access standards to enable voice, video, and data services over a single connection is creating new opportunities for those semiconductor vendors positioned to take advantage of shifts from one technology to another as well as shifts within each category." - Abhi Dugar, research manager, Semiconductors: Wireless and Wired Communications
Table of Contents
IDC Opinion
In This Study
Situation Overview
Future Outlook
Essential Guidance
LEARN MORE
Related Research
Synopsis
Table: Wired Broadband Access Technology and Service Layering by Operator Type
Table: Wired Broadband Access Vendor Competitive Analysis, 2011
