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市場調查報告書

連結晶片全球動向

Connectivity Chip Trends

出版商 Global Industry Analysts, Inc. 商品編碼 297818
出版日期 內容資訊 英文 24 Pages
商品交期: 最快1-2個工作天內
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連結晶片全球動向 Connectivity Chip Trends
出版日期: 2014年01月01日 內容資訊: 英文 24 Pages
簡介

本報告針對連結晶片全球動向分析,提供世界市場預測與2012年到2017年無線連結IC預測。另有7項市場資料表、世界市場動向、技術進步、競爭情況回顧、近年業界主要企業策略性產業活動重點。活動中的企業42家檔案,目錄介紹如下。

第1章 連結晶片 - 市場概要

  • 對應Wi-Fi的行動設備強勢成長
  • 消費者對Wi-Fi行動設備的需要帶領著半導體產業成長
  • 短期帶領與無線連結晶片市場受到期待的主因
  • 消費者對無線方案的關注增加
  • 次世代消費者設備使用網路增加
  • 技術進步
  • 競爭情況

第2章 最近產業活動

  • Amazon.com持續Texas Instruments的行動處理器部門
  • Samsung收購CSR手持技術開發部門
  • Toumaz設立ToumazMicrosystems
  • Broadcom持續NetLogic Microsystems事業
  • CSR持續Zoran事業
  • Inside Secure以NFC技術與Intel合作
  • Qualcomm收購Atheros Communications
  • Texas Instruments收購National Semiconductor

第3章 產品發表/創新

  • Apple引進最新Mac模式802.11ac網路機能
  • Broadcom發表最新5G WiFi產品系列
  • Broadcom發表BCM20732 BluetoothR智慧型系統晶片
  • Dialog Semiconductor發表DA14580 SmartBond TM系統晶片
  • Broadcom發表BCM4752定位架構
  • Marvell與Atheros各自發表了Wi-Fi晶片
  • ST-Ericsson發表了行動連結晶片

第4章 市場參與企業

  • Analog Devices, Inc. (美國)
  • Aquantia Corporation (美國)
  • ASIX Electronics Corporation (台灣)
  • Atmel Corporation (美國)
  • Beken Corporation (中國)
  • Broadcom Corporation (美國)
  • Cadence Design Systems, Inc. (美國)
  • Celeno Communications (以色列)
  • CellGuide Ltd. (以色列)
  • CSR PLC (英國)
  • Dialog Semiconductor (德國)
  • Freescale Semiconductor, Inc. (美國)
  • Fujitsu Ltd. (日本)

第5章 補充

目錄
Product Code: 146167

The report analyzes and presents an overview of Connectivity Chips market worldwide. The report in addition provides global market estimates and projections for Wireless Connectivity ICs in US dollars for years 2012 through 2017. Supported with 7 market data tables, the report provides a review of global market trends, technological advancements, and competitive scenario. The report highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 42 companies operating in the Connectivity Chips arena worldwide including Broadcom Corporation, CSR PLC, INSIDE Secure, Marvell Technology Group Ltd., Qualcomm Atheros Inc., Samsung Semiconductor Inc., ST-Ericsson, Texas Instruments Inc., Toumaz Microsystems and others are profiled.

Table of Contents

1. CONNECTIVITY CHIPS - A MARKET OVERVIEW

  • A Prelude
    • Table 1: Global Wireless Connectivity ICs Market (2012-2017) in US$ Million
    • Table 2: Global Video-Oriented Consumer Electronics Devices Equipped with High-Bandwidth Wireless Solutions ICs (2012-2017) in Million Units
  • Wi-Fi-enabled Mobile Devices to Witness Robust Growth
    • Table 3: Global Wi-Fi-enabled Device Shipments (2012-2017) in Million Units
  • Increased Consumer Demand for Wi-Fi Mobile Devices Driving Growth in Semiconductor Industry
  • Key Factors Expected to Drive Wireless Connectivity Chips Market in Near Term
  • Increase in Consumer Interest for Wire-Free Solutions
    • Table 4: Global Bluetooth-Enabled Chip Shipments (2012-2017) in Million Units
  • Growing Use of Internet in Next-Generation Consumer Devices
  • Technological Advancements
  • Competitive Scenario
    • Table 5: Leading Connectivity Chip Producers' Market Share by Value Sales Worldwide (2012) - Percentage Breakdown for Broadcom, Texas Instruments, CSR PLC, Marvell Technology Group Ltd, and Others
    • Table 6: Leading Bluetooth Chip Producers' Market Share by Value Sales Worldwide (2012) - Percentage Breakdown for Broadcom, CSR PLC, Media Tek, RDA Microelectronics, and Others
    • Table 7: Leading GPS Chip Producers' Market Share by Value Sales Worldwide (2012) Percentage Breakdown for CSR Plc, u-blox AG, Texas Instruments, Broadcom, and Others

2. RECENT INDUSTRY ACTIVITY

  • Amazon.com to Take Over Mobile Processor Division of Texas Instruments
  • Samsung Acquires Handset Technology Development Division of CSR
  • Toumaz Establishes Toumaz Microsystems
  • Broadcom Takes Over NetLogic Microsystems
  • CSR Takes Over Zoran
  • Inside Secure Signs Agreement with Intel for NFC Technology
  • Qualcomm Acquires Atheros Communications
  • Texas Instruments Acquires National Semiconductor

3. PRODUCT LAUNCHES/INNOVATIONS

  • Apple to Introduce 802.11ac Networking Capabilities in New Mac Models
  • Broadcom Launches New 5G WiFi Product Line
  • Broadcom Rolls Out BCM20732 Bluetooth® Smart System-on-Chip
  • Dialog Semiconductor Introduces DA14580 SmartBond™ System-on-Chip
  • Broadcom Introduces BCM4752 Location Architecture
  • Marvell and Atheros Independently Introduce Wi-Fi Chips
  • ST-Ericsson Introduces Mobile Connectivity Chips

4. MARKET PARTICIPANTS

  • Analog Devices, Inc. (USA)
  • Aquantia Corporation (USA)
  • ASIX Electronics Corporation (Taiwan)
  • Atmel Corporation (USA)
  • Beken Corporation (China)
  • Broadcom Corporation (USA)
  • Cadence Design Systems, Inc. (USA)
  • Celeno Communications (Israel)
  • CellGuide Ltd. (Israel)
  • CSR PLC (UK)
  • Dialog Semiconductor (Germany)
  • Freescale Semiconductor, Inc. (USA)
  • Fujitsu Ltd. (Japan)
  • Gainspan Corporation (USA)
  • GCT Semiconductor, Inc. (USA)
  • Glyn Ltd. (Australia)
  • INSIDE Secure (France)
  • Intel Corporation (USA)
  • Lantiq (Germany)
  • Marvell Technology Group Ltd. (Bermuda)
  • Maxim Integrated Products, Inc. (USA)
  • MediaTek, Inc. (Taiwan)
  • Microchip Technology, Inc. (USA)
  • Nordic Semiconductor ASA (Norway)
  • Nvidia Corporation (USA)
  • NXP Semiconductors NV (The Netherlands)
  • PMC-Sierra, Inc. (USA)
  • Qualcomm Atheros, Inc. (USA)
  • Quantenna Communications, Inc. (USA)
  • RDA Microelectronics (China)
  • Realtek Semiconductor Corporation (Taiwan)
  • Redpine Signals (USA)
  • Renesas Electronics Corporation (Japan)
  • RF Micro Devices, Inc. (USA)
  • Samsung Semiconductor, Inc. (USA)
  • Silicon Laboratories, Inc. (USA)
  • SkyTraq Technology, Inc. (Taiwan)
  • ST-Ericsson (Switzerland)
  • Telechips, Inc. (Korea)
  • Texas Instruments, Inc. (USA)
  • Toumaz Microsystems (UK)
  • u-blox AG (Switzerland)

5. APPENDIX

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