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市場調查報告書

局部焊接的全球市場

Selective Soldering

出版商 Global Industry Analysts, Inc. 商品編碼 138796
出版日期 內容資訊 英文 187 Pages
商品交期: 最快1-2個工作天內
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局部焊接的全球市場 Selective Soldering
出版日期: 2016年03月01日 內容資訊: 英文 187 Pages
簡介

本報告以局部焊接的全球市場為焦點,依地區 (美國,加拿大,日本,歐洲,亞太地區,中南美,其他) 別估算·預測交易金額的轉變,更彙整過去6年的市場分析資料和大小42家參與企業公司簡介等目前競爭環境相關的調查資訊。

第1章 簡介,調查方法,產品定義

  • 調查的可靠性和報告的限制
  • 免責聲明
  • 資料的解釋和報告水準
    • 定量技術與分析
  • 產品的定義和調查範圍

第2章 摘要整理

  • 產業概要
    • 局部焊接設備-主要的特徵與用途
    • 波高監測
    • 上部預熱
    • 惰性氣控制·焊接
    • 氮噴射的剝離功能
    • 雙頭助焊劑設備
    • 交換型焊爐
    • 大型化噴嘴
    • 表面黏著技術(SMT)設備和彈性電路基板的發展形成的局部焊接設備需求擴大的穩固基礎
    • 機會指標
    • 彈性電路基礎的發展-局部焊接設備的投資效果檢驗
    • 即使從TH轉換到SMT元件,局部焊接市場仍維持成長
    • 雷射焊接 -局部焊接的重要工程
    • 局部焊接工程種類與特徵
    • 市場預測
    • 亞太地區-全球主流
    • 歐美- 另一個有力市場
    • 競爭情形-概要註記
  • 成長推動要素,市場趨勢與課題
    • 因插入式零件的小規模卻穩固的需求而加速的成長
    • 自動化-局部焊接市場上的暗號
    • 表面黏著技術零件的自動化局部焊接
    • 自動局部焊接─包含雙面表面黏著技術部件的印刷電路板焊接作業所需之物
    • 有助於局部焊接市場成長的技術創新
    • 波峰焊料面用Aperture Tooling
    • Mass Selective Dip Solder Foundation
    • 微型流動局部焊爐
    • 雷射局部焊接系統
    • 局部助焊劑
    • 微型流動局部焊接對波峰焊接的優勢點
    • 提高局部焊接效率的免清洗助焊劑
    • 由於成本·品質問題產業在局部焊接轉換方向
    • 由於零件縮小化而好轉的未來發展預測
    • 下一代電子技術-能由小窺大的局部焊接的商機
    • 以局部焊接設備為中心的課題
  • 有代表性的終端用戶產業
    • 從OEM到CEM及EMS供應商─持續變化的客戶簡介
    • 表面黏著技術的重要末端用途
    • 由於汽車電子產品的發展而商機急速擴大的局部焊接設備
    • 實現電子學的驚異
    • 因電訊劇增的需求
    • 有助於局部焊接設備產業發展的醫療領域
    • 醫療設備委託製造業的局部焊接設備
    • 因家用電子設備的普及擴大而加速的局部焊接需求
    • 電子設備委託製造業-局部焊接設備的重要客戶
    • 各種產業上雷射焊接的崛起
      • 工業用途
      • 電子設備製造
      • 汽車用途
      • 醫療用途
      • 雷射焊接光電子技術
  • 技術創新
  • 產品概要
  • 產品銷售·技術創新
  • 最新產業趨勢
  • 主要加入企業
  • 全球市場預測

第3章 市場

  • 美國
  • 加拿大
  • 日本
  • 歐洲
  • 亞太地區
  • 中南美
  • 其他地區

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: MCP-6564

This report analyzes the worldwide markets for Selective Soldering in US$ Thousand. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 42 companies including many key and niche players such as -

ACE Production Technologies, Inc.
DDM Novastar LLC
Ebso GmbH
EPM Handels AG
ERSA GmbH

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

  • Study Reliability and Reporting Limitations
  • Disclaimers
  • Data Interpretation & Reporting Level
    • Quantitative Techniques & Analytics
  • Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW

  • A Prelude
  • Selective Soldering Machines and Equipment - Key Features and Uses
  • Wave Height Monitoring
  • Top-side Preheating
  • Inert Atmosphere Control and Solder Delivery
  • Nitrogen Peel-off Jet
  • Dual Head Fluxers
  • Swappable Solder Pots
  • Larger Nozzles
  • Growth of SMT Equipment and Flexible PCBs Form Strong Base for Rising SSE Demand
  • Opportunity Indicators
    • Table 1: Global Electronics Systems Market by End-Use Industry (2015): Percentage Breakdown of Sales for Computers & Peripheral, Communication Devices, Consumer Electronic Devices, Automotive Electronics, Industrial Electronics, and Aerospace/Defense Electronics (includes corresponding Graph/Chart)
    • Table 2: World Market for PCBs (2015): Percentage Share Breakdown of Key End-Use Application Markets (includes corresponding Graph/Chart)
  • Growth of Flexible Printed Circuit Boards - A Business Case for SSE
  • Selective Soldering Still Enjoys Growth despite Shift from TH to SMT Component
  • Laser Soldering - An Important Selective Soldering Process
  • Types of Selective Soldering Processes and Their Features
  • Market Outlook
  • Asia-Pacific - Dominates the Global Scenario
  • Europe and the US - Other Prominent Markets
  • Competition - A Brief Note

2. GROWTH DRIVERS, MARKET TRENDS AND ISSUES

  • Small but Persistent Demand for Through-Hole Components Drives Growth
  • Automation - A Buzz Word in Selective Soldering Market
  • Automated Selective Soldering of SMT Components
  • Automated Selective Soldering Need of the Hour for Soldering PCBs with Double-Sided SMT Content
  • Innovations Drive Selective Soldering Market Growth
  • Selective Aperture Tooling over Wave Solder
  • Mass Selective Dip Solder Foundation
  • Miniature Wave Selective Solder Fountains
  • Laser Selective Soldering System
  • Selective Flux Applicators
  • Advantages of Miniature Wave Selective Soldering over Wave Soldering
  • No-Clean Flux Encourages Efficiency in Selective Soldering
  • Cost and Quality Issues Drive Industry towards Selective Soldering
  • Shrinking Component Size Paints Brighter Prospects
  • Next Generation Electronics: A Tantalizing Opportunity for Selective Soldering
  • Challenges Associated with Use of SSE

3. OVERVIEW OF SELECT END-USE INDUSTRIES

  • From OEMs to CEMs and EMS Providers: Changing Customer Profile
  • Important End Uses of Surface Mount Technology
  • Developments in Automotive Electronics Drives Opportunities for SSE
    • Table 3: Automotive Electronics as a Percentage of Vehicle Production Cost (includes corresponding Graph/Chart)
    • Table 4: Increasing Electronic Content in Automobiles as a Percentage of Vehicle Value (includes corresponding Graph/Chart)
  • Enabling the Electronic Marvel
  • Telecommunications Soars Demand
  • Healthcare Segment Reinforcing Growth in Selective Soldering Equipment Industry
  • Selective Soldering Machines in Medical EMS
  • Growing Proliferation of Consumer Electronic Devices to Drive Demand for Selective Soldering
    • Table 5: Global Market for Consumer Electronics (2012 & 2015): Breakdown of Annual Revenue (in US$ Billion) by Region/Country for US, Canada, Europe, Asia-Pacific (including Japan), Middle East, and Latin America (includes corresponding Graph/Chart)
  • Electronic Manufacturing Services Industry: A Key Customer of Selective Soldering Equipment
  • Advent of Laser Soldering in Various Industries
    • Industrial Applications
    • Electronics Manufacturing
    • Automobile Application
    • Medical Application
    • Laser Soldering Optoelectronics

4. TECHNOLOGY INNOVATIONS

  • Solder Nozzles Cleaning - Innovative Patented Ultrasonic Technology
  • Development of Direct Diode Lasers
  • Latest Feature Additions in i-Pulse Machines
  • Development of the InnoLot Lead-Free Alloy for Automotive Electronics
  • Development of Preheated Solder Joints for Power Electronics
  • Solder Masks
  • Soldering of Image Sensors to PCBs
  • Electrostatic Damage
  • Board Assembly
  • Manual Soldering of Leaded or Pinned Devices
  • Reflow-Soldering
  • Lead-Free Soldering

5. PRODUCT OVERVIEW

  • Selective Soldering - An Introduction
  • Evolution of Automated Soldering
  • Automated Selective Soldering
  • Selective Wave Soldering
  • Selective Fountain Soldering
  • Programmable Selective Soldering
  • Selective Miniwave Soldering
  • Selective Laser Soldering
    • Advantages of Laser Soldering
    • Limitations of Laser Soldering
    • Classification of Laser Soldering Processes
      • Single Spot Soldering Process
      • Simultaneous Soldering
      • Mask Soldering
  • Round-table Selective Soldering
    • Automatic Soldering Techniques
    • Reflow Soldering
    • Wave Soldering
    • Circuit-board Loading Station
    • Fluxing Station
    • Pre-heating Station
    • Soldering Station
      • Classification of Solder Joints
      • Good Solder Joint
      • Poor Solder Fillet
      • Shorts
  • Solder Paste Application/Paste Printing - The Blue Print
    • Important Considerations for Good Quality Printing
    • Why Use Solder Paste?
    • Which Type of Solder Paste to be Used?
    • Prerequisites of an Ideal Solder Paste
    • Regulations on the Usage of Solder Pastes
    • Other Soldering Techniques
      • Advantages of Using Selective Soldering Processes
      • Encountering Selective Soldering Problems
    • Stringing/Webbing
    • Fillet Tearing
    • Copper Dissolution
      • Key Process Issues for Lead-free Selective Soldering
    • Wave Height Monitoring
    • Top Side Preheating
    • Solder Delivery and Inert Atmosphere Control
    • Nitrogen Peel-off Jet
    • Dual Head Fluxers
    • Swappable Solder Pots for Lead-free
    • Larger Nozzles
      • Factors Affecting Investment in Selective Soldering Equipment
      • Stamp Soldering
    • Benefits of Stamp Soldering
      • Diode Lasers - Creating Opportunity through "FlashSoldering"
    • Hot Bar
    • Common Soldering Iron
    • Micro-flame
      • Road Ahead for FlashSoldering

6. PRODUCT INTRODUCTIONS/INNOVATIONS

  • ACE to Showcase KISS-103IL, a Novel Selective Soldering Technology at SMT
  • Vitronics Soltec to Launch New ZEVAm Selective Soldering Platform
  • Seho North America Introduces GoSelective-LS Selective Soldering Machine
  • Manncorp Releases IS-T-300, an All-in-One Selective Fluxing and Soldering System
  • Kurtz Ersa Showcases Complete Range of Ersa's Selective Soldering Equipment
  • SEHO Systems Showcases SelectLine and LeanSelect Selective Soldering Systems
  • Fero Launches Selective Soldering Machines of Interselect in New Zealand
  • ACE Production Technologies Showcases KISS-102IL Selective Soldering Machine
  • Count On Tools Develops Selective Soldering Nozzles for Pillarhouse Equipment
  • Soltec Introduces Two Novel Selective Soldering Platforms
  • DDM Introduces Model IS-B 335S, Automatic Selective Soldering Machine
  • RPS Automation Showcases FRX10 Selective Soldering System
  • RPS Introduces Complete Range of Selective Soldering Equipment
  • RPS Releases Economy Line of Selective Soldering with FRX16
  • Soltec Showcases 6746 Selective Soldering Machine and XPM3i Reflow Oven

7. RECENT INDUSTRY ACTIVITY

  • Wistron Corporation Selects ACE Selective Soldering System in China
  • BAE Systems Completes Installation of second Selective Soldering System from ACE
  • Celestica Completes Installation of KISS-103IL Selective Soldering System
  • Accelerated Assemblies Invests KISS-102IL Selective Soldering System
  • Diehl Controls Orders EBSO SPA 400 NC Selective Soldering Systems
  • Soltec Inks Partnership Deal with EMEA Electro Solutions
  • ACE Production Technologies Inaugurates Demo Center in Mexico
  • Seika Machinery Acquires Malcomtech International
  • ACE Inks Partnership Deal with Rochester Institute of Technology
  • Vitronics Soltec Inks Distribution Agreement with Seica S.p.A.
  • XetaWave Installs ACE's Selective Soldering System
  • Teledyne Printed Circuit Technology Selects Ersa for Selective Soldering
  • W&S Benelux Selects Inertec Selective Soldering Solutions
  • eTech-WEB Selects Juki's CUBE.460 Selective Soldering System
  • Conelec Electronic Manufacturing Selects Ersa's ECOSELECT 2
  • HP Caribe BV and Ersa Ink Partnership Deal
  • RPS Partners with South-Tek Systems for Developing Nitrogen Generation System
  • Soltec Inks Partnership Agreement with EPM
  • Vitronics Soltec Enters Into Partnership Agreement with SMT House
  • Gen3 Systems Bags a Contract from ZOT Engineering for Supply of KISS 103
  • Conelec Electronic Selects Ersa ECOSELECT 2(tm) Selective Soldering System
  • Electronic Technologies Purchases ACE's KISS-103 Selective Solder Machine
  • S and Y Industries Install KISS-140 Selective Wave Soldering Machine

8. FOCUS ON SELECT PLAYERS

  • ACE Production Technologies, Inc. (US)
  • DDM Novastar LLC (US)
  • Ebso GmbH (Germany)
  • EPM Handels AG (Switzerland)
  • ERSA GmbH (Germany)
  • FTM Technologies (France)
  • INERTEC Lottechnologien GmbH (Germany)
  • Japan Unix Co. Ltd. (Japan)
  • Juki Automation Systems, Inc. (US)
  • Pillarhouse USA, Inc. (US)
  • RPS Automation, LLC (US)
  • SEHO Systems GmbH (Germany)
  • Shenzhen JT Automation Equipment Co., Ltd. (China)
  • Tai'an Puhui Electric Technology Co., Ltd. (China)
  • Tamura H.A. Machinery, Inc. (US)
  • Vitronics Soltec BV (The Netherlands)

9. GLOBAL MARKET PERSPECTIVE

    • Table 6: World Recent Past, Current & Future Analysis for Selective Soldering Equipment by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), Latin America and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 7: World Historic Review for Selective Soldering Equipment by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), Latin America and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 8: World 14-Year Perspective for Selective Soldering Equipment by Geographic Region - Percentage Breakdown of Annual Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), Latin America and Rest of World Markets for Years 2009, 2016 & 2022 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATES

  • A. Market Analysis
    • Current and Future Analysis
    • Growth Trends in Selective Soldering Market
    • Pricing Scenario
    • Shift towards Modular Equipment
    • R&D Efforts in Selective Soldering Market
    • Product Launches
    • Strategic Corporate Developments
    • Key Players
  • B. Market Analytics
    • Table 9: US Recent Past, Current & Future Analysis for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 10: US Historic Review for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)

2. CANADA

  • Market Analysis
    • Table 11: Canadian Recent Past, Current & Future Analysis for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 12: Canadian Historic Review for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)

3. JAPAN

  • A. Market Analysis
    • Current and Future Analysis
    • Key Player
  • B. Market Analytics
    • Table 13: Japanese Recent Past, Current & Future Analysis for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 14: Japanese Historic Review for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)

4. EUROPE

  • A. Market Analysis
    • Current and Future Analysis
    • Revival in SMT Reflow Soldering Equipment Demand in Europe - A Case in Point
    • Product Launches
    • Strategic Corporate Developments
    • Key Players
  • B. Market Analytics
    • Table 15: European Recent Past, Current & Future Analysis for Selective Soldering Equipment by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets Independently Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 16: European Historic Review for Selective Soldering Equipment by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets Independently Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 17: European 14-Year Perspective for Selective Soldering Equipment by Geographic Region - Percentage Breakdown of Annual Revenues for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2009, 2016 & 2022 (includes corresponding Graph/Chart)

5. ASIA-PACIFIC

  • A. Market Analysis
    • Current & Future Analysis
    • Soaring Growth Opportunities
    • Snapshot of Electronics Industry in Asia-Pacific
    • Well Established ECMS Industry Drives Demand for Selective Soldering Equipment
    • Price-based Competition
    • Product Launch
    • Key Players
  • B. Market Analytics
    • Table 18: Asia-Pacific Recent Past, Current & Future Analysis for Selective Soldering Equipment by Geographic Region - China, South Korea, Taiwan and Rest of Asia-Pacific Markets Independently Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 19: Asia-Pacific Historic Review for Selective Soldering Equipment by Geographic Region - China, South Korea, Taiwan and Rest of Asia-Pacific Markets Independently Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 20: Asia-Pacific 14-Year Perspective for Selective Soldering Equipment by Geographic Region - Percentage Breakdown of Annual Revenues for China, South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2009, 2016 & 2022 (includes corresponding Graph/Chart)

6. LATIN AMERICA

  • Market Analysis
    • Table 21: Latin American Recent Past, Current & Future Analysis for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 22: Latin American Historic Review for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)

7. REST OF WORLD

  • Market Analysis
    • Table 23: Rest of World Recent Past, Current & Future Analysis for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 24: Rest of World Historic Review for Selective Soldering Equipment Market Analyzed with Annual Revenues in US$ Thousand for Years 2009 through 2014 (includes corresponding Graph/Chart)

COMPETITIVE LANDSCAPE

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