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市場調查報告書
全球電子溫控市場
Electronic Thermal Management
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全球電子溫控市場 是由出版商Global Industry Analysts, Inc.在2010年10月所出版的。
這份英文市場調查報告書包含Pages: 557 價格從美金4950起跳。
本報告書為全球電子溫控市場之調査分析、產業概要、市場動向、產品概要、最近競爭環境、產品導入與革新、最近產業活動、最近企業活動、主要企業、世界市場前景、各國市場概要等項目的相關整理，概述如下。
第1章 導論、調査方法、產品定義
第2章 產業概要
第3章 市場動向
第4章 產品概要
- 溫控的作用
- 電子溫控產品
- 溫控應用
- 電腦
- 通信
- 醫療
- 工業電子機器
- 航空/軍事
- 家庭用電化產品
- 車
第5章 最近的競爭環境
第6章 產品的導入與革新
第7章 最近的產品革新與發售－前景
第8章 最近的產業活動
第9章 最近的企業活動－前景
第10章 主要企業
第11章 世界市場的前景
第12章 美國
第13章 加拿大
第14章 日本
第15章 歐洲
第16章 亞太地區
第17章 全球其他諸國
競爭企業簡介
Abstract
This report analyzes the worldwide markets for Electronic Thermal Management
in US$ Million by the following end-use segments: Computers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer Electronics, and
Automotive. Also, the report provides market analytics for the Global and US
market for the product segments - Hardware, Software, and Interfaces &
Substrates. Annual estimates and forecasts are provided for the period 2007
through 2015. A six-year historic analysis is also provided for these markets.
The report profiles 158 companies including many key and niche players such as
II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced
Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group,
Inc., Ametek, Inc., Amkor Technology, Inc., Ansys, Inc., Ansoft Corporation,
Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., Ceramics
Process Systems Corporation, Chomerics, Comair Rotron, Inc., Cookson
Electronics Assembly Materials, Cool Innovations, Inc., Cooler Master Co.,
Ltd., C-Therm Technologies Ltd., CTS Corporation, Daat Research Corp., Degree
Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc.,
Ferraz Shawmut, LLC, Fujikura Ltd., Henkel Loctite Corporation, Honeywell
Electronic Materials, Intricast Company Inc., ITW Vortec, JARO Components,
Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert
Corporation, Lord Corporation, Lytron Incorporated, Mentor Graphics
Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch
Instruments, Inc.., Netzsch Thermal Analysis, NMB Technologies Corporation,
Noren Products, Inc.., Orient Semiconductor Electronics Ltd., PC Power &
Cooling, Inc.., Pfannenberg, Inc., PLANSEE Thermal Management Solutions,
Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., Tennmax
United, The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene
Company, Inc., U.S. Toyo Fan Corporation, United Thermal Engineering
Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data
and analytics are derived from primary and secondary research. Company
profiles are mostly extracted from URL research and reported select online
sources.
Table of Contents
1. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
- Study Reliability and Reporting Limitations
- Disclaimers
- Data Interpretation & Reporting Level
- Quantitative Techniques & Analytics
- Product Definitions and Scope of Study
- End-Use Segments
- 1. Computers
- 2. Telecom
- 3. Medical/Office Equipment
- 4. Industrial/Military
- 5. Consumer Electronics
- 6. Automotive
- Product Segments
- 1. Hardware
- 2. Software
- 3. Interfaces and Substrates
2. INDUSTRY OVERVIEW
- Sophisticated Technology Needs Effective Thermal Management
- Current and Future Analysis
- Regional Perspective
- End-Use Perspective
- Product Segment Perspective
3. MARKET TRENDS
- Recession Impacts the Market
- Rising Complexities Present Lucrative Opportunities for Electronic Thermal
Management
- PC Market Stimulates Growth
- Thermal Management Subsystems Set for Robust Growth
- New Technologies Under Development
- Liquid Cooling Gaining Foothold
- Semiconductor Manufacturers Look for Thermal Management Technology
- Heat Pipe Gains Popularity among PC Manufacturers
- Imminent Growth for ICs
4. PRODUCT OVERVIEW
- Thermal Management - A Critical Function
- Electronic Thermal Management Products
- Hardware
- Heat Sinks
- Heat Pipes
- Micro Channels
- Spray Cooling
- Electronic Cooling Fans
- Metal Backplanes
- BGAs
- Software
- Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD)
- Electronic Design Automation (EDA) Software, Electronic Computer Aided
Design (ECAD)
- Software, and Technology Computer Aided Design (TCAD) Software
- Interfaces and Substrates
- Thermal Compounds and Thermal Interface Materials
- Thermal Management Applications
- Computers
- Notebooks/Laptops
- Servers
- Embedded PCs
- Telecom
- Medical
- Industrial Electronics
- Aerospace/Military
- Consumer Electronics
- Automotive
5. COMPETITIVE ENVIRONMENT IN RECENT PAST
- Thermal Management - A Fragmented Market
- Table 1: Leading Vendors in the Worldwide Thermal Management Market
(2006 & 2007) - PercentageBreakdown by Value Sales for Amkor, Aavid
Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding
Graph/Chart)
- Thermal Management Hardware Market
- Table 2: Leading Players in the Worldwide Thermal Management Hardware
Market (2006 & 2007) -Percentage Breakdown by Value Sales forAavid
Thermalloy, Thermacore, Lytron, and Others(includes corresponding
Graph/Chart)
- Fluent - The Undisputed Thermal ManagementS/W Market Leader
- Table 3: Leading Players in the Worldwide Thermal Management Software
Market (2006 & 2007) -Percentage Breakdown by Value Sales for Fluent,Ansys,
Flomerics, Daat, and Others (includescorresponding Graph/Chart)
- Chomerics and Bergquist Lead Thermal ManagementInterface Market
- Table 4: Leading Players in the Worldwide Thermal Management
Interface Market (2006 & 2007) -Percentage Breakdown by Value Sales
forChomerics, Bergquist, Aavid Thermalloy, Lytron,and Others (includes
corresponding Graph/Chart)
- Amkor Dominates Thermal Management Substrate Market
- Table 5: Leading Players in the Worldwide Thermal Management
Substrate Market (2006 & 2007) -Percentage Breakdown by Value Sales for
Amkor,Kyocera, ST ChipPAC, OSE, ASAT, and Others(includes corresponding
Graph/Chart)
6. PRODUCT INTRODUCTIONS/INNOVATIONS
- LORD Unveils MT-815 Low Modulus Increased ThermalConductivity Adhesive
- Thermaltake Introduces Thermaltake SlimX3
- Honeywell Electronic Materials Launches Honeywell PCM45M-SP
- AdaptivCool Develops HotSpotr HT-510
- Nuventix Introduces SynJet Spot Light Cooler
- DSM Engineering Plastics Unveils Thermally Conductive PA46 Material
- Micropelt Launches MPC-D40x Thermoelectric Coolers
- Pfannenberg Unveils New DTS 3000 Side-Mount Cooling Units
- California Micro Devices Launches LuxGuard™ CM1771
- Honeywell Unveils Pb-free Die Attach Solder
- Nuventix Introduces New Line of SynJet Coolers
- Indium Launches Heat-Spring® Thermal Interface Material
- Parker Hannifin Launches Two-Phase Liquid Cooling System
- Nuventix and National Semiconductor Launch Electronic Drive and Reference
Design
- Honeywell International Unveils Honeywell PTM 3180
- RS Components Unveils New Thermal Management Solutions
- Arun Components Launches Alutronic Line of Heatsink Systems
- Nextreme Thermal Solutions Introduces New Series of OptoCooler High
Voltage Modules
- Vette Introduces Aluma-Cop Liquid Cooling
- SprayCool Launches Multi-Platform Enclosure
- Celsia Technologies Unveils Advanced NanoSpreader
- STABLCOR Introduces ST10-LC909 Products
7. PRODUCT INNOVATIONS/LAUNCHES IN RECENT PAST - A PERSPECTIVE BUILDER
- SMART Releases Liquid-Cooled VLP DDR
- LORD Develops Materials for Thermal Management
- Dow Corning Introduces New Thermally Conductive Compound
- Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures
- Dell Develops a Liquid-Cooled Heat Sink
- Fujipoly America Develops an Innovative Thermal Interface Material
- Flomerics to Offer T3Ster Thermal Testing System
- Andigilog® Develops ThermalEdge™ Cooling Technology
- Andigilog® Introduces Thermal Management Solutions
- Celsia Releases MicroSpreader™
- Sunon Develops Liquid Circulation Cooling System
- EBM-PAPST Develops Advanced Liquid Cooling System
- EBM-PAPST Introduces New Fan-Cooling Technology
- Hybricon Introduces Liquid-Cooled ATR Chassis
- Ansoft Launches Latest Version of ePhysics as ePhysics v2
- CTS Launches New Line of Low-Profile Forged Heat Sinks
- Honeywell Introduces Screen Printable Phase Change Material in Chip
Manufacture
- Laird Launches Thermally Conductive, Electrically Insulating T-preg™
HTD for PCBs
- Laird Introduces Deep Drawing Capability for Shielding Applications
- Laird Introduces Low-Cost T-Gard™ for SMPS Devices
- Laird Introduces T-Gard™ 500 High Performance Insulator for
Automotive Industry
- Jaro Develops 450 CFM AC Cooling Fan for Industrial Use
- Jaro Develops IC Cooling Fan With High Flow and Cooling Value
- Mathis Develops Mathis TCi™ For Improved Thermal Conductivity Testing
- Melcor Introduces Extrusion Heat Sinks With Improved Performance
- Fluent Launches New Environmental Thermal Audit Solution for Data Centers
- Kooltronic Introduces Advanced Enclosure Accessories
- Pfannerberg Develops Filterfan®
8. RECENT INDUSTRY ACTIVITY
- Thermacore Snaps Up Pittsburgh Materials Technology
- Parker Hannifin Takes Over SprayCool
- Dow Kokam Acquires Societe de Vehicles Electriques
- BorgWarner Establishes Manufacturing Plant
- MAHLE Acquires Majority Stake in BEHR Industry
- CoolIT Systems Takes Over Assets of Delphi Thermal Liquid Cooling
- Curtiss-Wright Snaps Up EST Group
- Arlington Capital Partners Acquires J.A. Reinhardt
- Thermacore Takes Over k Technology
- IBM Collaborates with Vette
- Bias Power Collaborates with Nuventix
- Roal Electronics Collaborates with Nuventix
- Electronic Environments Inks Partnership Agreement with AdaptivCool
- Asetek Forms Alliance with Corsair
- AdaptivCool and Yamatake Sign Agreement
- Toyal America forms Alliance with E.W. Kaufmann
- Stablcor and Elvia PCB Group Ink Licensing Agreement
- Weidmann Electrical Technology and LumaSense
- Technologies Ink Strategic Partnership Agreement
- Thermacore Bags Contract from Defense Advanced Research Projects Agency
- Waytronx Takes Over CUI
- Photochemie Signs Licensing Agreement with Stablcor
- ON Semiconductor Establishes Research and Development Centre
- Stablcor and Graphic Ink Licensing Agreement
- Texas Instruments Takes Over Commergy Technologies
- Thermal Energy International Takes Over Gardner Energy Management
- nCoat Inks Agreement with BSR Solar Technologies and Sunvention USA
- CSP Inc. MultiComputer Division Signs Agreement with SprayCool®
Technologies
- Mentor Graphics Takes Over Flomerics Group
- Modine Divests Thermacore
9. CORPORATE ACTIVITY IN RECENT PAST - A PERSPECTIVE BUILDER
- Moog Takes Over Thermal Control Products
- Rensselaer Teams Up with Varsities to Develop Cooling Techniques
- Laird Partners with Sager Electronics
- Honeywell to Expand R&D Facility
- Vette Adds ERM
- Laird Takes Over Supercool
- Arlington Capital Acquires Woven Electronics Through Thermal Solutions
- Parker Hannifin Purchases Acofab and Adecem
- Ametek Adds Land Instruments
- Lytron Adds Lockhart Industries
- Seki Technotron Purchases 10% Interest in sp3 Inc.
- OnScreen Purchases Patent of WayCool Thermal Cooling Technology
- Flomerics Acquires NIKA
- Aavid Merges with Ansys and Spins-Off Thermal Management Business
- Celsia and Yeh-Chiang Sign Agreement
- Nextreme Inks License Deal with Caltech
- Celsia Signs Sales & Development Pact with Lighting Science
- Celsia Contracts with Kubo to Expand in Japan
- Hybricon and Parker Hannifin Sign Pact for Cooling Solutions
- Rogers and Thermal Transfer Composites Partner
- sp3 Partners with CPS
- Celsia Teams Up with AET
- Mathis Forms Distribution Partnership with Setaram Instrumentation
10. FOCUS ON SELECT PLAYERS
- II-VI, Incorporated (US)
- Aavid Thermalloy, LLC (US)
- Advanced Thermal Solutions, Inc. (US)
- Alcoa, Inc. (US)
- Alpha Technologies, Inc. (US)
- Ametek, Inc. (US)
- Amkor Technology, Inc. (US)
- Ansys, Inc. (US)
- Ansoft Corporation (US)
- Fluent, Inc. (US)
- ASAT Holdings Ltd. (Hong Kong)
- Brush Engineered Materials, Inc. (US)
- Ceramics Process Systems Corporation (US)
- Chomerics (US)
- Comair Rotron, Inc. (US)
- Cookson Electronics Assembly Materials (US)
- Cool Innovations, Inc. (US)
- Cooler Master Co., Ltd. (UK)
- C-Therm Technologies Ltd. (Canada)
- CTS Corporation (US)
- Daat Research Corp. (US)
- Degree Controls, Inc. (US)
- Dow Corning Corporation (US)
- Dynatron Corporation (US)
- Enertron, Inc. (US)
- Ferraz Shawmut, LLC (Canada)
- Fujikura Ltd. (Japan)
- Henkel Loctite Corporation (US)
- Honeywell Electronic Materials (US)
- Intricast Company Inc (US)
- ITW Vortec (US)
- JARO Components, Inc. (US)
- Kooltronic, Inc. (US)
- Kyocera Corporation (Japan)
- Laird Technologies (US)
- Liebert Corporation (US)
- Lord Corporation (US)
- Lytron Incorporated (US)
- Mentor Graphics Corporation (US)
- Metal Matrix Cast Composites, LLC (US)
- Micronel U.S. (US)
- Netzsch Instruments, Inc. (US)
- Netzsch Thermal Analysis (Germany)
- NMB Technologies Corporation (US)
- Noren Products, Inc. (US)
- Orient Semiconductor Electronics Ltd. (Taiwan)
- PC Power & Cooling, Inc. (US)
- Pfannenberg, Inc. (US)
- PLANSEE Thermal Management Solutions (US)
- Sumitomo Electric Industries, Ltd. (Japan)
- Tech Spray, L. P. (UK)
- Tellurex Corp. (US)
- Tennmax United (US)
- The Bergquist Company (US)
- The Filter Factory, Inc. (US)
- Thermacore (US)
- Transene Company, Inc. (US)
- U.S. Toyo Fan Corporation (US)
- United Thermal Engineering Corporation (US)
- Vette Corp. (US)
- Wakefield Thermal Solutions, Inc. (US)
11. GLOBAL MARKET PERSPECTIVE
- Table 6: World Recent Past, Current & Future Analysisfor Electronic
Thermal Management by Geographic Region -US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan)and Rest of World Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2007 through 2015(includes
corresponding Graph/Chart)
- Table 7: World Historic Review for Electronic Thermal Management by
Geographic Region - US, Canada,Japan, Europe, Asia-Pacific (excluding Japan),
andRest of World Markets Independently Analyzed withAnnual Sales Figures in
US$ Million for Years 2001through 2006 (includes corresponding Graph/Chart)
- Table 8: World 11-Year Perspective for ElectronicThermal Management by
Geographic Region -Percentage Breakdown of Dollar Sales for US, Canada,Japan,
Europe, Asia-Pacific (excluding Japan) andRest of World Markets for Years
2005, 2010 & 2015(includes corresponding Graph/Chart)
- Table 9: World Recent Past, Current & Future Analysisfor Electronic
Thermal Management by Product Segment- Hardware, Software, and Interfaces &
SubstratesIndependently Analyzed with Annual Sales Figuresin US$ Million for
Years 2007 through 2015(includes corresponding Graph/Chart)
- Table 10: World Historic Review for ElectronicThermal Management by
Product Segment - Hardware,Software, and Interfaces & Substrates
MarketsIndependently Analyzed with Annual Sales Figuresin US$ Million for
Years 2001 through 2006(includes corresponding Graph/Chart)
- Table 11: World 11-Year Perspective for ElectronicThermal Management by
Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software,
andInterfaces & Substrates Markets for Years 2005, 2010 &2015 (includes
corresponding Graph/Chart)
- Table 12: World Recent Past, Current & Future Analysisfor Electronic
Thermal Management in Computers byGeographic Region - US, Canada, Japan,
Europe,Asia-Pacific (excluding Japan) and Rest of WorldIndependently Analyzed
with Annual SalesFigures in US$ Million for Years 2007 through 2015(includes
corresponding Graph/Chart)
- Table 13: World Historic Review for ElectronicThermal Management in
Computers by GeographicRegion - US, Canada, Japan, Europe,
Asia-Pacific(excluding Japan), and Rest of World MarketsIndependently Analyzed
with Annual Sales Figuresin US$ Million for Years 2001 through 2006(includes
corresponding Graph/Chart)
- Table 14: World 11-Year Perspective for ElectronicThermal Management in
Computers by GeographicRegion - Percentage Breakdown of Dollar Sales for
US,Canada, Japan, Europe, Asia-Pacific (excluding Japan)and Rest of World
Markets for Years 2005, 2010 & 2015(includes corresponding Graph/Chart)
- Table 15: World Recent Past, Current & Future Analysisfor Electronic
Thermal Management in Telecom byGeographic Region - US, Canada, Japan,
Europe,Asia-Pacific (excluding Japan) and Rest of WorldIndependently Analyzed
with Annual Sales Figuresin US$ Million for Years 2007 through 2015(includes
corresponding Graph/Chart)
- Table 16: World Historic Review for Electronic Thermal Management in
Telecom by Geographic Region - US,Canada, Japan, Europe, Asia-Pacific
(excluding Japan),and Rest of World Markets Independently Analyzedwith Annual
Sales Figures in US$ Million for Years 2001through 2006 (includes
corresponding Graph/Chart)
- Table 17: World 11-Year Perspective for ElectronicThermal Management in
Telecom by Geographic Region - Percentage Breakdown of Dollar Sales for US,
Canada,Japan, Europe, Asia-Pacific (excluding Japan) andRest of World Markets
for Years 2005, 2010 & 2015(includes corresponding Graph/Chart)
- Table 18: World Recent Past, Current & Future Analysisfor Electronic
Thermal Management in Medical/Office Equipment by Geographic Region - US,
Canada,Japan, Europe, Asia-Pacific (excluding Japan) andRest of World
Independently Analyzed with Annual SalesFigures in US$ Million for Years 2007
through 2015(includes corresponding Graph/Chart)
- Table 19: World Historic Review for Electronic Thermal Management in
Medical/Office Equipment by GeographicRegion - US, Canada, Japan, Europe,
Asia-Pacific(excluding Japan), and Rest of World MarketsIndependently Analyzed
with Annual SalesFigures in US$ Million for Years 2001 through 2006(includes
corresponding Graph/Chart)
- Table 20: World 11-Year Perspective for ElectronicThermal Management in
Medical/Office Equipment by Geographic Region - Percentage Breakdownof Dollar
Sales for US, Canada, Japan, Europe,Asia-Pacific (excluding Japan) and Rest of
WorldMarkets for Years 2005, 2010 & 2015 (includescorresponding
Graph/Chart)
- Table 21: World Recent Past, Current & FutureAnalysis for Electronic
Thermal Management in Industrial/Military by Geographic Region - US,Canada,
Japan, Europe, Asia-Pacific (excluding Japan)and Rest of World Independently
Analyzed withAnnual Sales Figures in US$ Million for Years 2007through 2015
(includes corresponding Graph/Chart)
- Table 22: World Historic Review for Electronic Thermal Management in
Industrial/Military by GeographicRegion - US, Canada, Japan, Europe,
Asia-Pacific(excluding Japan), and Rest of World MarketsIndependently Analyzed
with Annual Sales Figuresin US$ Million for Years 2001 through 2006(includes
corresponding Graph/Chart)
- Table 23: World 11-Year Perspective for ElectronicThermal Management in
Industrial/Military byGeographic Region - Percentage Breakdownof Dollar Sales
for US, Canada, Japan, Europe,Asia-Pacific (excluding Japan) and Rest of
WorldMarkets for Years 2005, 2010 & 2015 (includescorresponding
Graph/Chart)
- Table 24: World Recent Past, Current & FutureAnalysis for Electronic
Thermal Managementin Consumer Electronics by Geographic Region -US, Canada,
Japan, Europe, Asia-Pacific (excludingJapan) and Rest of World Independently
Analyzedwith Annual Sales Figures in US$ Million forYears 2007 through 2015
(includes correspondingGraph/Chart)
- Table 25: World Historic Review for Electronic Thermal Management in
Consumer Electronics by GeographicRegion - US, Canada, Japan, Europe,
Asia-Pacific(excluding Japan), and Rest of World MarketsIndependently Analyzed
with Annual SalesFigures in US$ Million for Years 2001 through 2006(includes
corresponding Graph/Chart)
- Table 26: World 11-Year Perspective for ElectronicThermal Management in
Consumer Electronics byGeographic Region - Percentage Breakdownof Dollar Sales
for US, Canada, Japan, Europe,Asia-Pacific (excluding Japan) and Rest of
WorldMarkets for Years 2005, 2010 & 2015 (includescorresponding
Graph/Chart)
- Table 27: World Recent Past, Current & Future Analysisfor Electronic
Thermal Management in Automotiveby Geographic Region - US, Canada, Japan,
Europe,Asia-Pacific (excluding Japan) and Rest of WorldIndependently Analyzed
with Annual Sales Figuresin US$ Million for Years 2007 through 2015(includes
corresponding Graph/Chart)
- Table 28: World Historic Review for ElectronicThermal Management in
Automotive by GeographicRegion - US, Canada, Japan, Europe,
Asia-Pacific(excluding Japan), and Rest of World MarketsIndependently Analyzed
with Annual SalesFigures in US$ Million for Years 2001 through 2006(includes
corresponding Graph/Chart)
- Table 29: World 11-Year Perspective for ElectronicThermal Management in
Automotive by GeographicRegion - Percentage Breakdown of Dollar Salesfor US,
Canada, Japan, Europe, Asia-Pacific(excluding Japan) and Rest of World
Marketsfor Years 2005, 2010 & 2015 (includescorresponding Graph/Chart)
12. UNITED STATES
- A. Market Analysis
- Current and Future Analysis
- By End-Use Segment
- By Product Segment
- Rising Complexities Present Lucrative Opportunities for Electronic
Thermal Management
- Price Pressures and Shifting of Manufacturing to Asia to Restrain Growth
- B. Market Analytics
- Table 30: US Recent Past, Current & Future Analysisfor Electronic
Thermal Management by ProductSegment - Hardware, Software, and Interfaces
&Substrates Markets Independently Analyzed withAnnual Sales Figures in US$
Million for Years 2007through 2015 (includes corresponding Graph/Chart)
- Table 31: US Historic Review for Electronic Thermal Management by
Product Segment - Hardware,Software, and Interfaces & Substrates
MarketsIndependently Analyzed with Annual SalesFigures in US$ Million for
Years 2001 through 2006 (includes corresponding Graph/Chart)
- Table 32: US 11-Year Perspective for ElectronicThermal Management by
Product Segment -Percentage Breakdown of Dollar Sales forHardware, Software,
and Interfaces & SubstratesMarkets for Years 2005, 2010 & 2015
(includescorresponding Graph/Chart)
- Table 33: US Recent Past, Current & FutureAnalysis for Electronic
Thermal Management byEnd-Use Segment - Computers, Telecom,Medical/Office
Equipment, Industrial/Military,Consumer Electronics, and Automotive Markets
Independently Analyzed with Annual SalesFigures in US$ Million for Years
2007through 2015 (includes correspondingGraph/Chart)
- Table 34: US Historic Review for Electronic Thermal Management by
End-Use Segment - Computers,Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive Markets
Independently Analyzed with Annual Sales Figuresin US$ Million for Years
2001 through 2006(includes corresponding Graph/Chart)
- Table 35: US 11-Year Perspective for ElectronicThermal Management by
End-Use Segment -Percentage Breakdown of Dollar Sales forComputers, Telecom,
Medical/Office Equipment, Industrial/Military, Consumer Electronics,and
Automotive Markets for 2005, 2010 & 2015(includes corresponding
Graph/Chart)
13. CANADA
- Market Analysis
- Table 36: Canadian Recent Past, Current & FutureAnalysis for
Electronic Thermal Management byEnd-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, ConsumerElectronics, and
Automotive Markets IndependentlyAnalyzed with Annual Sales Figures in US$
Millionfor Years 2007 through 2015 (includescorresponding Graph/Chart)
- Table 37: Canadian Historic Review for ElectronicThermal Management
by End-Use Segment - Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive Markets
Independently Analyzed with Annual Sales Figuresin US$ Million for Years
2001 through 2006(includes corresponding Graph/Chart)
- Table 38: Canadian 11-Year Perspective for Electronic Thermal
Management by End-Use Segment - Percentage Breakdown of Dollar Sales for
Computers, Telecom, Medical/Office Equipment, Industrial/Military,Consumer
Electronics, and Automotive Marketsfor 2005, 2010 & 2015 (includes
corresponding Graph/Chart)
14. JAPAN
- Market Analysis
- Table 39: Japanese Recent Past, Current & FutureAnalysis for
Electronic Thermal Management byEnd-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, ConsumerElectronics, and
Automotive Markets IndependentlyAnalyzed with Annual Sales Figures in US$
Millionfor Years 2007 through 2015 (includescorresponding Graph/Chart)
- Table 40: Japanese Historic Review for Electronic Thermal Management
by End-Use Segment - Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive Markets
IndependentlyAnalyzed with Annual Sales Figures in US$ Millionfor Years 2001
through 2006 (includescorresponding Graph/Chart)
- Table 41: Japanese 11-Year Perspective for Electronic Thermal
Management by End-Use Segment - Percentage Breakdown of Dollar Sales for
Computers, Telecom, Medical/Office Equipment, Industrial/Military,Consumer
Electronics, and Automotive Markets for2005, 2010 & 2015 (includes
corresponding Graph/Chart)
15. EUROPE
- Market Analysis
- Table 42: European Recent Past, Current & FutureAnalysis for
Electronic Thermal Management byEnd-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/Military, ConsumerElectronics, and
Automotive Markets IndependentlyAnalyzed with Annual Sales Figures in US$
Millionfor Years 2007 through 2015 (includescorresponding Graph/Chart)
- Table 43: European Historic Review for ElectronicThermal Management
by End-Use Segment -Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, andAutomotive Markets
Independently Analyzed withAnnual Sales Figures in US$ Million for Years
2001through 2006 (includes corresponding Graph/Chart)
- Table 44: European 11-Year Perspective forElectronic Thermal
Management by End-Use Segment - Percentage Breakdown of Dollar Sales
forComputers, Telecom, Medical/Office Equipment, Industrial/Military,
Consumer Electronics, andAutomotive Markets for 2005, 2010 & 2015(includes
corresponding Graph/Chart)
16. ASIA-PACIFIC
- A. Market Analysis
- Current and Future Analysis
- Taiwan Market Scenario
- B. Market Analytics
- Table 45: Asia-Pacific Recent Past, Current & Future Analysis for
Electronic Thermal Management byEnd-Use Segment - Computers, Telecom,
Medical/Office Equipment, Industrial/ Military, Consumer Electronics,and
Automotive Markets Independently Analyzed withAnnual Sales Figures in US$
Million for Years 2007through 2015 (includes corresponding Graph/Chart)
- Table 46: Asia-Pacific Historic Review for Electronic Thermal
Management by End-Use Segment -Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, andAutomotive Markets
Independently Analyzedwith Annual Sales Figures in US$ Millionfor Years 2001
through 2006 (includescorresponding Graph/Chart)
- Table 47: Asia-Pacific 11-Year Perspective forElectronic Thermal
Management by End-Use Segment - Percentage Breakdown of Dollar Sales
forComputers, Telecom, Medical/Office Equipment, Industrial/Military,
Consumer Electronics, andAutomotive Markets for 2005, 2010 & 2015(includes
corresponding Graph/Chart)
17. REST OF WORLD
- Market Analysis
- Table 48: Rest of World Recent Past, Current &Future Analysis for
Electronic Thermal Managementby End-Use Segment - Computers,
Telecom,Medical/Office Equipment, Industrial/Military,Consumer Electronics,
and Automotive MarketsIndependently Analyzed with Annual SalesFigures in US$
Million for Years 2007through 2015 (includes correspondingGraph/Chart)
- Table 49: Rest of World Historic Review forElectronic Thermal
Management by End-Use Segment - Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, andAutomotive Markets
Independently Analyzedwith Annual Sales Figures in US$ Millionfor Years 2001
through 2006 (includescorresponding Graph/Chart)
- Table 50: Rest of World 11-Year Perspective forElectronic Thermal
Management by End-Use Segment - Percentage Breakdown of Dollar Sales
forComputers, Telecom, Medical/Office Equipment, Industrial/Military,
Consumer Electronics,and Automotive Markets for 2005, 2010 & 2015(includes
corresponding Graph/Chart)
COMPETITION
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