功率半導體包裝的外包市場

Outsourced Power Semiconductor Packaging Markets

出版商	Frost & Sullivan
出版日期	2008年01月	商品編碼	59679
內容資訊	英文
價格	US $ 6000 Web Access (Regional License) US $ 6500 Hard Copy & Web Access (Regional License)

功率半導體包裝的外包市場 是由出版商Frost & Sullivan在2008年01月所出版的。這份英文市場調查報告書價格從美金6000起跳。

此報告書中對於專門從事電晶體與兩極真空管等功率半導體包裝工程的外包廠商市場進行調查分析，其內容涵蓋有全球市場動向、功率半導體與功率半導體包裝市場展望、價格與各競爭公司現況、用於決策的基本資料等。報告書之內容摘要如下所示。

Executive Summary
- Introduction
- Project Scope and Methodology
- Key Findings
Analysis of the Global Market for Indipendant/Outsourced Power Packaging
- Market Overview
- Industry Challenges
- Market Drivers
- Market Restraints
Discrete Power Semiconductor Market
- Total Revenue Forecasts
- Individual Revenue Forecasts
Power Semiconductor Packaging Market
- Overall Forecasts
- Life Cycle of Packages Studied
- Individual Revenue Forecasts
Power Semiconductor Packaging Market Regional Trends
- Revenue Forecasts
Pricing Trends and Competitive Analysis
- Pricing Trends
- Competitive Analysis
- Market Share Estimates
Summary and Conclusion
- Summary
- Strategic Conclusion
Appendix
- Appendix I
- Appendix II
Decision Support Database
- DSD' s

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