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市場調查報告書

熱力原料及軟體的北美市場

North American Thermal Management Components and Software Markets

出版商 Frost & Sullivan
出版日期 2005年06月 商品編碼 32688
內容資訊 英文 118 Pages
價格
本報告書已不再販售

本報告已在2011年07月19日停止出版。

簡介

中小機器設備工廠因為能夠提供平價且獨特的解決方略,因此常能獲得當地顧客的青睞。由於這些工廠的急速發展,北美的散熱片廠商正處於價格競爭等嚴峻的環境之下。

專門於高科技領域中扮演諮詢與市場調查角色的美國調查公司Frost & Sullivan(總公司: 德州),詳細地調查與分析熱力原料及軟體的北美市場,並有系統地出版綜合報告書 “North American Thermal Management Components and Software Markets”。

此報告書在下面的內容裡,除了說明以散熱片與熱電致冷器(TEC)為中心的熱力原料及軟體市場的概要,也探討市場發展促進因素與阻礙因素、獲利預測、各市場的各類製品的動向與預測。另外也提供各地預測、通路分析、價格動向、消費者動向、競爭架構及佔有分析等。

● 市場動向

  • 市場概要
  • 定義
  • 課題
  • 市場發展促進因素
    • 由於輸出功率密度及封裝的需求增加,導致熱管理市場獲利提高。
    • 由於自動控制的普及,導致市場對於優質熱管理的需求增加。
    • 用於發電上的熱電原素的需求增加
    • 醫療設備產業的新商機
    • 多樣特製等級帶動散熱片市場的獲利提高
  • 市場發展阻礙因素
    • 價格崩壞
    • 高價位阻礙了冷卻用TEC在耐久性消費品產業上的發展
    • 一般性軟體阻礙了專用熱管理軟體的普及
    • TEC curve的售價標準化對獲利的影響
    • 通訊產業的復甦遲緩阻礙了熱電致冷器(TEC)的市場擴大

● 預測與動向

  • 市場工學指標
  • 整體市場獲利預測
  • 散熱片市場:各製品預測與動向
  • 熱電致冷器(TEC)市場:各製品預測與動向
  • 熱管理軟體:各製品預測與動向
  • 各地預測與動向
  • 價格動向分析
  • 通路分析
  • 消費者動向與分析

● 競爭分析

  • 競爭架構
  • 市場佔有分析

● Frost & Sullivan Awards

● 決策輔助資料庫(統計資料集)

目錄

Machine Shops with Localized Clientele Challenge Heat Sink Manufacturers

North American manufacturers in the heat sink market -- a part of the thermal management components market -- are facing a strong challenge due to the sudden proliferation of several small machine shops with localized customer bases. These machine shops are winning over small and mid-sized clients by providing them with customized, yet affordable, solutions. This rising trend has placed manufacturers of heat sinks under considerable pricing pressure and restrained their market penetration, in addition to the tough price competition they are already facing from Asian suppliers in the standardized heat sink market. In particular, many tier-2 and tier-3 participants that had already started moving toward niche or customized markets in search of better margins have been impacted by the growing strength of machine shops in these areas. These manufacturers are expected to develop partnerships with machine shops in an attempt to convert this challenge into an opportunity and gain much-needed presence in small and medium accounts for customized solutions.

This Frost & Sullivan research service takes an in-depth look at the North American thermal management components and software market. This analysis focuses on the markets for standardized and customized heat sinks along with single-stage and multi-stage thermoelectric coolers (TECs). It examines the critical challenges facing these markets as well as their major drivers and restraints. It also includes detailed revenue forecasts by level of customization to give clients better insights into the market.

Increasing Power Density and Packaging Challenges Drive Revenues

Growing functional convergence of products is creating a demand for superior and more efficient thermal solutions. Packaging challenges are increasing, as are the power densities on printed circuit boards (PCBs). Thermal management manufacturers are addressing these challenges by providing more sophisticated -- and more expensive -- heat sinks and TECs along with higher-performance thermal design software, thereby driving revenues.

Thermal management challenges arising due to miniaturization of end-user applications also form an important driver for this market. In an attempt to differentiate themselves from the competition, original equipment manufacturers (OEMs) and system integrators are looking to pack a greater number of components on their PCBs. Moreover, due to growing miniaturization, there is a trend toward reducing the size of the PCBs in order to minimize the size of the end product. "The industry is not likely to see a decrease in the rate of miniaturization and digital convergence," observes the analyst of this research service. "Therefore, the impact of this driver is anticipated to be high throughout the forecast period (2006-2012)."

Move toward Higher Customization Expected to Provide Respite from Relentless Price Pressure

The extent of customization in a heat sink design determines the price of the product in the North American heat sink market, which is not as commoditized as that in Asia. Product margins are closely linked to the level of customization, causing the market to shift toward increased customization in terms of both consumption and production. "North American manufacturers are actively pursuing mass customization as well as long-term partnerships to improve margins," says the analyst. "This move is also expected to provide some relief from high levels of price sensitivity in the heat sink market, caused by an increase in the shipments of standardized, low-cost products."

Market Trend

Market Overview
Definitions
Challenges
Drivers
Restraints

Forecasts & Trends

Market Engineering Measurements
Total Market Revenue Forecasts
Heat Sink Market: Forecasts & Trends by Product Type
Thermoelectric Coolers Market: Forecasts & Trends by Product Type
Thermal Management Software: Forecasts & Trends by Product Type
Forecasts & Trends by Geographic Region
Pricing Trend Analysis
Distribution Channel Analysis
End-user Trends & Analysis

Competition Analysis

Competition Structure
Market Share Analysis

Frost & Sullivan Awards

Market Leadership Award (Heat Sink Market)
Customer Service Leadership Award (Thermal Management Software Market)
Customer Service Leadership Award (Thermoelectric Coolers Market)
Technology Leadership (Heat Sink Market)

Decision Support Database

Telecom Equipment Spending
PC Installed Base
Light Vehicle Sales
Medical Device Mfg Establishments
Installed Base of Fax Machines
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