Phase Change Memory Enters a New Phase outlines the challenges phase change
memory faces as it vies to compete with mainstream charge-based memories. The
report provides thorough analysis of PCM versus current mainstream
semiconductor memories such as SRAM, DRAM, NOR flash and NAND flash. An
update on the PCM activities of major vendors as well as a market and price
forecast out to 2015 based on a detailed roadmap is also provided.
Table of Contents
CONTENTS
LIST OF FIGURES
LIST OF TABLES
TERMINOLOGY
EXECUTIVE SUMMARY
MEMORY OVERVIEW
Introduction
The Memory Hierarchy
SRAM
Concept
Technology Evolution
DRAM
Concept
Technology Evolution
NOR Flash
Concept
Technology Evolution
NROM
Concept
Technology Evolution
NAND Flash
Concept
Technology Evolution
PHASE CHANGE MEMORY
Introduction
Phase Change Material
Memory Cell Concept
Basic Operation
Memory Cell Variations
Selection Device
PCM Characteristics
Set Time
Reset Current
Endurance
Memory Comparison
Multi-level Cell PCM
Device Layout
PCM Reliability
PCM Cost Drivers
Die Size
Process Complexity
Technology Scaling
Scaling Parameters
Roadmap
PCM DEVELOPMENT STATUS
PCM Development Status
ATMI, Inc.
BAE Systems
CAMELS
Elpida
Hynix Semiconductor
IBM
IMEC
ITRI
Macronix International
Nanochip
Numonyx (Intel/ST)
NXP Semiconductors
Ovonyx
Qimonda AG
Renesas Technology
Samsung Electronics
STMicroelectronics
ULVAC
MARKET FORECAST
PCM as a NOR Replacement
PCM as a Non-volatile RAM
PCM as a Storage Class Memory
Applications
Embedded PCM
Market
REFERENCES
ABOUT THE AUTHOR
ABOUT FORWARD INSIGHTS
Services
Contact
REPORT OFFERINGS
List of Figures
Figure 1. Memory Hierarchy
Figure 2. SRAM Cell Layout
Figure 3. 3D SRAM Technology
Figure 4. DRAM Cell
Figure 5. DRAM Cell Transistor Evolution
Figure 6. DRAM Cell Capacitor Trend
Figure 7. NOR Flash Cell
Figure 8. NOR Architecture
Figure 9. NOR Flash Cell
Figure 10. NOR Flash Technology Evolution
Figure 11. Drain Bias Margin
Figure 12. NROM Cell Concept
Figure 13. NROM Architecture
Figure 14. NROM Cell
Figure 15. NROM Technology Evolution
Figure 16. Bit Disturb (“Second Bit Effect”)
Figure 17. NAND Flash Cell Concept
Figure 18. NAND Architecture
Figure 19. NAND Cell String
Figure 20. NAND Flash Technology Evolution
Figure 21. NAND Flash Memory Gap Fill
Figure 22. Electrons Stored on the Floating Gate
Figure 23. Samsung 32Gb CTF Memory
Figure 24. Timeline of Phase Change Memory
Figure 25. Periodic Table
Figure 26. GST Composition
Figure 27. Basic PCM Cell Structure
Figure 28. Set Operation
Figure 29. Reset Operation
Figure 30. Phase Change Memory I-V Curve
Figure 31. Memory Array Operation
Figure 32. μTrench and Lance Structures
Figure 33. Lance and pore structure
Figure 34. Phase Change Bridge Memory
Figure 35. MOS and BJT Selector
Figure 36. Diode Selector
Figure 37. Set Time Trend
Figure 38. Dependence of Reset Current on Contact Area
Figure 39. Reset Current Reduction with Ta2O5 Interfacial Layer
Figure 40. Reset Current Trend
Figure 41. PCM Endurance
Figure 42. Read Access Time Comparison
Figure 43. Write Throughput
Figure 44. Program Performance Comparison
Figure 45. MLC Write Approaches
Figure 46. MLC Distribution
Figure 47. Multi-level States as a Function of Pulse Tail
Microprocessor Market to 2015 - Enterprise Shift to Cloud Computing and Popularity of Mobile Computing Increasing Demand for Multi-core Processor Chips
