Demand for electronic polymer products is forecast to expand 13.3 percent per year to $4.5 billion in 2008. Production of these products will require 510 million pounds of resin valued at $2.2 billion. Growth will be driven by a strong recovery in the semiconductor industry and a shift to new technologies that are more intensive users of polymers.

For example, direct chip attachment is intensifying the need for new materials such as underfills and conductive adhesives. This encourages close collaboration between chipmakers and backend (packaging) operations and favors firms with US operations. These trends in back-end technologies, and the general shift toward higher cost specialty resins, will result in electronic polymer products outpacing gains in electronic component shipments through 2008.

Area array, chip scale packages to spur gains

For electronic polymers used in fundamental applications such as printed circuit board laminates and semiconductor packaging, the primary competitive focus will be the continuing replacement of wire bonded packages by flip chip and other types of area array and chipscale packaging in many applications. Standard wire bonded packages will still predominate, but the move to area array packaging will cause significant shifts in material requirements as formerly niche materials become major segments of the industry.

For instance, chip underfills, used in flip chip assemblies, see annual growth of nearly 30 percent per year through 2008. Conductive adhesives will also see strong gains as these materials replace lead solders due to environmental factors and the use of less expensive compounds in molded interconnect devices. Conversely, epoxy molding compounds and die attach adhesives, both used traditional wire bonded packaging, will post slower gains.

Low-k, liquid crystal, polysulfone polymers among best prospects

A few segments of the electronic polymer products market are expected to experience particularly good growth. For example, annual gains for low-k dielectric polymers are projected to reach $285 million in 2008 from less than $10 million in 2003. Polymers with a low dielectric constant, such as Dow Chemical�fs SILK and Rohm and Haas�f ZIRKON materials, are challenging traditional silicon dioxide (SiO2) in crucial ILD (interlayer dielectric) applications in semiconductor fabrication. The primary competition for low-k polymers, which are applied via a spin-on process, is from CVD (chemical vapor deposition) processes utilizing carbondoped SiO2. The outcome of this competition is likely to be a combination of spin-on polymers and CVD-applied materials. Compounds made of high temperature thermoplastics such as liquid crystal polymer and polyethersulfone used in molded interconnect devices are another area of strong growth.

Study coverage

Electronic Polymers, a 302-page Freedonia study. It provides historical demand data (1993, 1998, 2003) plus forecasts to 2008 and 2013 by resin, type and end-use. It also presents company market share data and profiles 36 US industry competitors.

INTRODUCTION

I. EXECUTIVE SUMMARY

II. MARKET ENVIRONMENT

General
Macroeconomic Overview
Population & Demographic Trends
Personal Consumption Expenditures
Manufacturing Sector Overview
Electronic Product Shipments
Electronic Component Shipments: Semiconductors; Passive Components; Printed Circuit Boards
Environmental & Regulatory Trends

III. TECHNOLOGY

General
Electronic Component Manufacturing: Polycrystalline Silicon Production; Silicon Wafer Fabrication; Integrated Circuit Fabrication; Interlayer Dielectrics
Printed Circuit Board Production
Packaging & Assembly Overview: Wire-Bond Technology; Surface Mount Technology; Chip-on-Board Technology; Multichip Module Technology; Chip Scale Packaging; Ball Grid Arrays; Flip Chip Technology

IV. OVERVIEW

General
Industry Flow Chart
Historical Growth & Cyclicality, 1993-2003
Electronic Polymer Pricing Trends
World Demand for Electronic Polymer Products: World Demand by Region; World Demand by Product

V. ELECTRONIC POLYMERS DEMAND BY RESIN

General
Thermoset Electronic Polymers: Thermosets Demand by Resin; Epoxies; Demand by End Use & Application; Suppliers & Products; Polyimides; Demand by End Use & Application; Suppliers & Products; Silicones; Demand by End Use & Application; Suppliers & Products; Phenolics; Demand by End Use & Application; Suppliers & Products; Polyurethanes; Other Thermoset Electronic Polymers
Thermoplastic Electronic Polymers: Thermoplastics Demand by Resin; Polysulfone & Polyethersulfone; Liquid Crystal Polymer; Nylon; Polyphenylene Sulfide; Polybutylene Terephthalate; Polyethylene Terephthalate; Other Thermoplastic Electronic Polymers

VI. ELECTRONIC POLYMER PRODUCTS DEMAND BY TYPE

General
Electronic Laminates: Electronic Laminates by Resin; Epoxy-Based Electronic Laminates; Polyimide-Based Laminates; Phenolic-Based Electronic Laminates; Other Thermoset Electronic Laminates; PET-Based Electronic Laminates; LCP-Based Electronic Laminates; Other Thermoplastic Electronic Laminates; Electronic Laminates Suppliers & Market Share; Packaging Materials; Encapsulants
Packaging Molding Compounds: Other Packaging Materials; Packaging Materials Suppliers & Market Share
Connector Molding Compounds: Polysulfone & Polyethersulfone Molding Compounds; Liquid Crystal Polymer Molding Compounds; Nylon Molding Compounds; Polyphenylene Sulfide Molding Compounds; Polybutylene Terephthalate Molding Compounds; Other Connector Molding Compounds; Connector Molding Compounds Suppliers & Market Share
Electronic Adhesives & Underfill: Die Attach Adhesives; Assembly & Surface Mount Adhesives; Conductive Adhesives; Underfill; Adhesives & Underfill Suppliers & Market Share
Other Electronic Polymer Products: Conformal Coatings; Low-k Dielectric Polymers; All Other Electronic Polymer Products; Other Electronic Polymer Products Suppliers & Market Share

VII. ELECTRONIC POLYMER PRODUCTS DEMAND BY END USE

General
Printed Circuit Boards
Semiconductors
Passive Components

VIII. INDUSTRY STRUCTURE

General
Suppliers & Market Share: Isola (Ruetgers); DuPont; Cookson; General Electric; National Starch and Chemical (ICI); Rogers; Park Electrochemical; Henkel Loctite; Other
Acquisitions, Divestitures & Industry Restructuring
Joint Ventures & Cooperative Agreements
Research & Development
Competitive Strategies
Marketing & Distribution
Company Profiles: Ablestik Laboratories, see Imperial Chemical Industries; Acheson Colloids, see Imperial Chemical Industries; Air Products and Chemicals Incorporated; Arch Chemicals Incorporated; Arlon Incorporated, see Bairnco Corporation; Ashland Incorporated; Bairnco Corporation; Bakelite AG, see Ruetgers AG; BASF AG; Bayer AG; Celanese AG; ChemFirst Incorporated, see DuPont (EI) de Nemours; Chevron Phillips Chemical Company LLC; Conap Incorporated, see Cytec Industries Incorporated; Cookson Group plc; CPChem, see ChevronPhillips Chemical Company LP; Cytec Industries Incorporated; Dainippon Ink and Chemicals Incorporated; Degussa AG; Dow Chemical Company; Dow Corning Corporation; DuPont (EI) de Nemours; Durez Corporation, see Sumitomo Chemical; Eastman Chemical Company; Emerson & Cuming, see Imperial Chemical Industries plc; EMS-Chemie Holding AG; Epoxy Technology Incorporated; GE Plastics, see General Electric Company; General Electric Company; HD MicroSystems LLC, see DuPont and Hitachi Limited; Henkel KGaA; Hitachi Limited; Honeywell International Incorporated; Honeywell Plastics, see BASF AG; Huntsman Corporation; Imperial Chemical Industries plc; Isola Laminate Systems Corporation, see Ruetgers AG; Loctite Corporation, see Henkel KGaA; Lord Corporation; Matsushita Electric Works Limited; National Starch and Chemical, see Imperial Chemical (ICI); Park Electrochemical Corporation; Polyclad Laminates Incorporated, see Cookson Group plc; PPG Industries Incorporated; Promerus LLC, see Sumitomo Chemical Company Limited; Reichhold Incorporated, see Dainippon Ink and Chemicals; Resolution Performance Products LLC; Rogers Corporation; Rohm and Haas Company; Ruetgers AG; Shin-Etsu Chemical Company Limited; Shipley Company LLC, see Rohm and Haas Company; Solvay SA; Sumitomo Chemical Company Limited; Ticona LLC, see Celanese AG; Tra-Con, see Imperial Chemical Industries plc; Vantico AG, see Huntsman Corporation; Wacker-Chemie GmbH
Other Companies in the Electronic Polymers Industry

LIST OF TABLES

SECTION I -- EXECUTIVE SUMMARY

Summary Table

SECTION II -- MARKET ENVIRONMENT

1 Macroeconomic Indicators
2 Population Trends
3 Personal Consumption Expenditures
4 Manufacturers' Shipments
5 Electronic Product Shipments
6 Electronic Component Shipments by Product
7 Semiconductor Shipments by Type
8 Passive Component Shipments by Type
9 Printed Circuit Board Shipments by Type

SECTION IV -- OVERVIEW

1 Electronic Polymer Products Demand
2 Electronic Polymer Products Demand: Historical Growth & Cyclicality, 1993-2003
3 Electronic Polymers Pricing Trends

SECTION V -- ELECTRONIC POLYMERS DEMAND BY RESIN

1 Electronic Polymers Demand
2 Thermoset Electronic Polymers Demand by End Use & Application
3 Thermoset Electronic Polymers Demand by Resin
4 Epoxies Demand in Electronic Components by End Use & Application
5 Polyimides Demand in Electronic Components by End Use & Application
6 Silicones Demand in Electronic Components by End Use & Application
7 Phenolics Demand in Electronic Components by End Use & Application
8 Polyurethanes Demand in Electronic Components by End Use & Application
9 Other Thermoset Polymers Demand in Electronic Components by End Use & Application
10 Thermoplastic Electronic Polymers Demand by End Use & Application
11 Thermoplastic Polymers Demand by Resin
12 Polysulfone & Polyethersulfone Demand in Electronic Components by End Use & Application
13 Liquid Crystal Polymer Demand in Electronic Components by End Use & Application
14 Nylon Demand in Electronic Components by End Use & Application
15 Polyphenylene Sulfide Demand in Electronic Components by End Use & Application
16 PBT Demand in Electronic Components by End Use & Application
17 PET Demand in Electronic Components by End Use & Application
18 Other Thermoplastic Polymers Demand in Electronic Components by End Use & Application

SECTION VI -- ELECTRONIC POLYMER PRODUCTS DEMAND BY TYPE

1 Electronic Polymer Products Demand by Type
2 Electronic Laminates Demand
3 Electronic Laminate Demand by Resin
4 Epoxy-Based Electronic Laminates Demand
5 Polyimide-Based Electronic Laminates Demand
6 Phenolic-Based Electronic Laminates Demand
7 Other Thermoset Electronic Laminates Demand
8 PET-Based Electronic Laminates Demand
9 LCP-Based Electronic Laminates Demand
10 Other Thermoplastic Electronic Laminates Demand
11 US Electronic Laminate Sales by Company, 2003
12 Packaging Materials Demand by Type
13 Encapsulants Demand
14 Packaging Molding Compound Demand
15 Other Packaging Materials Demand
16 US Electronic Packaging Material Sales by Company, 2003
17 Connector Molding Compound Demand
18 Polysulfone & Polyethersulfone Connector Molding Compounds Demand
19 Liquid Crystal Polymer Connector molding Compounds Demand
20 Nylon Connector Molding Compound Demand
21 Polyphenylene Sulfide Connector Molding Compound Demand
22 Polybutylene Terephthalate Connector Molding Compound Demand
23 Other Connector Molding Compound Demand
24 US Connector Molding Compounds Sales by Company, 2003
25 Adhesives & Underfill Demand by Type
26 Die Attach Adhesives Demand
27 Assembly & Surface Mount Adhesives Demand
28 Conductive Adhesives Demand
29 Underfill Demand
30 US Electronic Adhesives & Underfill Sales by Company, 2003
31 Other Electronic Polymer Products Demand by Type
32 Conformal Coatings Demand
33 Low-k Dielectric Polymers Demand
34 All Other Electronic Polymer Products Demand
35 US Other Electronic Polymer Products Sales by Company, 2003

SECTION VII -- ELECTRONIC POLYMER PRODUCTS DEMAND BY END USE

1 Electronic Polymer Products Demand by End Use
2 Printed Circuit Board Applications for Electronic Polymer Products by Product & PCB Type
3 Semiconductor Applications for Electronic Polymer Products by Product & Packaging Type
4 Passive Components Applications for Electronic Polymer Products

SECTION VIII -- INDUSTRY STRUCTURE

1 US Electronic Polymer Product Sales by Company, 2003
2 Selected Acquisitions & Divestitures in the Electronic Polymers Industry, 2002-2003
3 Selected Cooperative Agreements in the Electronic Polymers Industry
4 Research & Development Expenditures: Selected Electronic Polymer Suppliers

LIST OF CHARTS

SECTION IV -- OVERVIEW

1 Electronic Polymers Flowchart
2 Electronic Polymer Products Demand: Historical Growth & Cyclicality, 1993-2003
3 World Electronic Polymer Products Demand by Region, 2003
4 World Electronic Polymer Products Demand by Product, 2003

SECTION VI -- ELECTRONIC POLYMER PRODUCTS DEMAND BY TYPE

1 Electronic Laminates -- US Market Share by Supplier, 2003
2 Electronic Packaging Materials -- US Market Share by Supplier, 2003
3 Connector Molding Compounds -- US Market Share by Supplier, 2003
4 Electronic Adhesives & Underfill -- US Market Share by Supplier, 2003
5 Other Electronic Polymer Products -- US Market Share by Supplier, 2003

SECTION VIII -- INDUSTRY STRUCTURE

1 Electronic Polymer Products -- US Market Share by Supplier, 2003

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