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市場調查報告書

指示牌 & 專業顯示器LED:全球市場的檢討與預測 2015-2020年

Signage & Professional Display LEDsGlobal Market Review & Forecast 2015-2020

出版商 ElectroniCast 商品編碼 328614
出版日期 內容資訊 英文 591 Pages
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指示牌 & 專業顯示器LED:全球市場的檢討與預測 2015-2020年 Signage & Professional Display LEDsGlobal Market Review & Forecast 2015-2020
出版日期: 2016年08月29日 內容資訊: 英文 591 Pages
簡介

全球指示牌 & 專業顯示器的封裝LED的消費規模2015年達到23億美元。預計消費規模2020年達到36億美元。雙列直插式封裝 (DIP) LED的消費規模年率預計增加10%以上,不過,表面黏著技術二極體 (SMD) LED,由於在指示牌 & 顯示器應用中晶片直接組裝LED (COB) 及多晶片COB LED (MCOB) 爆炸性成長,預計負成長。

本報告提供全球指示牌 & 專業顯示器的LED市場相關調查分析,各包裝類型、應用、功能及各地區的市場預測,主要企業簡介等彙整,為您概述為以下內容。

第1章 摘要整理

  • 概要
  • 沒被包裝的LED晶片 - 概要

第2章 市場預測:各包裝類型

第3章 市場預測:各指示/顯示器類型

第4章 LED:技術概要

第5章 LED、相關企業簡介 (316家)

第6章 ElectroniCast的市場調查手法

第7章 定義、標準

  • 縮寫,簡稱及一般用語
  • 照明標準及通訊協定

第8章 ElectroniCast的Excel試算表市場預測資料庫說明

  • 概要
  • 教程

附錄

  • Excel資料庫電子表格 (全球市場預測)
  • Power Point市場資料 (全球市場預測)

圖表清單

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目錄

The worldwide consumption of packaged light emitting diodes in signage and professional displays reached nearly $2.3 billion in 2015. In the year 2020, consumption is forecast to reach $3.6 billion.

The consumption value in Dual In-line Package (DIP) LEDs is forecast to increase in value at over 10 percent per year; however, Surface Mount Diode (SMD) LEDs are forecast with negative growth as Chip-On-Board LEDs (COB) and Multiple-Chip COB LEDs (MCOBs) in signage and display applications are set for explosive growth.

DIPs are single-color; however, for use in digital boards they are often placed in a LED "block" that accommodates 2 or 3 DIPs together in 1-block when installed in a sign/display board tile. SMD and COB LEDs are often multiple-chip LEDs (3-in-1 Red/Green/Blue. The multi-chip LEDs are quantified (counted) as ONE LED, not three. In 2015, SMD LEDs holds the leadership position in consumption value; however, in terms of volume (quantity), the DIP category dominates the worldwide marketplace

The use of Chip-On-Board LEDs (COB) and Multiple-Chip COB LEDs (MCOBs) in signage and display applications is relatively new. Typically, COBs are considered the next-generation LED package technology for General Lighting applications; however, COBs are (now) finding there way into LED Channel Letter and Panel/Box signage, Back Lighting Units (BLUs) for LCD display screens, as well as R&D efforts and new product introduction in the digital signage/display applications.

This study report details the use of LEDs, segmented by the following package-type:

  • Dual In-line Package (DIP)
  • Surface Mount Diode (SMD): Single/Multi-Chip
  • Chip on Board (COB)/MCOB: Single/Multi-Chip

The market forecast data are segmented by the following Applications (uses):

  • LEDs Used in Digital and Open-Face Signage/Display
  • LEDs Used in Backlit Signage/Display
  • LEDs Used in Backlighting Professional LCD Display Screens

The market forecast data are segmented by the following functions:

  • Consumption Value (US$, million)
  • Quantity (number/units: Million)
  • Average Selling Prices (ASP $, each)

The forecast for each type, in turn, is segmented into geographical region. The market data are segmented into the following geographic regions, plus a Global summary:

  • America (North America, Central and South America)
  • EMEA (Europe, Middle Eastern countries, plus Africa)
  • APAC (Asia Pacific)

Below, are four levels (or "food chain") of LEDs. For the purposes of this ElectroniCast study, we quantify and provide a market forecast for "Level 2"

  • Level 1 - The chip or die
  • Level 2 - Packaged LED Chips
  • Level 3 - LED array; sign/display module, lamps
  • Level 4 - LED sign, luminaire/fixture or display system

About ElectroniCast

ElectroniCast, founded in 1981, specializes in forecasting technology and global market trends in fiber optics communication components and devices, as well providing market data on light emitting diodes used in lighting.

As an independent consultancy we offer multi-client and custom market research studies to the world's leading companies based on comprehensive, in- depth analysis of quantitative and qualitative factors. This includes technology forecasting, markets and applications forecasting, strategic planning, competitive analysis, customer-satisfaction surveys and marketing/sales consultation. ElectroniCast, founded as a technology-based independent consulting firm, meets the information needs of the investment community, industry planners and related suppliers.

Information Base for the Market Forecast

Primary Research This market study is based on analysis of information obtained through the end of August 2016. ElectroniCast analysts performed interviews with authoritative and representative individuals in the LED lighting product manufacturing, LCD display screen manufacturing, and advertisement, mass transit and airport authorities, transportation/infrastructure, R&D, display and retail industry, government, and other. The interviews were conducted principally with:

  • Engineers, marketing personnel and management at manufacturers of LEDs (chips, components, display screens and modules, lamps and fixtures), as well as other lighting technologies.
  • Design group leaders, engineers, marketing personnel and market planners at major users and potential users of LED and other lighting.
  • Other industry experts, including those focused on standards activities, trade associations, and investments.

The interviews covered issues of technology, R&D support, pricing, contract size, reliability, documentation, installation/maintenance crafts, standards, supplier competition and other topics. Customers and distributors also were interviewed, to obtain their estimates of quantities received and average prices paid. Customer estimates of historical and expected near term future growth of their application are obtained. Their views of use of new technology products were obtained.

Analysis The analyst then considered customer expectations of near term growth in their application, plus forecasted economic payback of investment, technology trends and changes in government regulations and funding/tax-break legislation/rules in each geographical region, to derive estimated growth rates of quantity and price of each product subset in each application. These forecasted growth rates are combined with the estimated baseline data to obtain the long-range forecasts at the lowest detailed level of each product and application. In analyzing and forecasting the complexities of the regional markets for light emitting diode products, it is essential that the market research team have a good and a deep understanding of the technology and of the industry. ElectroniCast members who participated in this report are qualified.

Secondary Research A full review of published information was also performed to supplement information obtained through interviews. The following sources were reviewed:

  • Professional technical journals and papers
  • Trade press articles
  • Technical conference proceedings
  • Product literature
  • Company profile and financial information
  • Additional information based on previous ElectroniCast market studies
  • Personal knowledge of the research team.

Bottom-up Methodology ElectroniCast forecasts, as illustrated in the forecast data structure, are developed initially at the lowest detail level, then summed to successively higher levels. The background market research focuses on the amount of each type of product used in each application in the base year (2015), and the prices paid at the first transaction from the manufacturer. This forms the base year data.

ElectroniCast analysts then forecast the growth rates in component quantity use in each application, along with price trends, based on competitive, economic and technology forecast trends, and apply these to derive long term forecasts at the lowest application levels. The usage growth rate forecasts depend heavily on analysis of overall end user trends toward equipment usage and economic payback

Cross-Correlation Increases Accuracy The quantities of packaged LEDs, LED Driver ICs, LED materials/wafer/die/chips, LED Lamps and LED fixtures (luminaries) and other LED-based components, manufacturing processes/quality control/yields, and end-use products used in a particular application are interrelated. Since ElectroniCast conducts annual analysis and forecast updates in each LED component field, accurate current quantity estimates are part of the corporate database. These quantities are cross-correlated as a "sanity check".

ElectroniCast, each year since 2002, has conducted extensive research and updated their forecasts of several LED lighting categories. As technology and applications have advanced, the number of component subsets covered by the forecasts has expanded impressively. The calculation and analysis data spreadsheet technique is based upon input/output analysis, leveraging the quantitative consumption quantity, price and value of each item in each application at all levels to achieve reasonable quantitative conclusions.

Proprietary Statement

All data and other information contained in this data base are proprietary to ElectroniCast and may not be distributed or provided in either original or reproduced form to anyone outside the client's internal employee organization, without prior written permission of ElectroniCast. ElectroniCast, in addition to multiple-client programs, conducts proprietary custom studies for single clients in all areas of management planning and interest. Other independent consultants, therefore, are considered directly competitive. ElectroniCast proprietary information may not be provided to such consultants without written permission from ElectroniCast Consultants.

Table of Contents

1. Executive Summary

  • 1.1 Overview
  • 1.2 Unpackaged and Packaged LEDs - Overview

2. Market Forecast By Package-Type

3. Market Forecast By Sign/Display Type

4. Profile Briefs of LED and Related Companies

5. LEDs - Technology Overview

6. ElectroniCast Market Research Methodology

7. Definitions and Standards

  • 7.1 Acronyms, Abbreviations, and General Terms
  • 7.2 Lighting Standards and Protocols

8. ElectroniCast Market Forecast Data Base Explanation of Excel-Based Spreadsheets

  • 8.1 Overview
  • 8.2 Tutorial

Addendum

  • Excel Data Base Spreadsheets (Global Market Forecast)
    • Detailed Data: ASP ($, each); Quantity (Million); Value ($, Million) for all Regions
  • Power Point Market Data Figures (Global Market Forecast)

List of Companies Profiled

  • The following is a list of LED manufacturers (and related companies), which are profiled chapter 4.
  • Aavid Thermalloy (Nuventix Inc.)
  • A-BRIGHT
  • AbstractAVR
  • Acuity Brands Lighting, Inc. (ABL)
  • Advanced Analogic Technologies, Inc. (AATI) - Skyworks Solutions, Inc
  • Advanced illumination
  • Advanced Optoelectronic Technology, Inc.
  • Aerospace Optics (VIVISUN)
  • AESYS Incorporated
  • AIXTRON AG
  • Aldridge Electrical Industries Pty Ltd
  • Alien Energy - India
  • Allegro MicroSystems, Incorporated
  • Aluwave AB
  • American Bright Optoelectronics Corp.
  • American DJ Group of Companies (ADJ)
  • American Industrial Systems Inc (AIS) - Ennoconn and Foxconn
  • American Opto Plus LED Corp.
  • Analog Devices Incorporated (ADI)
  • Anton Bauer (Vitec Group)
  • Apple
  • Applelec Sign Components Ltd
  • Applied Materials, Incorporated
  • Arima Optoelectronics Corporation (AOC)
  • ARRI Group
  • Asia Unique LED Lighting Co., Ltd.
  • Aspen Avionics
  • Astronautics
  • Atmel Corporation
  • AUK Corporation
  • AUO
  • austriamicrosystems AG
  • Automotive Lighting Reutlingen GmbH (Magneti Marelli)
  • Avago Technologies (LSI Corporation)
  • Avidyne Corporation
  • AXT, Inc.
  • Aydin Displays (Video Display Corporation)
  • BAE Systems
  • Bajaj Electricals Limited (BEL)
  • Barco
  • Bayer AG (Covestro AG)
  • BioCare Systems
  • Bivar, Inc.
  • BluGlass
  • Bridgelux, Inc
  • Carclo Optics (Carclo PLC)
  • Carl Zeiss MicroImaging Inc.
  • Carmanah Technologies Corporation (Lightech Electronic Industries Ltd.)
  • CEMA Electric Lighting Products
  • CITIZEN ELECTRONICS Company, Limited
  • Code Mercenaries
  • Comsight Technology Company, Limited
  • Cool Lights USA
  • Cree Inc.
  • CRS Electronics Inc
  • Crystal IS Inc.
  • Cyberlux
  • Cypress Semiconductor Corporation
  • Dalian Luminglight Co., Ltd.
  • Daktronics
  • DDP Engineered LED Solutions (Data Display)
  • Dialight Solid State Lighting
  • Dialog Semiconductor
  • DiCon LED
  • Digital Lumens, Inc.
  • Digital Systems Engineering
  • dilitronics GmbH
  • Diodes Incorporated
  • Dionics Inc.
  • Dixon Tecnology
  • DOMINANT Semiconductors
  • Dowa Holdings Company, Limited
  • Dow Corning Electronics
  • Eaton Corporation plc (Cooper Lighting)
  • EcoSense Lighting
  • eldoLED B.V.
  • Energy Focus, Incorporated
  • Epistar (Formosa)
  • Epitech Technology Corporation
  • Esterline CMC Electronics
  • Eurotech (Parvus)
  • Everlight Electronics Company Limited
  • Exar Corporation
  • Excelitas Technologies Corporation
  • Fairchild Semiconductor
  • FLEx Lighting
  • Flextronics (Solectron Corporation)
  • Future Lighting Solutions
  • Gardasoft Vision Ltd (OPTEX)
  • GE Aviation
  • GE Lumination (GELCORE)
  • General Electric Company
  • Gentex Corporation
  • GlacialLight Inc
  • Global Foundries
  • Guangzhou Lovely Lighting Co., Ltd (Hong Kong Lovely Lighting Co., Ltd.)
  • Hangzhou z-light Optoelectronic Co., Ltd.
  • Harvatek International
  • Havells India Limited
  • Hella-New Zealand Limited
  • Highlink Technology Corporation (Emcore Corporation)
  • High Power Lighting Corp. (HPLighting)
  • Hitachi Cable, Limited
  • Honeywell Aerospace
  • Honeywell International Inc
  • Holectron
  • HPL Group - India
  • Hubbell Lighting Inc. / Precision-Paragon [P2]
  • IBM
  • Illumitex Incorporated
  • Independence LED Lighting
  • Infineon Technologies AG
  • Intematix Corporation
  • Intersil Corporation
  • JM Solid-State Lighting Limited (Jiuzhou Electrical Group)
  • Johnson Controls - National Energy Services (NES)
  • Kenall Manufacturing Company
  • Keselec India Private Limited (Schréder)
  • Keyence Corporation
  • Khatod Optoelectronic Srl
  • Kingbright Elec. Co., Limited
  • Kino Flo
  • KLA-Tencor Corporation
  • Koito Manufacturing Co., Limited
  • Kopin Corporation
  • Kyma Technologies
  • Kyocera Corporation
  • LedEngin, Inc.
  • LED Roadway Lighting Ltd.
  • LEDtronics
  • LEISO Lighting
  • Lextar Electronics (AU Optronics)
  • LG Innotek
  • Light-Based Technologies
  • Light Prescriptions Innovators (LPI)
  • Lighthouse Technologies
  • Lighting Science Group - LSG
  • Linear Technology
  • Lite-On Technology Corporation
  • Litepanels Broadcast Lighting Division (Vitec Videocom, Inc.)
  • Lowel-Light Manufacturing
  • LPA Excil Electronics
  • LSI Industries (Avago Technologies)
  • Lumex, Incorporated
  • Luminator USA (FoCon in Europe)
  • Luminus Devices Incorporated (Lightera/San'an Optoelectronics Co., Ltd.)
  • Lumitex, Inc.
  • Lumitron
  • Macroblock Incorporated
  • Majantys (Pleiades Group)
  • Maxim Integrated Products
  • Microchip Technology, Inc.
  • Mitsubishi Electric Corporation
  • Monolithic Power Systems, Incorporated
  • Mornsun Power
  • Nanosys
  • Nichia
  • Nitek, Incorporated
  • North American Lighting, Incorporated
  • NTL Electronics India Ltd., (NTL)
  • Nualite
  • NXP Semiconductors
  • Ocean Optics
  • Once Innovations
  • OnChip Devices
  • ON Semiconductor Corporation
  • Opto Diode Corporation (ITW Photonics Group)
  • Optomistic Products
  • OSRAM Opto Semiconductors
  • OSRAM SYLVANIA
  • Oxford Instruments
  • Oxley Group Limited
  • Panasonic Corporation (Panasonic Semiconductor Company)
  • Peterson Manufacturing Company (Piranha® brand LED lights)
  • Philips Lumileds Lighting Company
  • Philips Solid-State Lighting Solutions - Color Kinetics
  • Philips Electronics (Royal Philips Electronics)
  • Philips Teletro
  • PhosphorTech Corporation
  • Pixi Lighting LLC
  • Power Integrations
  • ProPhotonix (Stocker Yale)
  • Quantum Devices Incorporated
  • QD Vision
  • RAB Lighting Incorporated
  • RECOM Electronic GmbH
  • Revolution Lighting Technologies, Inc.
  • Renesas Electronics Corporation
  • Ricoh Company, Ltd.
  • Rockwell Collins
  • ROHM CO., LTD
  • Rosco Laboratories
  • San'an Optoelectronics Co., Ltd.
  • Safran Electronics & Defense
  • Saint-Gobain Abrasives, Incorporated
  • Samsung Electronics Co., Ltd.
  • Samudra Electronic System Pvt. Ltd. India
  • SCHOTT
  • Scrimsign Microelectronics Limited
  • Seiwa Electric Mfg Co., Limited
  • SemiLEDs
  • Semtech Corporation
  • Senslite Corporation
  • Sensor Electronic Technology, Inc. (SETI)
  • Seoul Semiconductor
  • Shandong Inspur Huaguang Lighting Co., Ltd
  • Shanghai Kepsun Optoelectronics Co., Ltd.
  • Sharp Microelectronics
  • Sheenly Corporation
  • Shenzhen Bang-Bell Electronics Company, Limited
  • Shenzhen Chip Optech Company, Limited
  • ShenZhen JingHua Optoelectronics Company Limited
  • Shenzhen Mason Technologies Co., Limited
  • Silicon Touch Technology (SiTI)
  • SloanLED
  • Solomon Systech Limited
  • Stanley Electric Co., Limited
  • Steinel
  • STMicroelectronics
  • Sumitomo Electric Industries, Limited (SEI)
  • SunLED
  • SunSun Lighting
  • Surya Roshni Limited, India
  • Switronix, Inc.
  • TD Light Sweden AB (Ahlström Capital)
  • Tekcore Co. Limited
  • Terma A/S
  • Texas Instruments Incorporated (TI)
  • Thales
  • The LED Light. Com
  • Thorn Lighting (Zumtobel Group)
  • 3M
  • TopGaN Limited
  • Toshiba Corporation
  • Toyoda Gosei Co., Limited
  • Translec Ltd
  • TT electronics Optek Technology
  • Tyco Electronics (TE Connectivity Ltd)
  • Tyntek Corporation
  • Unity Opto Technology
  • Universal Avionics
  • Universal Display Corporation (UDC)
  • UPEC Electronic Corporation
  • VarTech Systems
  • Veeco Instruments
  • VELscope
  • VIN LED Lighting (Vishal Group)
  • Vishay Intertech
  • Volpi
  • Vossloh-Schwabe Lighting Solutions GmbH & Co. KG/ Panasonic Lighting Europe GmbH
  • WAC Lighting
  • Waldmann Lighting
  • Wavien, Inc.
  • WDM Lighting
  • Xiamen Changelight
  • Xicato
  • Xilver B.V
  • ZAP grupe Ltd.
  • Zhuhai PN Power Electronic Technology Co., Ltd
  • Zylight LLC

List of Tables

  • 1.1.1 Signage & Professional Display LEDs Global Forecast, By Region ($Million)
  • 1.1.2 Signage & Professional Display LEDs Global Forecast, DIP, SMD, COB LED Package ($Million)
  • 1.1.3 Signage & Professional Display LEDs Global Forecast, DIP, SMD, COB LED Package (Quantity)
  • 1.1.4 Signage & Professional Display LEDs Global Forecast, By Digital, Letter/Box, LCD Display ($M)
  • 1.1.5 Signage & Professional Display LEDs Global Forecast, By Digital, Letter/Box, LCD Display (Qty)
  • 1.1.6 Consumer-Based Comparison - LED Displays vs. Incandescent Signs
  • 1.2.1 Typical Luminous Efficacies for Traditional and LED Sources
  • 2.1 Signage/Professional Display LEDs Global Forecast, By Package-Type (Value, Quantity, ASP)
  • 2.2 Signage/Professional Display LEDs America Forecast, By Package-Type (Value, Quantity, ASP)
  • 2.3 Signage/Professional Display LEDs EMEA Forecast, By Package-Type (Value, Quantity, ASP)
  • 2.4 Signage/Professional Display LEDs APAC Forecast, By Package-Type (Value, Quantity, ASP)
  • 3.1.1 Cost Comparison Table (Incandescent, Fluorescent, LED)
  • 3.2.1 LEDs in Digital/Open-Face Signage Global Forecast, By Package-Type (Value, Quantity, ASP)
  • 3.2.2 LEDs in Digital/Open-Face Signage America Forecast, By Package-Type (Value, Quantity, ASP)
  • 3.2.3 LEDs in Digital/Open-Face Signage EMEA Forecast, By Package-Type (Value, Quantity, ASP)
  • 3.2.4 LEDs in Digital/Open-Face Signage APAC Forecast, By Package-Type (Value, Quantity, ASP)
  • 3.3.1 LEDs in Backlit Signage/Display: Channel Letters, Box/Panel Global Forecast (Value, Qty, ASP)
  • 3.3.2 LEDs in Backlit Signage/Display: Channel Letters, Box/Panel America Forecast (Value, Qty, ASP)
  • 3.3.3 LEDs in Backlit Signage/Display: Channel Letters, Box/Panel EMEA Forecast (Value, Qty, ASP)
  • 3.3.4 LEDs in Backlit Signage/Display: Channel Letters, Box/Panel APAC Forecast (Value, Qty, ASP)
  • 3.4.1 LEDs in Backlighting Professional LCD Display Screens Global Forecast (Value, Quantity, ASP)
  • 3.4.2 LEDs in Backlighting Professional LCD Display Screens America Forecast (Value, Quantity, ASP)
  • 3.4.3 LEDs in Backlighting Professional LCD Display Screens EMEA Forecast (Value, Quantity, ASP)
  • 3.4.4 LEDs in Backlighting Professional LCD Display Screens APAC Forecast (Value, Quantity, ASP)
  • 5.1 LED Color Variety - Selected Examples
  • 5.2 LED Color Chart

List of Figures

  • 1.1.1 Dual In-line Package (DIP) LED
  • 1.1.2 Surface Mounted Device (SMD) LED
  • 1.1.3 Chip-On-Board and Multi-Chip On Board (COB/MCOB) LED
  • 1.1.4 Red/Green/Blue DIP-Type LEDs Group in Blocks within a Tile
  • 1.1.5 Churchill Downs "Big Board" Video Screen
  • 1.1.6 Outdoor Roadside Billboard LED Digital Display
  • 1.1.7 USA Map/Location of their LED-based Digital Billboards
  • 1.1.8 LED-Based Digital Advertising Board
  • 1.1.9 LED-based Building Media Facade (New York)
  • 1.1.10 Outdoors High Brightness LED Display Board
  • 1.1.11 LED Display at the Olympics in Beijing
  • 1.1.12 LED Display at the Winter Olympics in Russia (2014)
  • 1.1.13 Sub SMT Full-Color Indoor LED Display
  • 1.1.14 Transformable LED Display Screen
  • 1.1.15 LED Display - Airport (Canada)
  • 1.1.16 LED Display - Airport (France)
  • 1.1.17 Indoor LED Sign [LED Sign Moving Message Display]
  • 1.1.18 LED traffic Information Board (China)
  • 1.1.19 LED Flexible Displays: Curtain/Drapery Walls
  • 1.1.20 Flexibility of LED Soft Curtain Screen
  • 1.1.21 LED-based Flip Dot Destination Signs
  • 1.1.22 Back-Lit Signage Light LED System
  • 1.1.23 Channel Lettering LED Back-Lit Signage
  • 1.1.24 LED Back-Lit Signage
  • 1.1.25 Illuminating Signs - LED Panel Lighting Technology
  • 1.1.26 Neon Sign Technology and LED Channel Letters (Signage)
  • 1.1.27 LED Modules for Large Size Channel Letters and Light Boxes
  • 1.1.28 LED Tube Light for Backlighting Signs
  • 1.1.29 LED-Based Professional LCD Display
  • 1.1.30 Large Format Display (LFD) Monitors
  • 1.1.31 Professional LED Large Screen Display
  • 1.1.32 LED-Based Large Format Display with Premium Glass Coating
  • 1.2.1 Diagram of a typical LED chip
  • 1.2.2 Diagram of a typical LED chip
  • 1.2.3 LED Chip Cross-Sectional Structure
  • 1.2.4 Chip On Glass Cross-Sectional Structure
  • 1.2.5 ESD Protection Diodes
  • 1.2.6 Electrostatic Discharge Example
  • 1.2.7 Chip-on-Board LED Technology
  • 1.2.8 Single-die LED: 1000 lm at 100 lm/W at 3A
  • 1.2.9 Four-die LED with Primary Optics
  • 1.2.10 Example of LED Packaged Chip
  • 1.2.11 Example of LED Packaged Chip
  • 1.2.12 Example of LED Packaged Chip Surface Mount Variations
  • 1.2.13 Example of LED Packaged Chip: Flux
  • 1.2.14 Example of High Brightness LED Packaged Chip
  • 2.1 DIP LEDS Assembled Separately on a PCB
  • 2.2 DIP LEDS Assembled in Blocks on a PCB
  • 2.3 6-lead Multi-Chip Red, Green, Blue SMD LED
  • 2.4 Comparison of DIP and SMD LEDs on Display Boards
  • 2.5 Example - Use of LED Modules in Channel Letter
  • 2.6 COB LED Modules in Channel Letter Lighting
  • 2.7 Signage/Professional Display LEDs Global Forecast, By Package-Type ($Million)
  • 2.8 Signage/Professional Display LEDs Global Forecast, By Package-Type (Quantity)
  • 2.9 Signage/Professional Display LEDs Global Forecast, By Package-Type (ASP, $ Each)
  • 2.10 Signage/Professional Display LEDs America Forecast, By Package-Type ($Million)
  • 2.11 Signage/Professional Display LEDs America Forecast, By Package-Type (Quantity)
  • 2.12 Signage/Professional Display LEDs America Forecast, By Package-Type (ASP, $ Each)
  • 2.13 Signage/Professional Display LEDs EMEA Forecast, By Package-Type ($Million)
  • 2.14 Signage/Professional Display LEDs EMEA Forecast, By Package-Type (Quantity)
  • 2.15 Signage/Professional Display LEDs EMEA Forecast, By Package-Type (ASP, $ Each)
  • 2.16 Signage/Professional Display LEDs APAC Forecast, By Package-Type ($Million)
  • 2.17 Signage/Professional Display LEDs APAC Forecast, By Package-Type (Quantity)
  • 2.18 Signage/Professional Display LEDs APAC Forecast, By Package-Type (ASP, $ Each)
  • 3.1.1 Energy Cost Comparison for an Open/Closed Sign
  • 3.1.2 Energy Cost Comparison for a Red/Green Signal
  • 3.1.3 LED-Based Outdoor Digital Signage at Shopping Mall
  • 3.1.4 Direct LED Backlight LCD Display Screen
  • 3.1.5 82" Edge-Lit LED/LCD Display Screen
  • 3.1.6 120-foot Long Multi-Panel LED Display at Los Angeles Airport
  • 3.1.7 Narita International Airport Digital Signage (Japan)
  • 3.1.8 LED Digital Signage at Rail Station (Japan)
  • 3.1.9 LED Open-Face Sign
  • 3.1.10 LED Traffic Signals
  • 3.1.11 Neon versus LED Channel Letter Sign
  • 3.1.12 Neon and LED Channel Letter Sign
  • 3.1.13 Front - Lit LED Channel Letters
  • 3.1.14 Backlit LED/ Reverse Lit Channel Letters
  • 3.1.15 Backlit Led Channel Letters Illuminated Letter
  • 3.1.16 LED Backlight Panel (Light Box Panel Sign)
  • 3.1.17 LED Back Lighting For Advertising Signs
  • 4.1 PCB Assembly - China
  • 4.2 LED Backlit Display
  • 4.3 Company/Factory Photos - China
  • 4.4 LED-Based Rugged Touch Screen with NVIS Capability
  • 4.5 High Performance Materials used for Functional Parts in LED Luminaries
  • 4.6 High Power LED
  • 4.7 LED Troffer
  • 4.8 LED Lighting Military Solutions
  • 4.9 LED Lighting in Railway Station
  • 4.10 Outdoor LED Video Display
  • 4.11 4-inch x 4.7-inch Round Light/Fixture
  • 4.12 Dense Matrix LED / LED-Based Light Source
  • 4.13 Silicone Encapsulant and Silicone Lens in LEDs
  • 4.14 Silicone Products for LED Lamps
  • 4.15 Silicone Products for LED Streetlamps
  • 4.16 NVIS/LED Control Panel
  • 4.17 Integrated Weapons Delivery System
  • 4.18 LED Lighting - Aerospace
  • 4.19 Chip-On-Board (COB) LED Package
  • 4.20 Cockpit Modular Display/Panel
  • 4.21 Cockpit Large Area Display
  • 4.22 Traffic Lamp component LED
  • 4.23 High Power LED Lamp
  • 4.24 Surface Mount Type LED
  • 4.25 Surface Mount Type LED
  • 4.26 Exterior Aircraft LED Lighting
  • 4.27 LED/CCD Barcode Readers
  • 4.28 Surface-Mount Multi-layer Ceramic Packages
  • 4.29 LED Street-lighting Design
  • 4.30 LED Area Lights
  • 4.31 LED Tube Lights
  • 4.32 Driver on Board LED Module For Lighting
  • 4.33 LED Linear Optical Array
  • 4.34 Bi-Color - Next generation LED Panel
  • 4.35 Powerful Output and Photo-Quality Color LED Panel
  • 4.36 Solid-State NVIS Lamps
  • 4.37 LED-Based Stadium Display
  • 4.38 Nanostructures Designed for Different Color Emission
  • 4.39 Near UV LED
  • 4.40 Led-Based Linear Lamp - Parking Garage
  • 4.41 High Brightness LEDs (HB LED) - Undiced 4" Wafers
  • 4.42 Block Diagram for LED Lighting (Ceiling Light with Remote Control)
  • 4.43 Assorted LED Lighting Profile Devices
  • 4.44 Federal Lighting Location Requirements for Buses
  • 4.45 Assorted LED Drivers
  • 4.46 LED-Based 4W Flame Tip Filament Candelabra Dimmable
  • 4.47 LED-Based 4W Flame Tip Filament Candelabra Dimmable
  • 4.48 LED-Based Household Utility Bulb
  • 4.49 LED-Based Tube
  • 4.50 LED-Based Rotary Wing Aircraft Cockpit Display
  • 4.51 Low-Profile / Ultra-Compact Chip LEDs
  • 4.52 15-Color Lineup (LEDs)
  • 4.53 External Dimensions (LED)
  • 4.54 Maximum Ratings and Elecro-Optical Characteristics
  • 4.55 Smart Lighting Module
  • 4.56 Ambient Light Engine
  • 4.57 High Power (LED Component)
  • 4.58 Package (LED)
  • 4.59 Smart LED Bulbs (Changing Colors by Remote Control)
  • 4.60 Quality Management System in LED Manufacturing - China
  • 4.61 LED Streetlights in Use
  • 4.62 LEDs for Liquid Crystal Displays
  • 4.63 LEDs for General Lighting
  • 4.64 Glass-encapsulated Component LEDs
  • 4.65 Military and Harsh-Environment LEDs
  • 4.66 LED Street Lights
  • 5.1 Green light emission from RPCVD p-GaN layers grown on MOCVD
  • 5.2 ATEX & IECEx Certified Explosion- proof LED Light
  • 5.3 Highest-Performing Single-Die LED (XHP35 LEDs)
  • 5.4 LEDs on a Metal Core Linear Flexible Printed Circuit Board
  • 5.5 LED Chromatic Chart
  • 5.6 Evolution of Research Emphasis During Technology Life Cycle
  • 5.7 Wire-Bondable Silicon ESD Diode Chip in Gel-Packs
  • 5.8 LED Chip: Metal Layer (Thin Film Technology)
  • 5.9 AC LED Technology on a Wafer
  • 5.10 UV LED Chip Packages
  • 5.11 Fully Printed Halide Perovskite LEDs with Silver Nanowire Electrodes
  • 5.12 Ultra High Bright LED Chip
  • 5.13 LED Chip Design with Copper Alloy Thermal Conductivity
  • 5.14 LED Chip Design - Sapphire vs. Copper Alloy
  • 5.15 Ultra-Thin LED
  • 5.16 Solid-State Lighting LED
  • 5.17 LED Module with High Light Quality
  • 5.18 LED Module with Low-Profile Rectangular Shape
  • 5.19 Lumiramic Phosphor Technology: Thin Film Flip Chip (TFFC) technology
  • 5.20 Next-Generation Light Emitting Diode Module
  • 5.21 4-Leaded RGB LED
  • 5.22 Basic Structure of a Deep-UV Light-Emitting Diode
  • 5.23 Vertically Conducting Advanced LED Structure
  • 5.24 AlGaInP LED Efficacy
  • 5.25 Red Nitride Phosphors
  • 6.1 ElectroniCast Market Research & Forecasting Methodology
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