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市場調查報告書

Nokia Networks的W-CDMA/LTE多模式基頻單位「083833A.104」, FSME模式

Nokia Networks W-CDMA/LTE Multi-mode Baseband Unit, 083833A.104, Model FSME

出版商 EJL Wireless Research 商品編碼 319486
出版日期 內容資訊 英文 85 Pages
商品交期: 最快1-2個工作天內
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Nokia Networks的W-CDMA/LTE多模式基頻單位「083833A.104」, FSME模式 Nokia Networks W-CDMA/LTE Multi-mode Baseband Unit, 083833A.104, Model FSME
出版日期: 2014年11月20日 內容資訊: 英文 85 Pages
簡介

本報告提供構成Nokia Solutions Networks的Flexi eNodeB系統的一部分的FSME LTE數位基頻單位的結構相關調查、外表、方塊圖、BOM、被動元件的封裝尺寸、主動/被動元件的廠商市場佔有率等彙整資料。

摘要整理

  • 主動/被動元件:摘要
  • 重要註記

第1章 NOKIA的FLEXI MULTIRADIO BTS系統

  • Nokia的Flexi產品概要

第2章 FSME的機器分析

  • 機器分析

第3章 FPFB(FLEXI POWER DISTRIBUTION AND FUSES MODULE)

第4章 FCM子系統

第5章 FSP子系統

第6章 風扇單位

附錄A Passive case尺寸分析

附錄B 主動元件的市場佔有率分析

圖表

目錄

This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010.

Key Findings:

  • Separate sector cards for baseband processing
  • Standard DSPs for high capacity LTE user support and throughput
  • Advanced power management for ASICs, DSPs, and FPGAs

Component and semiconductor suppliers mentioned in this report include: Amphenol, AVX, Epson Toyocomm, Fairchild Semiconductor, Infineon Technologies, Molex, NXP Semiconductors, Pulse Electronics, Samsung Semiconductors, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type
  • Total Pages: 85
  • Total Tables: 16
  • Total Exhibits: 64

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: NOKIA FLEXI MULTIRADIO BTS SYSTEM

  • Overview of Nokia Flexi Product Offering

CHAPTER 2: FSME MECHANICAL ANALYSIS

  • Mechanical Analysis

CHAPTER 3: FLEXI POWER DISTRIBUTION AND FUSES MODULE (FPFB)

CHAPTER 4: FCM SUB SYSTEM

CHAPTER 5: FSP SUB SYSTEM

CHAPTER 6: FAN UNIT

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: FPFB Bill of Materials
  • Table 2: FCM PCB Top Bill of Materials
  • Table 3: FCM PCB Top Missing Component Bill of Materials
  • Table 4: FCM PCB Bottom Bill of Materials
  • Table 5: FCM PCB Bottom Missing Component Bill of Materials
  • Table 6: FCM PCB Bottom Missing Connector Bill of Materials
  • Table 7: FSP Top Bill of Materials
  • Table 8: FSP Top View Missing Component Bill of Material
  • Table 9: FSP Bottom Bill of Materials
  • Table 10: FSP Bottom Missing Component Bill of Materials
  • Table 11: FSP Bottom Missing Component, Area A Bill of Materials
  • Table 12: FSP Bottom Missing Connector Bill of Materials
  • Table 13: Passive Component Case Size Distribution by System Subsection
  • Table 14: Identified Passive Component Supplier Distribution by System Subsection
  • Table 15: Active/Passive Component Distribution by System Subsection
  • Table 16: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Nokia Flexi Macro Cell Indoor/Outdoor BTS System Cabinets, FCIA (L) and FCOA (R)
  • Exhibit 2: Flexi FSMx System Module w/Case, Front/Back Covers and External Cable Entry Covers
  • Exhibit 3: Nokia FSME System Block Diagram
  • Exhibit 4: FSME System Module Interfaces w/FPFB Power Module (L) and Transport Sub-module (R)
  • Exhibit 5: FSME Unit, Front
  • Exhibit 6: FSME Front Panel Interface Ports
  • Exhibit 7: FSME Unit, Front View
  • Exhibit 8: FSME Unit, Back View (Fan Unit Removed)
  • Exhibit 9: FSME Unit, Left Side View
  • Exhibit 10: FSME Unit, Right Side View
  • Exhibit 11: FSME Unit, Bottom View
  • Exhibit 12: FSME Unit, Top View
  • Exhibit 13: FSM Top Frame, External View
  • Exhibit 14: FSM Top Frame, Internal View w/PCBs
  • Exhibit 15: FSM Top Frame, Internal View w/o PCBs
  • Exhibit 16: FSM Bottom Shield, External View
  • Exhibit 17: FSM Bottom Frame, Internal View w/PCBs
  • Exhibit 18: FSM Bottom Frame, Internal View w/o PCBs
  • Exhibit 19: FSME System, Exploded Side View
  • Exhibit 20: FSME System, FCM+FSP Boards
  • Exhibit 21: FPFB Interface Diagram
  • Exhibit 22: FPFB Interface Panel w/Protective Covers
  • Exhibit 23: FPFB Interface Panel w/o Protective Covers
  • Exhibit 24: FPFB Top View (L) and Bottom View (R)
  • Exhibit 25: FPFB Cover, External View (L) and Internal View (R)
  • Exhibit 26: Aluminum Recycling Code
  • Exhibit 27: FPFB Internal View of Frame w/ PCB
  • Exhibit 28: FPFB Frame Internal View w/o PCB
  • Exhibit 29: FPFB Power Bus Bar Component Diagram
  • Exhibit 30: FPFB PCB Top View
  • Exhibit 31: FPFB PCB Top View Component Diagram
  • Exhibit 32: FPFB PCB Bottom View Component Diagram
  • Exhibit 33: FPFB Connector Card to System Module
  • Exhibit 34: FCM PCB Dimensions
  • Exhibit 35: FCM to FSP Connector Card Type 1
  • Exhibit 36: FCM to FSP Connector Card Type 2
  • Exhibit 37: FCM PCB Top View, Component Diagram
  • Exhibit 38: FCM PCB Top View, Areas A & B
  • Exhibit 39: FCM PCB Top View, Area A Component Diagram
  • Exhibit 40: FCM PCB Top View, Area B Component Diagram
  • Exhibit 41: FCM PCB Top View, Missing Components Diagram
  • Exhibit 42: FCM PCB Bottom View, Component Diagram
  • Exhibit 43: FCM PCB Bottom View, Missing Components Diagram
  • Exhibit 44: FCM PCB Bottom View, Missing Connector Component Diagram
  • Exhibit 45: FCM Block Diagram
  • Exhibit 46: FSP PCB Dimensions
  • Exhibit 47: FSP Top View, Component Diagram
  • Exhibit 48: FSP Top View, Missing Component Diagram
  • Exhibit 49: FSP Bottom View, Component Diagram
  • Exhibit 50: FSP Bottom View, Missing Component Diagram
  • Exhibit 51: FSP Bottom View, Missing Components, Area A
  • Exhibit 52: FSP Bottom View, Missing Connector Component Diagram
  • Exhibit 53: FSME FSP Baseband Processing Block Diagram
  • Exhibit 54: Plastic Recycling Code
  • Exhibit 55: Fan11 Unit, External View
  • Exhibit 56: Fan11 Unit, Internal View
  • Exhibit 57: Fan11 Unit, Bottom View
  • Exhibit 58: Fan11 Cable Connector Interface Plate, External View (L) and Internal View (R)
  • Exhibit 59: Passive Component Case Size Distribution
  • Exhibit 60: Identified Passive Component Market Share by Vendor
  • Exhibit 61: Active Semiconductor Component Share
  • Exhibit 62: High Pin Count IC vs. Discretes
  • Exhibit 63: Active Semiconductor Market Share by Vendor
  • Exhibit 64: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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