本報告已在2011年09月05日停止出版。
Abstract
This report explored areas of the cutting-edge laser application technology
like the following: (1) Maskless exposure equipment and direct patterning
technology development of flat display panel, equipment, and parts makers (2)
Glass Cutting, Frit Sealing, and ACF Bonding development trend using
cutting-edge laser technology (3)TFT-LCD' s Color Filter production and Panel
Repair technology trend applying laser technology (4)OLED Backplane LTPS laser
crystallization technology trend.
This report explored areas of the cutting-edge laser application technology like the following:
- Maskless exposure equipment and direct patterning technology development
of flat display panel, equipment, and parts makers
- Glass Cutting, Frit Sealing, and ACF Bonding development trend using
cutting-edge laser technology
- TFT-LCD' s Color Filter production and Panel Repair technology trend
applying laser technology
- OLED Backplane LTPS laser crystallization technology trend
- Companies are persistently attempting to cut production cost in flat panel
display market. Recently, flexible substrate was introduced to the market that
traditionally used glass substrate. This entailed request for enormous change
in manufacturing process and equipment as well.
Manufacturing process was taken a look at to find that it still uses
photolithography to operate patterning. Photolithography process uses vacuum
plating equipment to vaporize thin film composition materials to plate upon
substrate. It includes exposure and developing processes along with mask. Thin
film which is patterned through the conventional equipment, material, and
processes has complicated manufacturing process and big material loss that it
is difficult to cut down production cost. Moreover, FPD substrate is in
large-size trend to cause difficulty in large-size photomask production and
radical increase in price.
In order to resolve this issue, companies within flat panel display industry
like Samsung Electronics, LG Electronics, and foreign laser related makers are
investing in maskless exposure equipment development using laser technology
that doesn' t require photomask.
Laser exposure technology is not able to completely replace delicate
photolithography technology yet in TFT-LCD industry where delicate patterning
is required. However, it is slowly applied in flat panel display industry
based on the persistent research development accomplished so far. It is
expected to move on to entire electronic industry field including RFID, solar
cell, sensor, and memory later on.
Recently, FPD market began unlimited competition for high quality and
production cost reduction. It is in desperate need for manufacturing method
that can expand OLED backplane LTPS technology, simplify manufacturing
process, and reduce production cost. In a situation like this, technology
using laser is successfully applied in mass production process as a
replacement for conventional manufacturing process. Its application is
currently being gradually expanded to crystallization process, thin film
direct patterning, glass cutting, panel packaging, and repair fields.
Displaybank published "Advanced Laser Applications for Next-Generation FPD
Manufacturing Process" report regarding cutting-edge laser application
technology which is becoming hot issue to flat panel display industry related
companies and is actively being research-developed.
Table of Contents
1. LASER TECHNOLOGY OUTLINE
- 1.1 CHARACTERISTIC OF LASER
- 1.1.1 Definition and Characteristic of Laser
- 1.1.2 Oscillation Principle of Laser
- 1.2 ADVANCED LASER FOR FPD PRODUCTION
- 1.2.1 Semi-Conductor Laser
- 1.2.2 Solid Laser
- 1.2.3 Gas Laser
- 1.2.4 Femto second Laser
- 1.3 BASIC COMPOSITION OF FPD LASER EQUIPMENT
- 1.3.1 Laser and Optical System
- 1.3.2 Laser Synthesis System Equipment
- 1.4 APPLICATION FIELD OF ADVANCED LASER
- 1.4.1 FPD Related Laser Application
- 1.4.2 Electric/Electronic/Solar Cell Related Laser Application
- 1.5 RECENT LASER TECHNOLOGY DEVELOPMENT TREND
2. FPD MARKET TRENDS AND COST ANALYSIS
- 2.1 FPD MARKET TRENDS
- 2.1.1 TFT-LCD Market Trend
- 2.1.2 PDP Market Trend
- 2.2 MANUFACTURING COST & ASP COMPARISON OF FPD
- 2.1.1 42Inch FHD PDP vs. TFT-LCD
- 2.1.2 50Inch FHD PDP vs. 52Inch FHD TFT-LCD
3. NEXT-GENERATION FPD PROCESS USINGN LASER PATTERNING TECHNOLOGY
- 3.1 MASKLESS EXPOSURE
- 3.1.1 Polygon Mirror Based Technology
- 3.1.2 Spatial Light Modulator (SLM) Based Technology
- 3.1.2.1 DMD Based Maskless Exposure
- 3.1.2.2 GLV Based Maskless Exposure
- 3.1.3 LDW, Laser Direct Writing, Based Technology
- 3.1.4 Equipment Maker Trend
- 3.1.4.1 ASML
- 3.1.4.2 DNS, Dainippon Screen
- 3.1.4.3 Hitachi Via
- 3.1.4.4 Index Technology
- 3.1.4.5 LG Electronics/LG Display
- 3.1.4.6 Micronic Laser Systems
- 3.1.4.7 Orbotech
- 3.1.4.8 ORC Manufacturing
- 3.1.4.9 SDI/Samsung Electronics
- 3.1.4.10 Ball Semiconductor
- 3.1.5 SLM(Spatial Light Modulator) Maker Trend
- 3.1.5.1 Texas Instrument
- 3.1.5.2 Silicon Light Machines
- 3.1.5.3 Micronic Laser Systems
- 3.1.5.4 Fraunhofer IPMS
- 3.1.6 Panel Maker Trend
- 3.1.6.1 Samsung Electronics
- 3.1.6.2 LG Display
- 3.1.6.3 Samsung SDI
- 3.1.7 Patent Trend
- 3.2 LASER DIRECT PATTERNING TECHNOLOGY
- 3.2.1 ITO (Indium Tin Oxide) Direct Patterning
- 3.2.2 Laser Selective Etching for LCD and Flexible Display Production
- 3.3 LASER INDUCED METHOD FOR OLED ORGANIC FILM DIRECT PATTERNING
- 3.3.1 RIST(Radiation Induced Sublimination Transfer) Technology by KODAK
- 3.3.2 LITI(Laser Induced Thermal Imaging) Technology by Samsung SDI
- 3.3.3 LIPS (Laser Induced Pattern-wise Sublimation) Technology by SONY
- 3.4 TITLER AND ID MARKER
- 3.4.1 PDP Panel ID Marking Using UV Laser
- 3.4.2 LCD Panel Titling Using Laser Exposure Technology
- 3.4.3 High Quality Next-Generation Titler Technology
4. ADVANCED LASER APPLICATION TECHNOLOGY FOR FPD PRODUCTION
- 4.1 LASER CRYSTALLIZATION FOR LTPS (LOW TEMPERATURE POLY SILICON)
- 4.1.1 Eximer Laser Based Technology (ELA, SLS, TDX)
- 4.1.2 Solid Laser Based Technology (SELAX, Green Laser, CLC)
- 4.1.3 Semi-Conductor Laser Based Technology (dLTA: Diode Laser Thermal
Annealing)
- 4.2 LASER REPAIR TECHNOLOGY
- 4.2.1 Laser Array Repair
- 4.2.2 Laser CVD Repair (Electrode Open Repair)
- 4.3 LASER GLASS CUTTING TECHNOLOGY
- 4.3.1 Glass Cutting Technology Using CO2 Laser
- 4.3.2 Next-Generation Laser Cutting Technology Using Hybrid Method
- 4.4 LASER FRIT SEALING AND PACKAGING TECHNOLOGY
- 4.4.1 AMOLED Frit Sealing Technology Using Semi-Conductor Laser
- 4.4.2 Next-Generation FPD Packaging Technology Using Laser
5. INDEX
