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市場調查報告書
BARNES & NOBLE製平板PC「NOOK Color」構造・成本分析（逆向工程分析）
[Reverse Engineering Analysis] BARNES&NOBLE Tablet PC NOOK Color (BNRV200) Structure and Cost Analysis
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BARNES & NOBLE製平板PC「NOOK Color」構造・成本分析（逆向工程分析） 是由出版商DisplayBank在2011年07月所出版的。
這份英文市場調查報告書價格從美金4000起跳。
本報告書為BARNES & NOBLE的平板PC「NOOK Color」相關的逆向工程分析、主要零件的詳細、利用技術概要、成本推計値等相關分析，其結果概述如下。
第1章 概要
- 產品背景
- 產品分類
- 規格比較
- Nook系列内的規格比較
- 產品概念
- 總綱・摘要
第2章 逆向工程
- 包裝盒
- 外蓋
- 前蓋零件之特徵與規格
- 背蓋・側蓋
- 背蓋分解
- 中蓋框架分解
- 電池
- 中蓋框架零件
- 主板
- 主板分解
- 印刷電路板(PCB)上部・下部零件之特徵與規格
- CPU規格比較
- CPU區塊圖
- CPU平台
- 主要IC規格：無線LAN、記憶體、MEMS
- 主要IC規格：音訊、LVDS（低電壓作動進行）、PMIC（電源管理用積體電路）
- 觸控螢幕面板
- 顯示器・模組
- LCD（液晶顯示器）的分解
- LCD面板零件
- 規格比較
- BLU（背光單元）之特徵
- LED棒／包裝
- 零件清單
第3章 技術的問題
- 觸控螢幕面板(TSP)之傾向
- 依TSP基本的構造與驅動方式之分類
- TSP積載構造之比較
- TPK的供應鏈
- CPU傾向
- LG Display(LGD)製LCD面板
第4章 成本推計
第5章 附錄
- BARNES & NOBLE NOOK Color圖像
Abstract
Displaybank, based on its research capability on display industry, offer Reverse Engineering reports on issued products in order to provide technical advantage analysis of leading maker and point out benchmarking point.
Reverse Engineering reports from Displaybank outlines technology, cost, supply chain and profitability analysis and targeted products expand from display-based to IT products as well. Table of Contents
1. Overview
- 1.1. Product Background
- 1.1.1. Product Category
- 1.1.2. Spec. Comparison
- 1.1.3. Nook Series Spec. Comparison
- 1.1.4. Product Concept
- 1.2. Executive Summary
- 1.2.1. Technology Review
- 1.2.2. Cost/Supply Chain
2. Reverse Engineering
- 2.1. Package Box
- 2.1.1. Box Design
- 2.1.2. Box Opening Process
- 2.2. Covers
- 2.2.1. Front Cover Components Features and Specifications
- 2.2.2. Back/Side Cover
- 2.2.3. Back Cover Disassembling
- 2.2.4. Middle Cover Frame Disassembling
- 2.2.5. Battery
- 2.2.6. Middle Cover Frame Components
- 2.3. Main Board
- 2.3.1. Main Board Disassembling
- 2.3.2. PCB Top/Bottom Components Features and Specifications
- 2.3.3. CPU Specification Comparison
- 2.3.4. CPU Block diagram
- 2.3.5. CPU platform
- 2.3.6. Major IC Specification_WLAN, MEMORY, MEMS
- 2.3.7. Major IC Specification_Audio, LVDS, PMIC
- 2.4. Touch Screen Panel
- 2.4.1. Front Cover Disassembling
- 2.4.2. Touch Screen Pattern Structure
- 2.4.3. Touch Board
- 2.5. Display Module
- 2.5.1. LCD Disassembling
- 2.5.2. LCD Panel Components
- 2.5.3. Spec. Comparison
- 2.5.4. Characteristic of BLU
- 2.5.5. LED Bar/Package
- 2.6. Component List
3. Technical Issue
- 3.1. TSP Trend
- 3.1.1. TSP Basic Structure and Classification by Driven Method
- 3.1.2. TSP Stacked Structure Comparison
- 3.1.3. TPK Supply Chain
- 3.2. CPU Trend
- 3.2.1. ARM Core
- 3.2.2. TI CPU Family
- 3.3. LGD LCD Panel
- 3.2.1. LGD LCD Panel PRM
- 3.2.2. LCD Cell structure Comparison
4. Cost Estimation
- 4.1. Net Material Cost Estimation
- 4.1.1. Total Material Cost
- 4.2. Profit Estimation
- 4.2.1. Display & Touch Screen Panel
- 4.2.2. Set Profit Estimation
- 4.3. Major Supplier
- 4.3.1. Total Supply Chain Map
5. Appendix
- 5.1. BARNES&NOBLE nookcolor Image
- 5.1.1. Mechanical Part
- 5.1.2. Circuit Part
- 5.1.3. Display Part
- 5.1.4. Major Parts
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