Abstract
LED (Light Emitting Diode), basically, is the device emitting light by the
combination of electrons and holes nearby P-N junction or in active layer
through flowing electric current to compound semiconductor terminal.
White LED is being commercialized such as BLU for large LCD
(TV/monitor/laptop), automotive headlamp, general lighting, etc. and its use
has been increasing gradually.
It is anticipated that many of the light sources will be replaced by white
light source using LED, which is more eco-friendly and last longer since it
does not use mercury, in the future.
Accordingly, assuming that LED replaces many of the conventional light
sources, social and economic impact will be very huge.
LED industry is radically growing since 2008, also related industries, related
components/material industries are growing explosively.
LED is becoming a gigantic industry leading many industries, now an item
called ‘LED’ has become the trend uniting the words such as
design/efficiency/energy/next generation and so forth, thus the trend that LED
itself takes a big role in the proportion of product is tremendously
increasing.
Chart 1. Annual Price Trend of Epoxy Resin
Based on these facts, we identified sequential cost structure and analyzed
business trend of core sub-materials and price trend, from the basic structure
of LED and manufacturing process in this report.
Chart 2. Cost Structure of 505 SMD Package
It is judged that this report will be very helpful to the companies of
substrate for LED, Epi/Chi related, package, the companies interested in LED
business newly, also to all the companies related to LED business.
Table of Contents
0. Introduction
- 0.1. Report Overview
- 0.2. Search Method
- 0.3. Search Scope and Definition
1. LED Basic Structure and Manufacturing Process
- 1.1. Overview
- 1.2. Substrate Single-Crystal
- 1.2.1. Type Features and Comparison of Advantage/Disadvantage
- 1.2.2. Sapphire
- 1.2.3. SiC
- 1.2.4. GaN
- 1.3. Epi-Wafer
- 1.3.1. Overview
- 1.3.2. Basic Process - Blue LED
- 1.3.3. Basic Structure - Blue LED
- 1.3.4. Basic Structure - Blue LED
- 1.4. Chip
- 1.4.1. Overview
- 1.4.2. Main Process - Front-end
- 1.4.3. Main Process - Back-end
- 1.4.4. Vertical LED
- 1.4.5. Main Process - ROY Chip
- 1.5. Package
- 1.5.1. Overview
- 1.5.2. PCB Substrate Package
- 1.5.3. Lead Frame Package
- 1.5.4. Middle Power Package
- 1.5.5. W Class Power Package
2. LED Cost Structure
- 2.1. Main Material and Component Configuration
- 2.1.1. Substrate
- 2.1.2. Epi-Wafer
- 2.1.3. Chip
- 2.1.4. Package
- 2.2. Chip
- 2.2.1. 250*250 Chip
- 2.2.2. 350*350 Chip
- 2.2.3. 250*600 Chip
- 2.2.4. 500*500 Chip
- 2.2.5. 600*600 Chip
- 2.2.6. 1000*1000 Chip
- 2.3. Package
- 2.3.1. 1608 SMD Package
- 2.3.2. 3528 SMD Package
- 2.3.3. 5050 SMD Package
- 2.3.4. 0.5W Class SMD Package
- 2.3.5. 1W Class Power Package
3. LED Core Sub-Material Industry Trend
- 3.1.Ingot/Substrate
- 3.1.1. Overview - Ingot
- 3.1.2. Overview - Substrate
- 3.1.3. Sapphire Ingot/Substrate Roadmap
- 3.1.4. Sapphire Ingot Price Trend
- 3.1.5. Sapphire Substrate Price Trend
- 3.2. Epi-Wafer/Chip
- 3.2.1. Overview
- 3.2.2. Epi-Wafer Price Trend
- 3.2.3. Chip Price Trend
- 3.3. Frame
- 3.3.1. Overview
- 3.3.2. PCB
- 3.3.3. PCB Substrate Price Trend
- 3.3.4. Lead Frame
- 3.3.5. Lead Frame Substrate Price Trend
- 3.3.6. Ceramics
- 3.3.7. Ceramics Substrate Price Trend
- 3.3.8. WLP (Wafer Level Package)
- 3.3.9. WLP Substrate Price Trend
- 3.4. Molding Material (EMC)
- 3.4.1. Overview
- 3.4.2. Epoxy Resin
- 3.4.3. Epoxy Resin Price Trend
- 3.4.4. Silicone Resin
- 3.4.5. Silicone Resin Price Trend
- 3.5. Phosphor
- 3.5.1. Overview
- 3.5.2. Type Features
- 3.5.3. Phosphor Price Trend
Appendix. LED Value Chain
- A. W/W LED Companies
- B. Korean LED Companies
- C. Taiwanese LED Companies
- D. W/W Main LED Sub-Material Companies
