LED及LED應用產品散熱技術分析 是由出版商DisplayBank在2010年05月所出版的。
這份英文市場調查報告書價格從美金5500起跳。
本報告為，調查LED散熱技術基本概要，並分析元件、應用別散熱技術，以下列摘要形式闡述。
簡介
第1章 散熱技術基本概要
第2章 散熱理論
第3章 散熱技術：元件別
- LED晶片、包裝散熱技術
- 機板層級散熱技術
- 系統層級散熱技術
第4章 散熱技術：應用別
附錄
Abstract
The “LED & LED Applied Product Heat Dissipation Technology
Analysis” report discusses the basic overview of LED dissipation
technology and analyzes heat dissipation theory, and heat dissipation
technology by component and application in-depth. This report intends to
assist LED substrate, epi and chip related companies, package makers,
companies with interests in new LED business, and companies that belong to all
LED related fields.
Report Highlights
- In-depth analysis of LED module' s basic structure, LED thermal property,
and LED heat dissipation technology
- Detailed description of LED' s representative heat dissipation theory (heat
resistance theory) and evaluation method of the theory
- Summary of LED Chip and Package heat dissipation technology, Board Level
heat dissipation technology, and System Level heat dissipation technology
- Analysis of heat dissipation technology employed in LED BLU, general
lighting, and car lighting
LED (Light Emitting Diode) basically is a device which emits lights through a
bonding of an electron and a hole either in an active layer or near P-N
conjugation by spilling electric currents in a compound semiconductor
terminal. The white LED usage gradually expands to large LCD
(TV/Monitor/NotePC), BLU, car headlamp, and general lighting.
However, the LED, which requires applications of current and voltage, tends to
consume the applied power (current * voltage) as heat. The higher the power
applied in LED device is, the higher the heat generated from the device. In
other words, the higher power may be consumed if a LED product can generate
more heat. This is a significant competitiveness of LED product application.
Therefore, makers use materials that release heat well compared to the
material cost and realize product' s structure and shape to discharge heat
well. In particular, the LED, which consumes over 70% of applied power as heat
and some in light, may increase the efficiency of light consumption if it has
a structure that effectively releases heat.
In other words, how well the heat generated from the internal device of LED is
released to outside becomes one of the most important factor together with
basic electrical and optical properties.
Table of Contents
0. Introduction
- 0.1. Report Overview
- 0.2. Research Methodology
- 0.3. Research Scope and Terms
1. Basic Overview of Heat Dissipation Technology
- 1.1. Basic Structure of LED Module
- 1.1.1. Overall Structure of LED Module
- 1.1.2. LED Chip Structure
- 1.1.3. LED Package Structure
- 1.1.4. Metal PCB Structure
- 1.1.5. TIM (Thermal Interface Material) and Heat Sink Structure
- 1.2. LED Thermal Properties
- 1.2.1. Energy Conversion Property
- 1.2.2. Junction Temperature
- 1.2.3. Light Output and Heat Dissipation
- 1.2.4. Effect of Heat on the LED Lifetime
- 1.3. LED Heat Dissipation
- 1.3.1. What is LED Heat Dissipation?
- 1.3.2. Heat Delivery Mechanism and LED Heat Dissipation
- 1.3.3. Heat Resistance in LED Module/System
- 1.3.4. LED Heat Dissipation Technology by Level
- 1.3.5. Thermal Conductivity of LED Heat Dissipation Material
- 1.3.6. CTE of LED Heat Dissipation Material
- 1.3.7. Heat Emissivity of LED Heat Dissipation Material
2. Heat Dissipation Theory
- 2.1. Overview
- 2.2. Heat Resistance Theory
- 2.2.1. Electric Resistance and Heat Resistance
- 2.2.2. Type of Heat Resistance
- 2.2.3. Power Dissipation
- 2.2.4. Junction Temperature Estimation
- 2.2.5. Heat Resistance of LED
- 2.3. Heat Resistance Evaluation Method
- 2.3.1. Junction Temperature Measurement
- 2.3.2. Heat Resistance Measurement
- 2.3.3. Thermal Status
- 2.3.4. Environment of Heat Resistance Measurement
- 2.3.5. Other Heat Dissipation Evaluation Method
3. Heat Dissipation Technology by Component
- 3.1. LED Chip and Package Heat Dissipation Technology
- 3.1.1. Chip Heat Dissipation Technology
- 3.1.2. L/F (Lead Frame) Type Plastic Package
- 3.1.3. High Output L/F (Lead Frame) Type Package Analysis
- 3.1.4. Large LED BLU-Use Plastic LED Package Analysis
- 3.1.5. Layer Stacking Ceramic Package
- 3.1.6. Ceramic Substrate Wafer Level Package (WLP)
- 3.1.7. Silicon Substrate Wafer Level Package (WLP)
- 3.1.8. Metal Package
- 3.1.9. Chip on Board (COB) Package
- 3.1.10. Chip on Aluminum (COA)
- 3.1.11. Heat Dissipation Effect of Sub Mount
- 3.1.12. Die Bonding and Heat Dissipation
- 3.2. Board Level Dissipation Technology
- 3.2.1. Concept and Composition of Metal PCB
- 3.2.2. FR-4 PCBs for LED
- 3.2.3. Flexible High Heat Dissipation PCB
- 3.2.4. Development Direction of High Heat Dissipation Metal PCB
- 3.2.5. Development of High Heat Dissipation Insulator
- 3.3. System Level Heat Dissipation Technology
- 3.3.1. Thermal Interface Material (TIM)
- 3.3.2. Heat Sink Technology
- 3.3.3. Heat Sink Surface Coating
- 3.3.4. New Heat Sink Material
- 3.3.5. Heat Pipe & Active Cooling
- 3.3.6. Heat Sink PCB, COH (Chip on Heat Sink)
4. Heat Dissipation Technology by Application
- 4.1. Overview
- 4.2. Display-Use LED BLU
- 4.2.1. TV/Monitor
- 4.2.2. Car Navigation
- 4.2.3. Outdoor LED Signboard
- 4.3. General Lighting
- 4.4. Car Lighting
INDEX
