技術分析：LED之製造過程、設備、副材料 是由出版商DisplayBank在2010年04月所出版的。
這份英文市場調查報告書價格從美金5500起跳。
本報告為，分析LED之製造過程、設備、副材料，並匯整LED產業之供應鏈及主要參與市場企業清單，以下列摘要形式闡述。
簡介
第1章 LED之製造過程
- 概要
- 基板晶體之製造過程
- 磊晶片
- 概要
- LED晶體發展技術之比較
- LED發展技術之細節
- 藍光LED
- 紅光LED
- IR（紅外線）LED
- 晶片
- LED晶片結構
- 藍色LED晶片
- 紅色LED晶片
- 單元過程
- 封裝
- PCB基板封裝
- 鉛線架封裝
- 中功率封裝
- 高功率封裝
第2章 LED設備
第3章 LED副材料
附錄
Abstract
Description
Report Composition and Highlights:
- LED Manufacturing Process
- LED Manufacturing Process Overview & Substrate Crystal Manufacturing
Process
- Epi-Wafer Manufacturing Process and Epi Growth Technology
- Chip Manufacturing Process & in-Depth Analysis of Package Manufacturing
Process
- LED Equipment
- Coverage in Epi Growth Equipment by Each Maker
- Detailed Coverage in Technology & Characteristics for Chip Manufacturing
Process Equipment and Package Manufacturing Equipment
- LED Sub-Material
- Epoxy and Silicon Resin Technology used for Molding Material in LED
Package
- PCB Substrate, Lead Frame Substrate, Ceramic Substrate and WLP
Technology that Mainly Compose Substrate
- Characteristics and Technical Issues by Phosphor Type
Supply Chain for LED Industry & Major Company List are Included:
- Number of Pages : 140 page
- Published on April 2010
Light Emitting Diode, or LED for short, is essentially a device that passes
electrical current through compound semiconductor terminals to induce bond at
the P-N junction or the active layer and emit light through the combination of
electrons and holes. Especially White LEDs are applied to backlight for
large-sized LCD display, automotive lighting and general lighting and the
application fields are gradually being widened.
The white light source applying LED is mercury-free and therefore
environmentally friendly. Being a solid device, white LED lighting is highly
durable. It' s likely that white LED will replace all incandescent and
fluorescent lighting in the future. This is what makes the socioeconomic
impact of white LED lighting that much more significant.
LEDs are already show high penetration into BLU / Automotive / Scenic lighting
that real-life applications that utilize LED light source gather much
attention. Above and beyond the effect of amplifying its designable concept,
LED has become commercial goods itself.
To this end, Displaybank aims to provide an exhaustive analysis on individual
manufacturing process, equipment, substrate, and mainstream sub-material
technologies for Epi, Chip, and Package, the three stages of LED product
manufacturing.
The “Technology Analysis: LED Manufacturing Process, Equipment &
Sub-Material” offers extensive analysis on LED manufacturing process
/ equipment / sub-material that will become the center of luminous source in
near future to benefit LED epi, chip and package makers, companies that are
interested in new LED businesses and all makers/suppliers located in LED
supply chain.
Table of Contents
0. Introduction
- 0.1. Report Overview
- 0.2. Research Methodology
1. LED Manufacturing Process
- 1.1 Overview
- 1.2 Substrate Crystal Manufacturing Process
- 1.2.1 Comparison of Characteristics by Substrate
- 1.2.2 GaN-based Substrate
- 1.2.3 GaAs-based Substrate
- 1.3 Epi-Wafer
- 1.3.1 Overview
- 1.3.2 Comparison of LED Epitaxial Growth Technologies
- 1.3.3 Details of LED Growth Technologies
- 1.3.4 Blue LED
- 1.3.5 Red LED
- 1.3.6 IR(InfraRed) LED
- 1.4 Chip
- 1.4.1 LED Chip Structure
- 1.4.2 Blue Chip Process
- 1.4.3 Red Chip Process
- 1.4.4 Details of Unit Processes
- 1.5. Package
- 1.5.1 PCB Substrate Package
- 1.5.2 Lead Frame Package
- 1.5.3 Middle Power Package
- 1.5.4 High Power Package
2. LED Equipments
- 2.1 Epitaxial Growth Equipments
- 2.1.1 Aixtron / Thomas Swan
- 2.1.2 Veeco
- 2.2 Chip Manufacturing Equipments
- 2.2.1 Mask Aligner
- 2.2.2 E-Beam Evaporator
- 2.2.3 ICP-RIE (Inductively Coupled Plasma Reactive Ion Etcher)
- 2.2.4 PECVD (Plasma Enhanced Chemical Vapor Deposition)
- 2.2.5 RIE (Reactive Ion Etcher)
- 2.2.6 Plasma Asher
- 2.3 Package Manufacturing Equipments
- 2.3.1 Die Bonder
- 2.3.2 Wire Bonder
- 2.3.3 Transfer Mold Machine
- 2.3.4 Saw Machine
- 2.3.5 Tester & Handler
- 2.3.6 Taping Machine
3. LED Subsidiary Materials
- 3.1 Molding Materials
- 3.1.1 Epoxy
- 3.1.2 Silicon
- 3.2 Package Substrate (Frame)
- 3.2.1 PCB
- 3.2.2 Lead Frame
- 3.2.3 Ceramic
- 3.2.4 WLP
- 3.3 Phosphor
- 3.3.1 Principles of Light Emission
- 3.3.2 Light Emitting Characteristics and Features of Detergent
- 3.3.3 Synthetic Technologies
- 3.3.4 LED-use Phosphor Characteristics by Type
Appendix. LED Value Chain
- A. W/W LED Enterprises
- B. Korean LED Enterprises
- C. Taiwan LED Enterprises
- D. W/W Ingot/Substrate Enterprises
- E. W/W Major LED Subsidiary Material Enterprises
- F. W/W Major LED Package Equipment Enterprises
