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市場調查報告書

DC-DC轉換器IC:電力系統封裝,全球技術趨勢,預測,競爭環境(第1版)

DC-DC Converter ICs: Power System in Package, Worldwide Technology Trends, Forecasts and Competitive Environment, First Edition

出版商 Darnell Group, Inc.
出版日期 2011年11月 商品編碼 223413
內容資訊 英文 77 Pages
價格
US $ 3100 PDF By E-mail (Multi-user corporate license)


DC-DC轉換器IC:電力系統封裝,全球技術趨勢,預測,競爭環境(第1版) 是由出版商Darnell Group, Inc.在2011年11月所出版的。 這份英文市場調查報告書包含77 Pages 價格從美金3100起跳。

簡介

本報告提供全球電力系統封裝(PSiP)所涵蓋的市場,推動市場成長要素和系統製造商需求趨勢,IC的開發和封裝技術的趨勢,材料領域的課題,各種用途領域的需求,全球市場預測等資訊,競爭的主要企業的簡介,為您概述為以下內容。

簡介

定義與普及推動因素

  • 系統製造商需求特性
  • IC的開發與封裝技術的趨勢
    • 3D IC封裝/堆積式封裝解決方案
    • 功能整合與零件整合
    • 高壓CMOS技術
    • 內裝式電池
  • 材料領域的課題
    • PSiP和Power-Supply-on-Chip(PwrSoC)

各種用途領域的需求特性

  • FPGA
  • 高頻(RF)傳送器
  • 記憶體終端電源(VTT)
  • 環保發電

全球PSiP市場預測

  • 預測的前提條件
  • 普及推動因素與課題
  • PSiP,PwrSoC,非絕緣模組的價格和性能
  • 輸出電流預測
  • 輸入電壓預測
  • 不同用途促進成長的要素與預測

商業方面的動向

競爭企業各公司概況

  • Analog Devices
  • Cymbet Corp.
  • Efficient Power Conversion(EPC)
  • Enpirion
  • Infineon
  • Infinite Power Solutions
  • Intel
  • Linear Technology
  • National Semiconductor
  • NXP Semiconductors
  • Rohm
  • Texas Instruments
  • 羅徹斯特大學
  • Vicor
  • Volterra

附錄A:第2次International Workshop on Power Supply on Chip的報告

圖表

目錄

Abstract

This report provides a detailed and quantitative analysis of the global market for Power Sistem in Package (PSiP) dc-dc converter modules. In many instances, unit sales, dollar sales and pricing trends are discussed. See the listing of Figures for a complete description of the Tables included in this unique and extensive analysis.

Topics covered include:

  • Definitions and Factors Driving Adoption
  • System Maker Demand Characteristics
  • IC Developments and Packaging Trends
  • Materials Challenges
  • Application Demand Characteristics
  • Worldwide PSiP Forecasts
  • Commercial Development
  • Competitive Overview

Table of Contents

Introduction

Definitions and Factors Driving Adoption

  • System Maker Demand Characteristics
  • IC Developments and Packaging Trends
    • 3D IC Packaging/Stacked Solutions
    • Functional Integration versus Component Integration
    • High-Voltage CMOS Technology
    • Embedded Batteries
  • Materials Challenges
    • Integrating Magnetics in PSiPs and PwrSoCs

Application Demand Characteristics

  • FPGAs
  • Radio Frequency (RF) Transmitters
  • Memory Termination Supply (VTT)
  • Energy Harvesting

Worldwide PSiP Forecasts

  • Forecast Assumptions
  • Market Adoption Drivers and Challenges
  • PSiP, PwrSoC and Non-Isolated Module Price/Performance
  • Output Current Forecasts
  • Input Voltage Forecasts
  • Application Drivers and Forecasts

Commercial Development

Competitive Overview

  • Analog Devices
  • Cymbet Corp.
  • Efficient Power Conversion (EPC)
  • Enpirion
  • Infineon
  • Infinite Power Solutions
  • Intel 6
  • Linear Technology
  • National Semiconductor
  • NXP Semiconductors
  • ROHM
  • Texas Instruments
  • University of Rochester
  • Vicor
  • Volterra

Appendix A: Report From the Second International Workshop on Power Supply on Chip

TABLES

  • Table 1 - PSiP Companies, Selected Applications and Enablers
  • Table 2 - Worldwide PSiP Market, by Output Current (millions of units)
  • Table 3 - Worldwide PSiP Market, by Output Current (millions of $)
  • Table 4 - Worldwide PSiP Market, by Output Current ($/unit)
  • Table 5 - Worldwide PSiP Market, by Input Voltage (millions of units)
  • Table 6 - Worldwide PSiP Market, by Input Voltage (millions of $)
  • Table 7 - Worldwide PSiP Market, by Input Voltage ($/unit)
  • Table 8 - Worldwide PSiP Market, by Application (millions of units)
  • Table 9 - Worldwide PSiP Market, by Application (millions of $)
  • Table 10 - Worldwide PSiP Market, by Application ($/unit)
  • Table 11 - Worldwide PSiP Market, by Application and Output Current (millions of units)
  • Table 12 - Worldwide PSiP Market, by Application and Input Voltage (millions of units)

FIGURES

  • Figure 1 - Linear Technology μModule
  • Figure 2 - 2011: POL Regulators in Server Systems
  • Figure 3 - 2012-2015: POL Regulators for Servers
  • Figure 4 - Beyond 2015: Integrated Regulators in a Processor Package
  • Figure 5 - Cross-section of a Device Using a PowerStack Package
  • Figure 6 - EnerChip Die in System-in-Package
  • Figure 7 - Cross-Section Diagram of isoPower Transformer
  • Figure 8 - Photograph of isoPower Transformer
  • Figure 9 - Bond Wire Inductor
  • Figure 10 - Low Temperature Co-fired Ceramic DC-DC Converter Prototype
  • Figure 11 - Micro-Inductor Structure
  • Figure 12 - Normalized Pricing for Point-of-Load Converters
  • Figure 13 - Price Differentials Between High-Performance PSiP Products and Equivalent " Generic" Products, by Amperage Segment (2011 and 2016)
  • Figure 14 - Worldwide PSiP Market, by Output Current (millions of units)
  • Figure 15 - Worldwide PSiP Market, by Output Current (unit market share)
  • Figure 16 - Worldwide PSiP Market, by Output Current (millions of $)
  • Figure 17 - Worldwide PSiP Market, by Input Voltage (millions of units)
  • Figure 18 - Worldwide PSiP Market, by Input Voltage (unit market share)
  • Figure 19 - Worldwide PSiP Market, by Input Voltage (millions of $)
  • Figure 20 - Worldwide PSiP Market, by Application (millions of units)
  • Figure 21 - Worldwide PSiP Market, by Application (unit market share)
  • Figure 22 - Worldwide PSiP Market, by Application (millions of $)
  • Figure 23 - Worldwide PSiP Market, Application Growth Rates - 2011 & 2016 (units and dollars
  • Figure 24 - Worldwide PSiP Market, by Application and Output Current (millions of units)
  • Figure 25 - Worldwide PSiP Market, by Application and Input Voltage (millions of units)
  • Figure 26 - EnerChip Bare Die Attachment Mechanisms
  • Figure 27 - Enpirion Power-System-on-Chip
  • Figure 28 - Texas Instruments TPS82671 System-in-Package Regulator, Embedded DC-DC Converter IC

Press Release

DC-DC轉換器PSiP (電力系統套裝)市場的分析

2011年11月28日

Global Information, Inc.已開始銷售Darnell Group, Inc.所發行的報告書「DC-DC Converter ICs: Power System in Package, Worldwide Technology Trends, Forecasts and Competitive Environment, First Edition (DC-DC轉換器IC:電力系統封裝,全球技術趨勢,預測,競爭環境(第1版))」

Darnell Group的本報告書分析PSiP (電力系統套裝)的全球市場。PSiP產品侵蝕DC-DC轉換器IC市場,今後5年有可能替換以往的解決方案。

預測全球PSiP市場將從2011年約6,500萬美元規模,以複合年成長率(CAGR)34.4%擴大,2016年時達到2億8,400萬美元。

在PSiP產品製造企業作為標的之全部應用部門,預測將有高成長率。

上級分析家Linnea Brush敘述:「支援PSiP、PCiPso及SwrSoC設計實現的技術創新,對原有的DC-DC電力轉換器IC和組件,亦以各種水平影響許多功能。預測PSiP及PCiP (最後是PwrSoC)將改變LDO、開關式穩壓器及控制器/FET。」。

「最高的市場機會在通信及電腦部門。預測從2011年開始到2016年,這些部門的銷售數以複合年成長率,從35%增加到50%之間。收益面的CAGR,預計同時期約從23%變成38%。產業用應用亦將大幅成長,銷售數約55%,收益則有44%的成長率。」

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