Abstract
Although driven by obvious factors such as cost and efficiency, the real
changes occurring in the dc-dc converter module and IC market are at the power
architecture and advanced materials levels. The emergence of the Dynamic Bus
Architecture (DBA) is, in fact, one of the most significant developments in
the power supply industry in 10 years. The DBA is already being designed into
some high-end systems, and widespread adoption is expected in the next few
years.
System makers are demanding more efficient products in smaller footprints at
what is called “cost neutrality” levels. But the broad variety of
applications across many diverse industries is allowing the dc-dc converter
market to thrive in both traditional and niche segments. On-board solutions
are eating away at the module market, yet “the brick is not dead,”
according to many power supply manufacturers.
The reason both types of products will thrive is that power architectures are
evolving beyond the classic distributed power model, adapting to system
makers' need for multiple voltage rails at lower voltages. Also, newer
applications such as light-emitting diodes (LEDs) and dc building power
require advanced components and materials to address unique operating
environments. Yet many traditional applications remain, such as industrial and
transportation, that simply need proven, reliable products.
Underlying these trends are new packaging designs with increased integration.
Smaller packages mean more thermal issues, and companies are looking at ways
to improve efficiency while managing heat dissipation. The challenge for dc-dc
converter module makers is how the Intermediate Bus Architecture is evolving:
customers are demanding more efficiency, as well as configurability and
optimization. This has led to a “Dynamic Bus Architecture,” which
consists of board-mounted dc-dc converters or point-of-load (POL) regulators
that communicate with a centralized power system host control via a digital
communications bus. The firmware is partly reconfigurable to specific
applications, with “energy optimization algorithms” built in.
Most of the distributed power architectures being implemented today, and
certainly future systems, include some form of digital power management and
control. Digital power management has become a “given” in many
systems, especially computer and communications applications. “Power
supply designers” are becoming “system designers,” and many
of them also utilize digital control techniques when appropriate, rather than
analog. The evolution of the Intermediate Bus Architecture (IBA) - from the
Central Control Architecture (CCA) to the emerging Dynamic Bus Architecture
(DBA) - is in part due to system demands that digital power management can
address effectively.
The DBA makes use of a Digital Bus Converter (DBC), which is able to
dynamically optimize its intrinsic efficiency, along with overall system
efficiency, and can be controlled and monitored. In addition, the emergence of
the DBC threatens to obsolete all of today' s analog bus converter products,
including unregulated, semi-regulated and even regulated devices.
With global economies slowly recovering from the recession, companies are
looking to keep costs low and optimize the equipment they already have. This
means increasing efficiency across all application areas. Advanced materials,
such as Silicon-carbide (SiC) and Gallium-nitride (GaN), are slowly becoming
more cost-effective in applications with high temperature and high power
requirements (SiC) or high-performance Information and Communication
Technology (ICT) applications (GaN). As costs come down, these materials are
likely to improve converter efficiencies and enable higher operating
frequencies and smaller converter sizes.
As components and power architectures evolve, some new approaches could
redefine the power supply landscape. The use of “on-chip” power
supplies, for instance, includes the distribution of power in high-speed,
high-complexity integrated circuits with power levels exceeding many tens of
watts and power supplies below a volt. Intel has made gains with thin-film
on-die magnetics that could speed mainstream adoption of this type of product.
Power Supply on Chip (PwrSoC) is also making steady progress in the research
and development area, although this technology is still several years away
from commercialization.
Opportunities in the “Smart Grid” are still being defined, but
most companies see smart meters as the “first step” in these
applications. Some IC companies believe their product line is broad enough to
encompass any smart-grid-related application, while other companies are
adopting a “wait and see” attitude in terms of what will be
successful.
Another trend that fits nicely with the Smart Grid concept is dc distribution
in buildings, which is being embraced by utilities, where intelligent control
allows communication with the utility. Dc power supports energy efficiency,
“green” technologies, and building automation and control.
Interest in dc building power is not new, but mainstream deployment has been
elusive except in the telecommunications world. The energy demands of data
centers renewed interest in dc powering, but the problems with batteries and
legacy ac systems made such considerations daunting, particularly in North
America and Europe.
“Dc-powered buildings” goes beyond data centers, however. The
EMerge Alliance is an open industry association focused on low-voltage dc
power distribution and its use in commercial interiors. In October, 2009, the
EMerge Alliance released the EMerge Alliance Standard, which
“establishes a more efficient means of powering the rapidly increasing
number of digital, dc-powered devices, such as sensors, lighting and IT
equipment.” Along with companies like Armstrong, the Alliance' s members
include Delta and Tyco Electronics.
In addition, the EMerge Alliance announced the first set of 26 Registered
Products in November, 2010. Already, companies like Armstrong World
Industries, Cooper Industries, Finelite Inc., Lunera Lighting, Nextek Power
Systems, Northwire Inc., and Tyco Electronics have products that have been
registered for the EMerge Alliance Standard.
Standards are certainly driving changes in the dc-dc converter market.
PMBus™ made its 2.1 specification for digital communications available
to the public; the Distributed-power Open Standards Alliance (DOSA) released
its non-isolated MICRO converter standard; the PCI Industrial Computer
Manufacturers Group (PICMG) has proposed formal improvements to the Advanced
Telecom Computing Architecture (ATCA) standard for military, defense, medical,
server and scientific applications; and Power-over-Ethernet (PoE) Plus now
supports up to 30W per port, and depending on the powered interface, can be
configured even beyond that.
The opportunities for dc-dc converter module and IC makers are greater now
than they have been in years, due to emerging applications, new power
architectures, advanced materials and components, and energy efficiency
standards. The power supply industry can take advantage of these developments,
knowing that additional markets are likely to arise in the future.
Topics Covered:
- Introduction
- Application Trends
- Evolving Power System Architectures
- Module and IC Design Trends
- Module Types
- Business and Manufacturing Landscape
- Standards Update
- Emerging Opportunities for DC-DC Converters
- DC-DC Converter Module Companies
- Power-Supply-On-Chip and Power-Supply-In Package Companies
Table of Contents
- Introduction
- Application Trends
- Communications
- Computing
- Consumer
- Industrial & Instrumentation
- Medical
- Military/Aerospace
- Evolving Power System Architectures
- Intermediate Bus Architecture
- Centralized Control Architecture
- Dynamic Bus Architecture
- Multi-core Architecture
- Distributed On-Chip Power
- Module and IC Design Trends
- Integration and Packaging Trends
- Module Packaging Trends
- IC Packaging Trends
- Power-Supply-on-Chip (PwrSoc) and Power-Supply-in-
- Package (PSiP)
- Other Packaging Developments
- Materials Developments (SiC & GaN)
- Power Density and Thermal Issues
- Module Types
- Bricks, Bus Converters
- Point-of-Load (POL) Converters
- Power Blocks
- Business and Manufacturing Landscape
- Standards Update
- DC-DC Converter Module Standards
- Distributed-power Open Standards Alliance (DOSA)
- Point-of-Load Alliance (POLA)
- High-Density Packaging (HDP) User Group
- Advanced Telecommunications Computing (ATCA & MicroTCA)
- Power-over-Ethernet (PoE) and PoE Plus
- PMBus™
- Other Standards
- Emerging Opportunities for DC-DC Converters
- Distributed DC Power in Buildings
- Photovoltaics
- Light-Emitting Diodes (LEDs)
- Competitive Overview
- DC-DC Converter Module Companies
- Bel Power
- CUI Global Inc.
- Delta Electronics
- Ericsson Power Modules
- FDK
- Lineage Power
- Martek Power
- Murata Power Solutions
- NetPower Technologies
- Power-One
- SynQor
- TDK-Lambda
- Vicor
- Power-Supply-on-Chip (PwrSoc) and Power-Supply-in-Package (PSiP) Companies
- Analog Devices
- Enpirion
- Infineon
- International Rectifier
- Linear Technology
- Micrel
- National Semiconductor
- NXP Semiconductors
- ON Semiconductor
- STMicroelectronics
- Texas Instruments
Appendix A - Report from Darnell' s Power Forum
Appendix B - Power-Related Standards Organizations and Members
LIST OF FIGURES:
- Figure 1 - IBM zEnterprise 196 Mainframe
- Figure 2 - PowertronR Railway DC-DC Converter
- Figure 3 - Synchronous Buck Regulator for Satellite & Space Applications
- Figure 4 - Intermediate Bus Architecture
- Figure 5 - Centralized Control Architecture
- Figure 6 - Dynamic Bus Architecture
- Figure 7 - 2010: POL Regulators in Server Systems
- Figure 8 - 2012-2015: POL Regulators for Servers
- Figure 9 - DC-DC Converter with Integrated Heat Sink
- Figure 10 - Enpirion Power-System-on-Chip
- Figure 11 - Cree Demonstrates 150mm Silicon 4-inch and 6-inch Wafers
- Figure 12 - EPC - Small Die Should Result in Low Cost
- Figure 13 - 600V Devices From microGaN
- Figure 14 - LiquaCore™ Power Management Technology
- Figure 15 - Vicor PwrSiP 1/32nd “Brick”
- Figure 16 - Digital POL Converter
- Figure 17 - POLA-compatible Non-isolated Power Module
- Figure 18 - ATCA-specific Bus Converter
- Figure 19 - PoE Midspan for High Power Terminals
- Figure 20 - Examples of DC Power Distribution in Commercial Facilities
- Figure 21 - DC Power Using PV as a Source
- Figure 22 - Distributed PV Architecture Using DC-DC Solution
- Figure 23 - National Semiconductor Solar Magic Power Optimizer, DC-DC
Solution
- Figure 24 - Tigo Energy Module Maximizer, DC-DC Solution
- Figure 25 - 40-inch LCD TV with LED Backlighting
- Figure 26 - High-Power DC-DC LED Driver
