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Markets for On-Chip and Chip-to-Chip Optical Interconnects - 2015 to 2024

出版商 Communications Industry Researchers (CIR) 商品編碼 321863
出版日期 內容資訊 英文
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晶片(on-chip)&晶片間光通訊模組市場預測 Markets for On-Chip and Chip-to-Chip Optical Interconnects - 2015 to 2024
出版日期: 2015年02月04日 內容資訊: 英文



  • 晶載/晶片間互聯的重要的發展
  • 「Interconnect Bottleneck」所創造的光電產業市場機會
  • 晶片級光互聯的現在及未來課題
  • 晶片級互聯的10年預測:摘要
  • 晶載/晶片間商務上熱門的8家公司

第1章 簡介

  • 本報告書的背景
    • 晶片相關的光互聯市場:經營者·產品·市場機會
    • 光學引擎和背板:光通訊模組的即時收益
    • 晶片為基礎的光互聯之新技術:長期的市場機會
  • 本報告書的目的
  • 調查手法·資訊來源

第2章 晶載/晶片間互聯的需求分析

  • 摩爾法則·擴充性·互連
  • 晶片級的光通訊模組推進因素
  • 電子互連的限制與因應策略
  • 光通訊模組的市場威脅
  • 光運算&通訊的轉變可能性:互連的影響
    • 全光背板
    • 光交叉連接器
    • 光運算
  • 本章的要點

第3章 晶載/晶片間互連的技術

  • 晶片級光通訊模組技術
    • 晶片間&晶載互連:銅纜的替代品
    • 晶片間&模組two模組PCB
    • 晶載互連
    • 晶片級互連的未來技術
  • 多核心處理和互連
    • 多核心處理器上光互聯的市場機會
    • 3D晶片·2.5D晶片和光通訊模組
  • 互連VCSEL:高速化
  • 光互聯用新的雷射R&D的影響
    • 矽雷射
    • 量子點雷射
  • 光通訊模組市場的其他零件
    • 微調製器
    • 探測器
    • 鏡片
  • 光引擎
    • 光引擎技術
    • 光引擎的供應商
  • 光通訊模組的替代奈米碳
  • 本章的要點

第4章 晶片級光互聯·技術平台·10年預測

  • 預測手法·前提條件
  • 未來晶片為基礎的互聯上,光集積平台所扮演的角色
    • 單片 vs 混合集積
    • 集積·互連·InP
    • 使用了PIC的晶片級光通訊模組的10年預測
  • 矽光子學
    • 矽光子學和晶載光子互連
    • 使用了矽光子學的晶片級光通訊模組的10年預測
  • 晶片級互連的光纖·波導管·自由空間光學的市場機會
    • 光纖和互聯
    • 晶片為基礎的互聯聚合物(及其他)波導管所扮演的角色
    • 晶片級互聯的自由空間光學所扮演的角色
    • 晶片級互連光纖·波導管·自由空間光學的10年預測
  • 本章的要點



Product Code: CIR-OI-MCC-0115

The so-called "interconnect bottleneck is creating opportunities for optical device and cable makers or all kinds. Process scaling, power consumption and operating frequency have all need to move away from metal interconnects and into the optical realm. This need is increasing with each new node; in high performance processors with metal tracks, clock distribution alone can use up to 50% of total chip power.

In this report, CIR analyzes both the latest commercial developments in optical interconnection at the chip level (both on-chip and chip-to-chip) and the progress in this area that is being made by important research teams worldwide. The coverage includes an investigation into the very latest architectures, devices, and materials that are impacting the prospects for on-chip and chip-to-chip optical connection. Among the topics covered by the report are the following:

  • The rise of optical engines and how these fit into future chip-to-chip connectivity. How will the architectures of these devices and materials used change as device dimensions shrink and what is the revenue potential of optical engines over the next ten years
  • An assessment of how novel photonic devices will be used in on-chip/chip-to-chip connections, analyzing the market potential of compound semiconductors versus the silicon photonics approach.
  • The market for approaches to optical interconnection that uses novel materials. Polymers, a material that has a long history, may finally find a role. Possible roadmaps for optical interconnection that use carbon nanotubes are also considered.
  • The commercialization of CMOS compatible optical interconnection using 3D architectures and other solutions

This report also contains a 10-year analysis that quantifies where and when the commercial opportunities for optical interconnection at the chip level will emerge and how much they will be worth. We also profile the leading firms and research efforts involved in designing and implementing on-chip and chip-to-chip optical interconnection.

CIR has been tracking the market for optical interconnects for almost a decade and is the leading industry analyst firm providing coverage in this this area. The report will be of considerable interest to marketing managers, business development executives and product managers in the semiconductor and data communications industries. It will also be of use to serious investors in these and other related industries.

Table of Contents

Executive Summary

  • E.1 Important Developments in On-Chip/Chip-to-Chip Interconnection in 2014
  • E.2 Why the "Interconnect Bottleneck" Creates Opportunities for the Photonics Industry
    • E.2.1 The Device Opportunity: Small and Cheap
    • E.2.2 The Integration Dimension: How Do You Get an Optical Link on a Chip and Make Money?
    • E.2.3 An Opportunity Analysis Matrix for Chip-Level Optical Interconnection
  • E.3 Current and Future Challenges for Chip-Level Optical Interconnection
    • E.3.1 Danger of Overshooting the Market
    • E.3.2 Technological Risks: Current and Future
  • E.4 Summary of 10-year Market Forecasts for Chip-Level Interconnection
  • E.5 Eight Companies to Watch in the On-Chip/Chip-to-Chip Business

Chapter One: Introduction

  • 1.1 Background to this Report
    • 1.1.1 Markets for Chip-Related Optical Interconnection: Players, Products and Opportunities
    • 1.1.2 Optical Engines and Backplanes: Immediate Revenues from Optical Interconnect?
    • 1.1.3 Emerging Technologies for Chip-Based Optical Interconnection: Long-Term Opportunities
  • 1.2 Objectives of this Report
  • 1.3 Methodology and Information Sources for this Report

Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection

  • 2.1 Moore's Law, Scaling and Interconnect
    • 2.1.1 Current Prognosis for Moore's Law
    • 2.2.2 Moore's Law and the Limits of Copper Interconnect
  • 2.2 Content Drivers for Optical Interconnect at the Chip Level
    • 2.2.1 The Next Data Rate Surge: What it Means for Processors and Memories
  • 2 3 Limits to Electronic Interconnects and Strategies for Dealing with them
  • 2.4 Market Threats to Optical Interconnect
  • 2.5 A Possible Transition to Optical Computing and Communications: Interconnect Implications
    • 2.5.1 All-Optical Backplanes
    • 2.5.2 Optical Crossconnects
    • 2.5.3 Optical Computing
  • 2.6 Key Points Made in this Chapter

Chapter Three: Technologies for On-Chip/Chip-to-Chip Interconnect

  • 3.1 Chip-Level Optical Interconnect Technology
    • 3.1.1 Chip-to-Chip and On-Chip Interconnect: Replacing Copper
    • 3.1.2 Chip-to-Chip and Module-to-Module PCBs
    • 3.1.3 On-Chip Interconnect
    • 3.1.4 Future Technologies for Chip-Level Interconnect
  • 3.2 Multicore Processing and Interconnect
    • 3.2.1 Opportunities for Optical Interconnection in Multicore Processors
    • 3.2.2 3D Chips, 2.5D Chips and Optical Interconnect
  • 3.3 VCSELs for Interconnect: Getting Faster
  • 3.4 Implications of Novel Laser R&D for Optical Interconnection
    • 3.4.1 Silicon Lasers
    • 3.4.2 Quantum Dot Lasers
  • 3.5 Other Components Suitable for the Optical Interconnect Market
    • 3.5.1 Micro-modulators
    • 3.5.2 Detectors
    • 3.5.3 Lenses
  • 3.6 Optical Engines
    • 3.6.1 Optical Engine Technology
    • 3.6.2 Optical Engine Suppliers
  • 3.7 Nanocarbon as an Alternative to Optical Interconnect
  • 3.8 Key Points Made in this Chapter

Chapter Four: Chip Level Optical Interconnection, Technology Platforms and Ten-Year Market Forecasts

  • 4.1 Forecasting Methodology and Forecasting Assumptions
  • 4.2 The Role of Optical Integration Platforms in Future Chip-Based Interconnection
    • 4.2.1 Monolithic versus Hybrid Integration
    • 4.2.2 Integration, Interconnect and InP
    • 4.2.3 10-Year Forecast of Chip-Level Optical Interconnect Using PICs
  • 4.3 Silicon Photonics
    • 4.3.1 Silicon Photonics and On-Chip Photonic Interconnects
    • 4.3.2 10-Year Forecast of Chip-Level Optical Interconnect Using Silicon Photonics
  • 4.4 Opportunities for Fiber, Waveguides and Free-Space Optics in Chip-Level Interconnect
    • 4.4.1 Fiber and Interconnection
    • 4.4.2 The Role of Polymer (and Other) Waveguides in Chip-Based Interconnection
    • 4.4.3 The Role of Free-Space Optics in Chip-Level Interconnection
    • 4.4.4 10-Year Forecast of Fiber, Waveguides, and Free-Space Optics for Chip-Level Interconnect
  • 4.5 Key Points Made in this Chapter

Acronyms and Abbreviations Used in this Report

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