光通訊的新收益機會：市場・技術預測 是由出版商Communications Industry Researchers在2010年05月所出版的。
這份英文市場調查報告書價格從美金3295起跳。
本報告書為光通訊市場動向與新的收益機會之相關調査分析，光通訊的需求、各種末端使用劃分的市場機會、光通訊技術與產品、各產品類別的5年市場預測等，概述如下。
總綱
第1章 導論
第2章 光通訊的現在與將來市場
- 處理器速度與光通訊需求
- 既存的高速VSR市場之光通訊
- VSR通信與資料庫管理系統
- 框架基礎的線路組裝
- 伺服器叢集
- SAN
- 光通訊的連接埠等級與市場機會
- 機板內建&機板對機板通信
- 機板對機板線路組裝
- 主機板・附加機板
- 底板
- 晶片對晶片通信的光通訊
- 晶片對晶片通信的光通訊之市場機會
- 光通訊與多核心程序
- 收發器的光通訊
- 光通訊的長期市場機會
- 晶片上光通訊
- Fiber-at-the-Desk與Fiber-to-the-Desk
第3章 光通訊產品・MSA・技術
- 晶片上光通訊產品
- 已成端的光組裝
- 光纖跳線
- MPO基礎的平行光通信
- 作為光通訊的AOC
- 由於MSA與規格而造成連結的形成
- 主要資料庫管理系統規格環境
- 光通訊・300pin VSR・OC-768
- 光通訊・PCI-Express
- 光通訊的專用方法
- Light Peak：將來的規格還是MSA?
- 其他的專用芳反
- 光通訊的"光引擎"：新產品定義
- 晶片上・晶片對晶片連接的光集積之作用
- 混合集積方案
- 單體集積方案之將來
- 光通訊與新的雷射種類：矽以及量子點
第4章 光通訊市場的5年預測
- 預測手法
- 代替流程
- 框架基礎的光通訊預測：依產品類別
- 連接埠基礎的光通訊預測：依產品類別
- 晶片對晶片光通訊預測：依產品類別
- 晶片上通訊的時刻表與質的分析
- 光通訊預測：摘要
圖表
Abstract
The idea that boards and chips (or even devices on chips) could be
interconnected with optics has excited the imagination of engineers for well
over a decade. Start-ups have appeared with optical interconnection as their
main focus only to disappear from the scene a year or so later. Established
transceiver and semiconductor firms have also tried their hands at optical
interconnection, but have generally abandoned or downsized projects after a
short space of time.
Until very recently, optical interconnection has not portrayed itself as a
good business to be in. Something has changed in the last year or so, however,
and that is the size of the addressable market. Optical interconnection
projects of the past have looked for initial revenues from the limited
opportunities in supercomputers or in very high-end telecom gear. But, as
Moore' s Law has pushed VLSI ever forward, the addressable market for optical
interconnects has expanded from a few niches to the giant market represented
by corporate servers and large routers.
Many believe that within a few years processor speeds will reach a point where
optical interconnects will be required in most standard business computers.
Meanwhile, the recent introduction by Intel of its LightPeak technology has
propelled optical interconnection from something that is little more than a
topic for technical conferences to a potential, near-term revenue generator.
These encouraging signs are countered by the quite daunting challenges facing
optical interconnection; primarily, that is, providing cost-effective optical
technology in markets that are used to paying only minimal amounts for metal
connectivity. There is also the issue of matching optical interconnect
technologies to the fairly different needs of the chip-to-chip, board-to-board
and on-rack interconnection. CIR expects proprietary solutions to these
problems to create sustainable market advantages for firms in the emerging
optical interconnection space.
There are also significant new business opportunities emerging for suppliers
of optical interconnect technology, including firms with roots in the diode
laser, active optical cabling, transceiver, and semiconductor industry. We
also think that optical interconnection will be a key enabling technology for
computer and telecom/datacom equipment firms, which will increasingly find
that the speed of internal interconnection is limiting their success in
deploying the latest processors.
With all this in mind, CIR is publishing this new report, which identifies
where the opportunities are to be found in optical interconnection and
quantifies how much those opportunities will be worth. We believe it will be
invaluable reading for all firms for which optical interconnection is key to
their business strategies.
Table of Contents
Executive Summary: Optical Interconnects
- E.1 Summary of Current Market Drivers and Challenges for Optical
Interconnection
- E.2 Firms to Watch in this Space
- E.2.1 Avago and MicroPOD
- E.2.2 CyOptics and Terapics
- E.2.3 Finisar, Laserwire and Optical Interconnection
- E.2.4 Intel' s Light Peak and Silicon Photonics
- E.2.5 Luxtera and OptoPhy
- E.2.6 Firms Offering Optical Engines and Optical Integration Solutions
- E.2.7 Firms Offering Cable, Fiber and Connectors for Optical
Interconnects
- E.3 Summary of Key Opportunities as Perceived by Technology/Component
Suppliers
- E.3.1 Optical Engines and Embedded Optical Interconnects
- E.3.2 Lasers
- E.3.3 Connectors and Cables
- E.4 Summary of Forecasts
Chapter One: Introduction
- 1.1 Background to this Report
- 1.1.1 Optical Interconnects Defined and Their Newfound Addressable
Markets
- 1.1.2 Optical Integration for Optical Interconnection?
- 1.2 Objectives of this Report
- 1.3 Scope of this Report
- 1.4 Methodology and Information Sources for this Report
- 1.5 Plan of this Report
Chapter Two: Current and Future Markets for Optical Interconnects
- 2.1 Processor Speeds and the Need for Optical Interconnects
- 2.2 Optical Interconnects in Existing High-speed Very-Short-Reach Markets
- 2.2.1 VSR Telecom and Datacom
- 2.2.2 Rack-Based Cable Assemblies
- 2.2.3 Server Clusters
- 2.2.4 SANs
- 2.3 Board-level Opportunities for Optical Interconnects
- 2.3.1 On-board and Board-to-board Communications
- 2.3.2 Board-to-Board Cable Assemblies
- 2.3.3 Motherboards and Daughter Boards
- 2.3.4 Backplanes
- 2.4 Optical Interconnects in Chip-to-Chip Communications
- 2.4.1 Market Opportunities in Optical Interconnects in Chip-to-Chip
Communications
- 2.4.2 Optical Interconnects and Multi-core Processors
- 2.4.3 Optical Interconnects in Transceivers
- 2.5 Longer-Term Opportunities for Optical Interconnects
- 2.5.1 On-Chip Optics
- 2.5.2 Fiber-at-the-Desk and Fiber-to-the-Desk
Chapter Three: Optical Interconnect Products, MSAs and Technologies
- 3.1 Products for Off-Chip Optical Interconnection
- 3.1.1 Pre-Terminated Optical Assemblies
- 3.1.2 Fiber-Optic Jumpers
- 3.1.3 MPO-based Parallel Optics
- 3.1.4 AOCs as Optical Interconnects
- 3.2 How MSAs and Standards are Shaping Optical Interconnection
- 3.2.1 The Dominant Datacom Standards Environment: Ethernet, Fibre
Channel and InfiniBand Breeding New/Updated Transceiver MSAs -SNAP12, QSFP,
CXP
- 3.2.2 Optical Interconnection, 300-pin VSR, and OC-768
- 3.2.3 Optical Interconnection and PCI-Express
- 3.3 Proprietary Approaches to Optical Interconnection
- 3.3.1 Light Peak: Future Standard or MSA?
- 3.3.2 Other Proprietary Approaches
- 3.4 "Optical Engines" in Optical Interconnection: A New Product Direction?
- 3.4.1 The Role of Optical Integration in On-Chip and Chip-to-Chip
Interconnection
- 3.4.2 Hybrid Integration Solutions
- 3.4.3 Future Monolithic Integration Solutions
- 3.4.4 Optical Interconnection and Novel Laser Types: Silicon and Quantum
Dot
Chapter Four: Five-Year Forecasts of Optical Interconnection Markets
- 4.1 Forecasting Methodology
- 4.2 Alternative Scenarios
- 4.3 Forecast of Rack-based Optical Interconnection by Product Type 4.4
Forecast of Board-based Optical Interconnection by Product Type
- 4.5 Forecast of Chip-to-Chip Optical Interconnection by Product Type
- 4.6 Timetable and Qualitative Forecast of On-chip interconnection
- 4.7 Summary of Forecasts for Optical Interconnection
Acronyms and Abbreviations Used in this Report
About the Author
List of Exhibits
- Exhibit E-1: Summary of Optical Interconnects Forecast ($ Millions)
- Exhibit 1-1: Optical Interconnection Components
- Exhibit 2-1: TIA-942 Basic Data Center Topology Defined
- Exhibit 2-2: Fiber Channel over Ethernet Illustration
- Exhibit 2-3: Avago' s MicroPOD Module
- Exhibit 3-1: 4-connector End-to-End Fibre Channel Connection
- Exhibit 3-2: Harness Assemblies for a Brocade 48000 Switch in a Data Center
- Exhibit 3-3: Fiber-Optic Trunk Cable with Pulling Eye
- Exhibit 3-4: MPO Connector with Key Up
- Exhibit 3-6: Side View Cut-away of Cassette MPO Connection
- Exhibit 3-5: MPO Position 1 Designation
- Exhibit 3-7: MPO Connector Endface Within Cassette
- Exhibit 3-8: TIA-568C Method A Polarity
- Exhibit 3-9: TIA-568C Method B Polarity
- Exhibit 3-10: TIA-568C Method C Polarity
- Exhibit 3-11: SNAP12 Module
- Exhibit 3-13: CFP Module
- Exhibit 3-12: QSFP Module
- Exhibit 3-14: AOC with CXP ends
- Exhibit 3-15: Illustration of CXP module and cable (Annex 6, InfiniBand
Architecture Specification)
- Exhibit 3-16: Today' s Supercomputer
- Exhibit 3-17: InfiniBand Formats and Data Rates
- Exhibit 3-18: Cisco VSR Module with SNAP12 Devices
- Exhibit 3-19: PCIe PCB with OE-FPGA from Xilinx/Reflex Phonetics
- Exhibit 3-20: Intel Light Peak Technology
- Exhibit 3-21: Light Peak Functional Diagram
- Exhibit 3-22: MicroPOD Transmitter and Receiver Modules with 12-fiber
Ribbon Cable
- Exhibit 3-23: Luxtera' s OptoPhy Transceiver
- Exhibit 3-24: Opportunities for Optical Integration in High-Speed Networks
- Exhibit 3-25: New Laser Integrated Products for Parallel Solutions
- Exhibit 3-26: Light on Board Technology and LightABLE Sub-Assembly
- Exhibit 3-27: CyOptics Terapics Project -1 Tbps
- Exhibit 3-28: Rendering of 3-D Optical Interconnect
- Exhibit 3-29: 1310nm FP Quantum Dot Laser Structure
- Exhibit 4-1: Data Center Active Optical Cables
- Exhibit 4-2: Rack-based Optical Interconnects Forecast
- Exhibit 4-3: MPO-to-LC breakout
- Exhibit 4-4: LC-to-LC Jumpers
- Exhibit 4-5: Total Revenue of Rack-based Optical Interconnects ($ Millions)
- Exhibit 4-6: Board-based Optical Interconnects Forecast
- Exhibit 4-7: Chip-to-chip Optical Interconnects Forecast
- Exhibit 4-8: Summary of Optical Interconnects Forecast ($ Millions)
光通訊市場：2015年預計達35億美金的收益
2010年05月26日
日商環球資訊有限公司、開始銷售維吉尼亞州為據點的產業分析企業Communications Industry Researchers所發行的報告書「New Revenue Opportunities for Optical Interconnects: A Market and Technology Forecast (光通訊的新收益機會：市場・技術預測)」。
依照CIR、光通訊產品的收益、2015年為止預計超過35億美金。直至先前、光通訊並不列入現實商業企業、至今的光通訊計畫、高階通訊機器及超級電腦領域所侷限的市場機會所獲取的初期收益為目標。但是、依照摩爾的法則VLSI (very-large-scale integration)持續的推進、光通訊的可尋址市場從微薄的利基市場、轉為大型路由器及通訊伺服器所形成的「巨大市場」。本報告中得知、「幾乎所有的標準業務用電腦處理器速度、在今後2∼3年中、會達到光通訊所需求的重點」。LightPeak技術所稱的Intel的最近開發、使得光通訊逐漸的受到矚目。
難應付課題所直接面臨的光通訊
光通訊、逐漸的成為持有短期收益的潛在力、業界直接面臨一些課題。以此做中心、在金屬連結最小額支出習慣的市場中、與提供高度成本效率的光技術成為相關點。此外其他課題上、光通訊技術的晶片對晶片（chip-to-chip）、機板對機板（board-to-board）、開放機櫃光通訊的各種需求都可被推舉。在CIR中、新的光通訊領域的加入企業創造出可持續維持的市場優點、期待解決這些問題的專用解決方案。
光通訊在、電腦及通訊/數據網路機器企業的主要實現技術上
電腦及通訊/數據網路機器企業,今後内部相互連結速度會妨礙最新處理器引進的成功。最主要的實現技術為光通訊的成長牽引因素展望。此外、二極體雷射、主動式光纖纜線、收發器、半導體產業持有管道的企業包含光通訊技術的供應商、也會出現一些新的商業機會。
