連結器產業的準則

連結器產業的準則 是由出版商Bishop & Associates, Inc.在2006年03月所出版的。 這份英文市場調查報告書包含272 pages 價格從美金3950起跳。

簡介

目錄

Abstract

Bishop and Associates, Inc. just released a six-chapter report providing a roadmap for the Connector Industry. This new 2006 report provides industry roadmaps on connector technology, connector market segments, product categories, long-term forecasts, and some input on other electronic components and product sectors. The report is organized into the following segments:

• Executive Summary
• Technology Roadmaps
• Long Term Forecasts
• Overview
• Industry Trends
• Electronics Industry Roadmaps
• Technology Trends
• Product Roadmaps

Information used to create this report includes input from Bishop and Associates and other key industry sources. This report is more market oriented and connector specific than the important iNEMI national technology roadmap.

This new report from Bishop & Associates identifies areas where roadblocks or other barriers will occur, and where industry forces are moving in a direction that will impact connector applications. There are forces at work that will shape future connector use, and in some cases radically change or eliminate traditional connector applications.

Connectors are an important component of electronic equipment, accounting for approximately two-percent of total equipment value. Although a small percentage, connectors represent billions of units in many different product categories. They provide separable interconnects to circuit elements during test, assembly, upgrade, repair, and connect peripherals, batteries, antennas, wires, cables, etc.

Table of Contents

Executive Summary

• S.1 Findings
• S.2 Forecast
• S.3 Market Trends
• S.4 Technology Trends
• S.5 Product Roadmaps
• S.6 Categories
• Tables
  • S.1 Connector Barriers
  • S.2 Industry Trends 1985-2015
  • S.3 Industry Trends ? Bar Chart
  • S.4 Sales by Market 1999-2009
  • S.5 Mech. Parameters
  • S.6 IC Socket Roadmap Example

Overview

• O.1 Introduction
• O.1 Interconnect Level
• O.2 Market Segments
• O.3 Connector Designs
• O.4 Business Forces
• O.5 Roadmap
• O.6 Industry Trends
• O.7 Outsourcing
• O.8 Major Trends
• O.9 Critical Areas NA, EU, JP
• O.10 US Gov Initiatives
• O.11 NEMI Roadmap

Chapter 1 - Technology Trends:

• 1.1 Connectors vs Other Comp.
• 1.2 Connecting Circuits
• 1.3 Electrical vs Electronic
• 1.4 Simpler Technology
• 1.5 Industry Standards
• 1.6 Electronics Technology
• 1.7 Moore's Law
• 1.8 Applications
• 1.9 Core Technologies
• 1.10 Mfg trends
• 1.11 Technology Roadblocks
• 1.12 Key Areas for Development
• 1.13 Key Takeaways
• Tables
  • 1.1 Design Pressures

Chapter 2 - Technology Road Mapping

• 2.1 What is a Roadmap
• 2.2 Roadmap Examples
• 2.3 Why Roadmap Long Term
• 2.4 Trade Secret Issues
• 2.5 Best Use of Roadmaps
• 2.6 Fundamentals of Road Mapping
• 2.7 Solving Real Problems - iNEMI
• 2.8 Connector Roadmap Outline
• 2.9 Sandia Labs Report
• Tables
  • 2.1 Packaged MPU Chips
  • 2.2 Processor Socket Roadmap
  • 2.3 MPU Roadmap
  • 2.4 Portable Sys Connector Roadmap
  • 2.5 Memory Socket Example

Chapter 3 - Industry Trends

• 3.1 Scope
• 3.2 Definition
• 3.3 Market Characteristics
• 3.4 Future Market Characteristics
• 3.5 Market Size & Scope
• 3.6 Regional Mix
• 3.7 Long Term Growth Rates
• 3.8 IC vs Connector Market Performance.
• 3.9 Connector Markets 2004, 2009
• 3.10 Market Segment Trends
• 3.11 Regional Dynamics
• 3.12 Engineering Location Trends
• 3.13 Survey - Key Roadmap Trends
• 3.14 Key Trends & Roadblocks
• 3.15 Summary of Connector Trends
• 3.16 Other Key Points
• 3.17 Connectors in Wireless World
• 3.18 Connector Background
• 3.19 Outsourcing
• 3.20 Barriers to North Amer. Mfg
• 3.21 Forecast Scenarios 1985-2015
• Tables
  • 3.1 Worldwide Connector Sales 2004-5
  • 3.2 Connector Sales by Region 2005
  • 3.3 % - 5 Yr Increments 1980-2010
  • 3.4 $ - 5 Yr Growth Rates 1980-2005
  • 3.5 $ 35 Yr Growth Cyclical 1980-2015
  • 3.6 World Semi vs Connector Revenues
  • 3.7 Industry Sales Performance. '95-05
  • 3.8 Semi vs Connector Yr-Yr Change
  • 3.9 Yr-Yr Change by Month
  • 3.10 Connector Markets 2004
  • 3.11 Connector Markets 2009
  • 3.12 Sales Performance by Market 1999-2009
  • 3.13 Global Sales by Market 1999-2009
  • 3.14 Market Trends 01-05 vs. 05-09
  • 3.15 Trends in OEM Markets
  • 3.16 Taiwan IT Hardware Prod. in China
  • 3.17 % Connector Engrg by Region
  • 3.18 Roadmap Trends ? Survey Results
  • 3.19 Mechanical Parameters 1985-2015
  • 3.20 Connector Type Summary
  • 3.21 Key Issues by Type
  • 3.22 WiFi Bluetooth Penetration '05-'10
  • 3.23 Offshoring of NA Assy 2000-'15
  • 3.24 1985-2015 Forecast - Optimistic
  • 3.25 1985-2015 Forecast ? Nominal
  • 3.26 1985-2015 Forecast - Recession
  • 3.27 Forecasting Turbulence
  • 3.28 Forecasting Paradigms

Chapter 4 - Product Roadmaps

• 4.1 Test Sockets
• 4.2 Burn-In Sockets
• 4.3 IC Sockets for Production
• 4.4 Memory Sockets DIMM
• 4.5 Memory Sockets SODIMM
• 4.6 Intel Motherboards
• 4.7 Memory Card Receptacles
• 4.8 PCB Connectors ? PCI Express
• 4.9 PCB New Card/Express Card
• 4.10 Generic PC Board Connectors
• 4.11 Min Wire-to-Board FEC/FPC
• 4.12 Other WTB Connectors
• 4.13 Min Board Stacking
• 4.14 2mm Backplane Connectors
• 4.15 High Performance. Backplane Conn.
• 4.16 Fiber Optic Connectors
• 4.17 RF Coaxial Connectors
• 4.18 Electronic Power Connectors
• 4.19 PCB Terminal Blocks
• 4.20 IEC/NEMI Terminal Blocks
• 4.21 RJ11-45 IO Connectors
• 4.22 Ind. Ethernet Connectors
• 4.23 Automotive Connectors
• 4.24 USB/IEEE1394 IO Connectors
• 4.25 WiFi Bluetooth Penetration
• 4.26 More on Backplanes
• Tables
  • 4.1 Test Sockets
  • 4.2 Burn-In Sockets
  • 4.3 IC Sockets for Production
  • 4.4 Memory Sockets DIMM
  • 4.5 Memory Sockets SODIMM
  • 4.6 Intel Motherboards
  • 4.7 Memory Card Receptacles
  • 4.8 PCB Connectors ? PCI Express
  • 4.9 PCB New Card/Express Card
  • 4.10 Generic PC Board Connectors
  • 4.11 Min Wire-to-Board FEC/FPC
  • 4.12 Other WTB Connectors
  • 4.13 Min Board Stacking
  • 4.14 2mm Backplane Connectors
  • 4.15 High Performance. Backplane Conn.
  • 4.16 Fiber Optic Connectors
  • 4.17 RF Coaxial Connectors
  • 4.18 Electronic Power Connectors
  • 4.19 PCB Terminal Blocks
  • 4.20 IEC/NEMI Terminal Blocks
  • 4.21 RJ11-45 IO Connectors
  • 4.22 Ind. Ethernet Connectors
  • 4.23 Automotive Connectors
  • 4.24 USB/IEEE1394 IO Connectors
  • 4.25 WiFi Bluetooth Penetration
  • 4.26 Industry Standards - Backplanes
  • 4.27 Impact of SMT
  • 4.28 Market Forecast 2001-2006
  • 4.29 Captive vs Outsourced Backplanes
  • 4.30 Backplane Pricing Trend
  • 4.31 Connectorized BP Roadmap

Chapter 5 - Forecast

• Tables
  • 5.1 1985-2015 Forecast - Optimistic
  • 5.2 1985-2015 Forecast - Nominal
  • 5.3 1985-2015 Forecast - Recessionary
  • 5.4 1985-2015 Comparisons
  • 5.5 1985-2015 Cyclical Growth
  • 5.6 Market Segment Performance. 2000-05
  • 5.7 Market Segment Performance. 2005-10
  • 5.8 Market Segment Performance. 2010-15

Chapter 6 - Electronics Market Roadmap

• 6.1 World Economic Trends
• 6.2 Automotive
• 6.3 Aerospace/Defense Systems
• 6.4 Board Assembly
• 6.5 Consumer Electronics
• 6.6 Digital Silicon
• 6.7 Displays
• 6.8 MEMS/Micro-Interconnect
• 6.9 Energy Storage - Batteries
• 6.10 Environmental Electronics
• 6.11 Final Assembly
• 6.12 Interconnect Substrates - PCBs
• 6.13 Interconnect Substrates ? Ceramic
• 6.14 Large Business Systems
• 6.15 Mass Data Storage
• 6.16 Modeling Simulation Design Tools
• 6.17 Fiber Optics
• 6.18 Electronic Packaging
• 6.19 Passive Devices
• 6.20 Portable Products
• 6.21 Thermodynamics
• Tables
  • 6.1 GDP + Exchange Rates 2003-05
  • 6.2 Per Capita Incomes 2005
  • 6.3 China Auto Exports 2000-2010
  • 6.4 Selected PCB Parameters 2003-15
  • 6.5 NA & World Consumer 2002-14
  • 6.6 Package Attributes 2003-15
  • 6.7 CE Market Segments 2005-15
  • 6.8 Top 20 Worldwide OEMs
  • 6.9 Cell Phone Shipments 2002-15
  • 6.10 On Chip Interconnects 2003-15
  • 6.11 Chip Package Roadmap 2001-15
  • 6.12 Semicon vs Connector $ 1980-15
  • 6.13 Industry Sales Performanceorm. 1995-05
  • 6.14 Display Market 2005-10
  • 6.15 Battery Market Dynamics
  • 6.16 Environmental Needs
  • 6.17 Current PCB Mfg Capability
  • 6.18 HDD Market 2005
  • 6.19 Areal Density 1970-2010
  • 6.20 Simulation Focus Areas
  • 6.21 Periph Bus Speed 2005-15
  • 6.22 IC Package IO Count 2005-15
  • 6.23 IPD Features
  • 6.24 Portable Roadmap 2003-15
  • 6.25 Notebook PC Wattage

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