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市場調查報告書

連接器產業發展藍圖

Connector Industry Roadmap

出版商 Bishop & Associates, Inc. 商品編碼 235624
出版日期 內容資訊 英文
商品交期: 請詢問到貨日
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連接器產業發展藍圖 Connector Industry Roadmap
出版日期: 2014年12月31日 內容資訊: 英文
簡介

本報告提供過去10年的電子產業及連接器的相關調查、今後10年的預測、市場與技術趨勢、主要種18產品發展藍圖、產業的方向性、主要市場預測,及連接器、設備市場長期的展望等相關討論彙整,為您概述為以下內容。

第1章 調查範圍、調查手法

第2章 半導體

  • 半導體廠商
  • 半導體設備廠商
  • 半導體包裝企業
  • 全球半導體vs.連接器成長率
  • 全球半導體vs.連接器規模(美金)
  • 全球半導體銷售額比率:各地區
  • 前進的半導體技術:主要課題
  • ITRS - iNEMI藍圖 - DRAM 1/2/ Pitch (nm)
  • CMOS定標
  • IC封裝&互連
  • 連接器預測
  • 彙整

第3章 有機印刷電路板(及其最終更換)

  • 背景
  • 情形分析
  • 印刷電路板(PCB)廠商
  • PCB廠商前100家
  • PCB企業收益:各國
  • PCB市場競爭性:連接器產業吸取的經驗?
  • 硬質面板規格、展望
  • 目前公稱面板規格
  • PCB密度的展望
  • PCB材料
  • 彈性電路、其他

第4章 美國的製造業:出貨量

  • 概要
  • 耐用消費品
  • 全製造業
  • 機器
  • 含家電的電子設備
  • 家用音訊/視訊設備
  • 照相機
  • 造船&坦克:國防
  • 通信設備:非國防
  • 運輸設備
  • 汽車&零件
  • 醫療用電子設備&器具
  • 半導體&相關產品
  • 半導體以外的電子元件
  • 電腦、電子產品、其他

第5章 市場及技術

  • 簡介
  • 地區的產業預測
  • 歐洲
  • 北美
  • 日本
  • 台灣、中國
  • 印度、其他

第6章 連接器產業的展望:摘要

  • 包裝的連接器層級
  • 市場分析
  • 前十大企業在連接器整體市場上佔的比例
  • 主要的產業需求
  • 主參數:連接器種類整體整合
  • 金屬連接器的主要特質
  • 摘要:各主要連接器類型
  • 製造基礎設施
  • 技術障礙
  • 連接器使用趨勢:各市場區隔
  • 連接器技術趨勢
  • 製造設備&流程
  • 基礎設施
  • 電子材料
  • 環境技術、其他

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: RM-1050-14

IN-DEPTH ANALYSIS AND HISTORICAL PERSPECTIVES FOR FORECASTS AND PLANNING

“The Connector Roadmap,” examines the electronics industry and connectors over the past decade, and forecasts the decade to come. This six chapter report provides electronics industry insiders with valuable insights and information.

The detailed study includes numerous charts and tables, and various photos and illustrations, giving readers a multi-dimensional look into industry trends, technology strategies, and industrial competitiveness in the electronic component and connector industry. The report also analyzes major elements of the electronics industry that parallel, intersect, and influence the design, development and use of connectors.

As the global economy has come to define the industry, the report includes a look into the competitive position and strategies affecting various regions, including shifting priorities for North America, Europe, Japan, China, and Asia-Pacific. A discussion of this global dynamic includes the “trickling” of “in-sourcing”, as some manufacturing returns to North America and the easing of taxes and regulations in the European Union.

The study looks at the connector industry's markets and technology trends, and details over 18 major product roadmaps, with technical parameters, forecasts, encroachment, and possible roadblocks over the next decade. U.S. Census Bureau data is compiled on U.S. shipments in 30 multi-billion dollar equipment markets, including automotive, computer and electronic products, military-aerospace, and semiconductors, charted from 1995-2013, with trend line analysis to 2023. Also included is a discussion of semiconductor technology, electronics packaging, and printed circuit board technology. The slowing or potential halt of Moore's Law - a critical driver for connector technology and demand or the emergence of a new set of technologies, e.g. ‘Beyond Moore' or ‘More Than Moore', is also examined.

The report discusses how the industry will move forward, forecasts key markets, and gives long-range projections on both connector and equipment markets. Many forecasters think the recovery will continue to be slow and painful, or backslide into another recession. Others see the potential for renewed growth as governments grapple, perhaps successfully, with tax, energy, sovereign debt, and environmental policies. Recommendations for connector industry research and development is also provided.

Table of Contents

Chapter 1 - Report Scope and Methodology

  • Background
  • The World Economies/North America
  • Europe
  • Japan
  • Asia-Pacific
  • China
  • ROW
  • World Economic Forum
  • Why has the US fallen from #1 in 2008 and before to #5 in 2013-14?
  • What should be done for the US to retain its World Leadership and move back toward #1?
  • International Monetary Fund Outlook 2013 and Beyond
  • IMF Forecasts
  • Bottom Line
  • The Global Electronics Industry

Chapter 2 - Semiconductors

  • Semiconductor Manufacturers
  • Semiconductor Equipment Manufacturers
  • Semiconductor Packaging Firms
  • Worldwide Semiconductor vs. Connector Growth Rates 1980-2013
  • Worldwide Semiconductor vs. Connector Dollars 1980-2013
  • World Semiconductor Sales Dollars Percentage by Region 1980-2013
  • Semiconductor Technology Going Forward: A Major Challenge
  • ITRS - iNEMI Roadmap - DRAM 1/2/ Pitch (nm)
  • CMOS Scaling
  • IC Packaging & Interconnect
  • Predictions for Connectors
  • Takeaways

Chapter 3 - Organic Printed Circuit Boards (and Their Eventual Replacement)

  • Background
  • Situation Analysis
  • PCB Manufacturers
  • Top 100 PCB Manufacturers 2011
  • PCB Company Revenues by HQ by Country 2010
  • PCB Company Revenues by HQ by Country 2011
  • Competitive Nature of PCB Marketplace - Lessons to be learned by connector Industry?
  • Rigid Board Specs and Outlook
  • Nominal Board Specs Today
  • PCB Density Outlook 2013-2023
  • PCB Materials
  • Flexible Circuits
  • Flex by Country - 2010
  • Top Flex Circuit Makers by Country
  • Future of Rigid and Flex Circuitry
  • Potential Disruptive Technologies
  • Si Photonics and Advanced PCB Technology

Chapter 4 - US Manufacturing

  • Overview
  • US Shipments Durable Goods 1995-2023
  • US Shipments All Manufacturing Industries 1995-2023
  • US Shipments Machinery 1995-2023
  • US Shipments Electrical Equipment including Appliances
  • US Shipments Household Audio/Video Equipment 1995-2023
  • US Shipments Photographic Equipment 1995-2023
  • US Shipments Ship Building & Tanks 1995-2023
  • US Shipments Communications Equipment - Defense 1995-2023
  • US Shipments Communication Equipment - Non-Defense 1995-2023
  • US Shipments Transportation Equipment 1995-2023
  • US Shipments Motor Vehicles & Parts 1995-2023
  • US Shipments Electromedical & Instrumentation 1995-2023
  • US Shipments Semiconductors & Related Products 1995-2023
  • US Shipments Electronic Components other than Semiconductors 1995-2023
  • US Shipments Computers and Electronic Products 1995-2023
  • Open Compute Product Motherboard Design
  • AMD Open 3.0 - Targeted Solutions
  • US Shipments Peripheral Equipment 1995-2023
  • US Shipments Storage Equipment

Chapter 5 - Markets and Technology

  • Introduction
  • Regional Business Prospects
  • Europe
  • Manufacturing Movement in Europe: East
  • EMS Providers in Europe
  • Top EMS Providers in Europe
  • European Connector Manufacturing Roadmap 1990-2025
  • Europe/s Issues/Opportunities with 2015-2025
  • North America
  • World C02 Measurements
  • North American Connector Roadmap 1990-2025
  • Japan
  • Taiwan - China
  • Historical Taiwan Targeted Technology Development
  • Asia Pacific & China Connector Roadmap 1990-2025
  • India
  • Technology
  • Definitions
  • Basic Research
  • Industry Technology Transfer
  • Business Cycle Impact on Technology
  • Core and New Technologies of the Connector Industry
  • Electronic Industry Technology Shifts Impact Connector Technology
  • What This Will Mean to Connector Technology
  • Connectors' Evolutionary Design
  • Changing Equipment Markets
  • OEM Destinies
  • Forbes List of Top R&D Spenders in 2011

Chapter 6 - Connector Industry Outlook 2015-25 Summary

  • Connector Levels of Packaging
  • Market Analysis
  • Top 10 as a Percentage of Total Connector Market 2003-2013
  • Key Industry Needs
  • Key Parameters - Consolidated across Connector Types
  • Key Attributes Metallic Connectors 2015 -2025
  • Summary by Major Connector Type
  • Manufacturing Infrastructures
  • Technical Barriers
  • Connector Usage Trends by Market Segment, 2015-25
  • 2015-2025 Connector Technology Trends
  • Manufacturing Equipment & Process
  • Infrastructure
  • Electronic Materials
  • Environmental Technology
  • Tons of Recycled Electrical/Electronic Equipment 2006-2014
  • Infrastructure Issues
  • Developed World Manufacturing
  • Maturing of the Industry
  • Connector Outlook Discussion
  • Key Areas for Development
  • Technology Gaps
  • Areas where Solvable Gaps and Showstoppers Could Occur
  • Selected Product Outlook 2015-25
  • Photovoltaic Systems and Interconnect
  • World Solar Module Forecast 2008-2023
  • PV Connector Types/Technology
  • Wire-to-Board Connectors (WTB)
  • Miniature Wire-to-Board (WTB) Connectors - 2000-2025 Roadmap
  • Processor Sockets 2000-2025 Roadmap
  • Dual In-Line Memory Sockets 2000-2025 Roadmap
  • Automotive Batteries and Connectors
  • Background
  • World Unit Percent and Volume Passenger Cars 2008-2025 and Related Battery Pack Volumes
  • Connectors
  • Battery Applications, Connector Projections, 2000-2025 Roadmap
  • USB Connectors
  • Super-Speed USB
  • Universal Serial Bus (USB) Connectors 2000-2025 Roadmap
  • PCB Connectors 2000-2025 Roadmap
  • Generic PCB Connectors 2000-2025 Roadmap
  • 2mm Backplane Connectors 2000-2025 Roadmap
  • High Performance Backplane Connectors
  • Fiber Optic Connectors
  • Background
  • FO Deployment
  • There are Formidable Roadblocks to an all-Si Photonics System
  • Available Elements of a Photonic System
  • Future Breakthroughs
  • Fiber Optic Connectors 2000-2025
  • Some of Mellanox FO Active/Passive Cable Assemblies
  • Optical Backplanes
  • Cable Assemblies
  • Some Types of Cable
  • TIA Part 568 Cat 5-7 Cable 2000-2025 Roadmap
  • Industrial Ethernet Cable 2000-2025 Roadmap
  • Plenum/Riser Cable - Commercial Buildings 2000-2025 Roadmap
  • Video Interface Connectors
  • Video Interface Connectors 2009-2025 Roadmap
  • VGA Connectors 2009-2025 Roadmap
  • Thunderbolt/Lightpeak - Display Port Connector 2011-2025 Roadmap
  • Test & Burn-In Sockets
  • Critical Issues
  • Test Socket Technology Trends
  • Test
  • Burn-In
  • Test & Burn-In Sockets 2003-2025 Roadmap
  • Test-in-Tray and Gang Testing
  • Test-in-Tray Automation 2009-2025 Roadmap
  • LED Lighting Connector Products
  • LED Lighting Penetration 2000-2030
  • Recommendations for Connector Industry Research & Development
  • Looking through a Crystal Ball, What will be THE Major Equipment Applications of the Next Decade?
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