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市場調查報告書
連接器種類與技術可望成長
Connector Types And Technologies Poised For Growth
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連接器種類與技術可望成長 是由出版商Bishop & Associates, Inc.在2010年02月所出版的。
這份英文市場調查報告書價格從美金3500起跳。
本研究報告針對成長中的連接器種類與促進連接器成長的新型電子產品與技術進行詳細分析調查，提供各種連接器產品概要、典型應用、2013為止全球預測、市場動向等情報，內容摘記如下。
第1章 調査範圍・調査方法
第2章 序論
第3章 USB連接器
- 成長促進因素
- 產品説明/性能評價
- 產品應用/市場資料
第4章 視訊界面連接器
第5章 HDMI連接器
第6章 電池連接器
第7章 FFC/FEC/FPC連接器
第8章 高速背板連接器
第9章 高速夾層連接器
第10章 SAS連接器
第11章 SATA連接器
第12章 小尺寸插拔連接器
第13章 電源連接器
第14章 PCI express連接器
第15章 光纖連接器
第16章 嵌入式電腦用連接器
第17章 耐環境/高耐久型連接器
第18章 醫療連接器
第19章 替代能源連接器
第20章 自動車連接器
第21章 新型內部連接技術
- 序論
- RJ45連接器在10/40/100GB乙太網路的應用
- 表面黏著技術(SMT)
- 85-ohm阻抗連接器設計
- 電力/温度管理
- 系統晶片(SoC)技術
- EMI/ESD保護
- 奈米科技
- 正交中平面結構
- 固體照明、等
第22章 整體市場動向
- 序論
- 第二來源的許可
- 行動設備的增加
- 材料價格對連接器的影響
- 産業規格的增加
- 主要新產品設計目的與課題
- 環境保護的使命
- 景氣復甦
第23章 主要調査結果與摘要
附錄A
附錄B
附錄C
Abstract
Bishop and Associates, Inc. has just released a 23 chapter report
providing a detailed analysis of Connector Types and Technologies Poised for
Growth. This new report addresses a list of 19 specific connector types that
are expected to experience greater than average growth in either volume or
sales based on the rapid expansion of markets for existing and new products
that utilize these interfaces. New technologies already driving the market as
well as emerging technologies that are poised to influence connector design
and/or application are reviewed. A discussion of market trends that are
changing the way electronic connectors are used is included Each connector
type is defined with a product description including key mechanical and
electrical performance characteristics, as well as the rational for its
selection. Typical applications are also identified. A global market value and
forecast to 2013 documents our growth expectations for each connector type.
Many of the selected interfaces have existed in the market for several years,
but emerging applications will propel their growth well beyond that of the
general connector market. Some legacy connector types, for instance, are being
adapted to high-speed differential signaling, which will allow implementation
in nextgeneration equipment. In other cases, entirely new interfaces will show
logarithmic percentage growth from near zero as they are implemented in new
high-volume applications.
Issues covered in this report include:
- Which existing connector types are poised for exceptional sales growth?
- What new electronic products and technologies are driving this connector
growth?
- How will the current global economic recession and recovery impact the
adoption rate of new interfaces?
- Which industry segments will utilize these connectors?
- Which segments will require the development of entirely new interfaces to
address specific applications?
- Who are the leading manufacturers of these connectors?
- How are power connectors being adapted to provide greater power and signal
density while supporting system thermal management strategies?
- How do connector manufacturers differentiate their products defined by an
industry specification?
- What specific applications will drive the growth of these connectors?
- What is the forecasted global market value of these growth connectors over
the 2009 through 2013 period?
- How much of this growth will be influenced by formal, defacto or
special-interest-group-generated standards?
- What is driving increasing interest in electronic system design that
conforms to standardized hardware platforms?
- Which exiting connectors, defined by an industry standard, will continue
to evolve in terms of bandwidth and signal density?
- Will new system packaging techniques such as orthogonal midplane designs
become widely adopted over the next three to five years?
- Will new material technology change the way connectors are designed,
fabricated and utilized?
- Will systems based on 85-ohm impedance dominate the industry or co-exist
with 100-ohm systems?
- How will system designer demand for higher speed and density interfaces
influence the development of next-generation connector technology?
- Are one-piece, high-performance edge connectors experiencing a resurgence?
Why?
- Has the performance/cost curve of fiber-optic connectors finally tipped
the advantage to fiber over copper in I/O applications?
- How will global environmental mandates influence the design of future
interconnects?
- How is the convergence of computing, communications and consumer
entertainment influencing the design of interconnects?
- What new classes of products, such as wireless video, light-emitting diode
illumination and alternative energy generation, will require the development
of new interconnect systems?
- What technology gaps exist that must be addressed in order to satisfy
next-generation equipment interconnect requirements?
- What effect will the adoption of wireless devices have on copper cabling
and connectors?
- How are design engineers addressing potentially conflicting objectives of
signal density, power density and thermal density?
- How is the trend toward mobile computing, communication and entertainment
influencing the ability to deliver power?
- Will smaller semiconductor geometries suffer from reduced resistance to
ESD damage?
- In what applications are high-speed Ethernet and Infiniband protocols most
effectively applied?
- How are global demographics influencing the development of new electronic
products as well as overall market size?
- How are high-speed backplane and I/O connectors evolving to address the
issues of 40 to 100 Gb/s bandwidth? Are copper 40+ Gb/s interfaces a viable
solution, or has copper finally reached its practical bandwidth limit?
- How will connector manufacturers address potentially conflicting
requirements for identical second sources and protection of intellectual
property?
- Will Serial ATA and SAS continue to dominate the storage interconnect
landscape?
- What new interfaces will dominate emerging automotive applications
including infotainment, networking, power management and battery charging?
- How will cloud computing and hardware virtualization influence the markets
for computing equipment in the future?
Table of Contents
Chapter 1 - Report Scope and Methodology
- Issues explored1
- Methodology & approach
Chapter 2 - Introduction
- Introduction
- Product selection process and criteria
Chapter 3 - Universal Serial Bus Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 4 - DisplayPort Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 5 - HDMI Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 6 - Battery Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 7 - FFC/FEC/FPC Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 8 - High-Speed Backplane Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 9 - High-Speed Mezzanine Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 10 - SAS Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 11 - SATA Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 12 - Small Form Factor Pluggable Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 13 - Power Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 14 - PCI Express Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 15 - Fiber Optic Connectors
- Growth drivers
- Product description / performance ratings
- Product market data
Chapter 16 - Connectors for Embedded Computing
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 17 - Environmental Resistant / Ruggedized Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 18 - Medical Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 19 - Alternative Energy Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 20 - Automotive Connectors
- Growth drivers
- Product description / performance ratings
- Product application / market data
Chapter 21 - Evolving Interconnect Technologies
- Introduction
- RJ45 Connectors in 10/40/100 Gigabit Ethernet applications
- Surface mount technology
- Connectors designed for 85-ohm impedance
- Power / thermal management
- System-On-Chip technology
- EMI / ESD protection
- Nano technology
- Orthogonal midplane architecture
- Solid-state illumination
- Increasing demand for high-speed design support
- Conflicting system packaging mandate
- Advancing technologies impacting connector utilization
- Ethernet and InfiniBand
Chapter 22 - Significant Market Trends
- Introduction
- Licensing of second sources
- Growth of mobile devices
- Impact of material prices on connectors
- Proliferation of industry standards
- Key new product design objectives and challenges
- Environmental protection mandates
- Economic recovery
Chapter 23 - Major Findings and Conclusions
Appendix A - Connector Definitions
Appendix B - Levels of packaging
Appendix C - Report contributors
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