Abstract
Wireless M2M and Mobile Broadband Devices is a comprehensive report analysing
the worldwide market for wireless data modules and terminals.
This strategic research report from Berg Insight provides you with 120 pages
of unique business intelligence including 5-year industry forecasts and expert
commentary on which to base your business decisions.
This report will allow you to:
- Understand the worldwide market for wireless M2M and mobile
broadband devices.
- Anticipate future trends and technology developments.
- Evaluate the business opportunities in the main vertical market
segments.
- Identify potential customers, partners and competitors on a highly
competitive global market.
- Comprehend the differences and commonalities between Europe, North
America and other regions.
- Profit from valuable insights about the most successful business
and technology propositions on the market.
Table of Contents
Table of Contents
List of Figures
Executive summary
1. Wireless M2M and mobile broadband data technology
- 1.1 Wireless and GPS chipsets
- 1.1.1 Wireless chipsets
- 1.1.2 GPS chipsets
- 1.2 Network communication technologies
- 1.2.1 Short and medium range wireless network technologies
- 1.2.2 Cellular mobile communication technologies
- 1.3 Wireless M2M data modules and terminals
- 1.3.1 M2M data modules
- 1.3.2 M2M terminals and devices
- 1.4 Mobile broadband modules and terminals
- 1.4.1 PC cards and ExpressCards
- 1.4.2 Embedded modules
- 1.4.3 Desktop modems and routers
2. Wireless chipset and GPS vendors
- 2.1 Wireless chipset vendor profiles
- 2.1.1 Agere Systems
- 2.1.2 Analog Devices
- 2.1.3 Freescale
- 2.1.4 Infineon
- 2.1.5 NXP Semiconductors
- 2.1.6 Qualcomm
- 2.1.7 Texas Instruments
- 2.2 GPS chipset and module vendor profiles
- 2.2.1 Fastrax
- 2.2.2 Global Locate
- 2.2.3 SiRF
- 2.2.4 Trimble
- 2.2.5 u-blox
3.M2M module and terminal vendors
- 3.1 Siemens Wireless Modules
- 3.1.1 Product strategy
- 3.1.2 Market strategy
- 3.2 Wavecom
- 3.2.1 Product strategy
- 3.2.2 Market strategy
- 3.3 Motorola
- 3.3.1 Product strategy
- 3.3.2 Market strategy
- 3.4 Enfora
- 3.4.1 Product strategy
- 3.4.2 Market strategy
- 3.5 Telit
- 3.5.1 Product strategy
- 3.5.2 Market strategy
- 3.6 Kyocera Wireless
- 3.7 Sagem
- 3.8 SIM Technology
- 3.9 Wireless M2M terminal vendors
- 3.9.1 Alpha Micro
- 3.9.2 Blue Tree Wireless Data
- 3.9.3 CalAmp
- 3.9.4 Dr. Neuhaus
- 3.9.5 Falcom
- 3.9.6 Owasys
- 3.9.7 Telesincro
- 3.9.8 Telular
- 3.9.9 BOX Telematics
- 3.9.10 CI Omnibridge
- 3.9.11 Cobra Automotive Technologies
- 3.9.12 DigiCore
- 3.9.13 MetaSystem
- 3.9.14 Trackm8
- 3.9.15 Trafficmaster
- 3.9.16 Viasat
- 3.9.17 WebTech Wireless
4.Mobile broadband vendors
- 4.1 Option
- 4.1.1 Product strategy
- 4.1.2 Market strategy
- 4.2 Novatel Wireless
- 4.2.1 Product strategy
- 4.2.2 Market strategy
- 4.3 Sierra Wireless
- 4.3.1 Product strategy
- 4.3.2 Market strategy
- 4.4 Ericsson
- 4.5 Huawei
- 4.6 Nokia
- 4.7 ZTE
- 4.8 Wireless broadband gateway and modem vendors
- 4.8.1 4G Systems
- 4.8.2 AnyDATA
- 4.8.3 Digi International
- 4.8.4 Sarian Systems
- 4.8.5 Topex
- 4.8.6 Zadako
5.Hardware and wireless data communication integration
- 5.1 Vehicle telematics
- 5.1.1 OnStar
- 5.1.2 Crown Telecom 24Horas vehicle telematics service
- 5.1.3 The European eCall initiative
- 5.2 Utility metering and AMM
- 5.2.1 Drivers and barriers for AMM in Europe and North America
- 5.2.2 AMM infrastructure
- 5.2.3 AMM system integration
- 5.3 WWAN connectivity for mobile computing
- 5.3.1 Module integration process
- 5.3.2 Key notebook and embedded module vendors
- 5.3.3 Dell and Novatel Wireless
6. Worldwide market forecasts and trends
- 6.1 Wireless M2M market summary
- 6.2 Vehicle telematics
- 6.3 Utility meters
- 6.4 Retail and banking
- 6.5 Security systems
- 6.6 Other M2M applications
- 6.7 Embedded mobile broadband modules for notebooks and UMPCs
Glossary
List of Figures
- Figure 1.1: Examples of wireless module chipset vendors, by IC function
- Figure 1.2: Selection of GPS chipset, module and board vendors
- Figure 1.3: Examples of unlicensed radio bands worldwide
- Figure 1.4: Wireless technology range versus throughput
- Figure 1.5: Cellular wireless standards
- Figure 1.6: Cost versus time diagram for wireless technology integration
- Figure 1.7: Natural size wireless M2M modules
- Figure 1.8: Examples of M2M terminal vendors
- Figure 1.9: HSDPA PC card, PCI Express Mini Card and wireless desktop
router
- Figure 2.1: Key wireless chipset vendors
- Figure 2.2: Examples of ADI' s wireless chipsets
- Figure 2.3: Examples of Freescale wireless platforms
- Figure 2.4: Examples of Infineon wireless ICs
- Figure 2.5: Examples of NXP wireless ICs
- Figure 2.6: Examples of Qualcomm wireless chipsets
- Figure 2.7: Examples of Texas Instruments wireless chipsets
- Figure 2.8: Fastrax iTrax MP OEM receiver modules
- Figure 2.9: Global Locate integrated GPS ICs
- Figure 2.10: SiRF chips for wireless applications
- Figure 2.11: Examples of Trimble GPS modules and tracking devices
- Figure 2.12: Low power, high sensitivity chip solutions from u-blox
- Figure 3.1: Principal cellular M2M communication module vendors
- Figure 3.2: Siemens range of wireless modules and terminals
- Figure 3.3: Open AT Software environment
- Figure 3.4: Wavecom range of wireless modules and terminals
- Figure 3.5: Motorola' s range of wireless modules
- Figure 3.6: Examples of Enfora' s range of wireless modules and terminals
- Figure 3.7: Telit range of CDMA/GSM/GPRS modules
- Figure 3.8: Sagem wireless M2M modules
- Figure 3.9: SIM Technology' s wireless modules
- Figure 3.10: CalAmp Skybility product overview
- Figure 3.11: Falcom GSM/GPRS product overview
- Figure 4.1: Wireless connectivity solution vendors for the mobile
computing market
- Figure 4.2: PC card and PCI Express Mini Card embedded module
- Figure 4.3: Wireless connectivity device revenues (Worldwide 2006)
- Figure 4.4: Examples of Option' s wireless connectivity products
- Figure 4.5: Novatel Wireless' range of wireless embedded modules and
ExpressCards
- Figure 4.6: Examples of Sierra Wireless embedded wireless modules and PC
cards
- Figure 4.7: Huawei' s range of wireless modules and data cards
- Figure 5.1: Registered vehicles and annual sales, EU 23+2 and North America
- Figure 5.2: Sales of OnStar equipped vehicles and OnStar subscribers
- Figure 5.3: eCall establishment and lifecycle
- Figure 5.4: Household power consumption and retail prices (Europe and
North America)
- Figure 5.5: Advanced metering penetration by state (USA 2006)
- Figure 5.6: Mixed multipoint and point-to-point AMM infrastructure
- Figure 5.7: Embedded module integration process
- Figure 5.8: Major notebook and wireless module vendors
- Figure 6.1 Worldwide wireless M2M module shipments forecast by application
- Figure 6.2: Wireless M2M module shipments by region (2006- 2011)
- Figure 6.3: Shipments of vehicle telematics units (2006- 2011)
- Figure 6.4: Shipments of wireless M2M modules for utility metering (2006-
2011)
- Figure 6.5: Shipments of wireless M2M modules for retail and banking
(2006- 2011)
- Figure 6.6: Shipments of wireless M2M modules for security systems (2006-
2011)
- Figure 6.7: Shipments of wireless M2M modules for other segments (2006-
2011)
- Figure 6.8: Shipments of embedded notebook broadband modules (2006- 2011)
- Figure 6.9: Worldwide notebook and UMPC shipments and WWAN module attach
rate
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