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市場調查報告書

全球SiP(系統級封裝)晶片技術市場

System-in-Package (SiP) Die Technologies and Global Markets

出版商 BCC Research 商品編碼 296883
出版日期 內容資訊 英文 173 Pages
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全球SiP(系統級封裝)晶片技術市場 System-in-Package (SiP) Die Technologies and Global Markets
出版日期: 2014年02月28日 內容資訊: 英文 173 Pages
簡介

全球SiP(系統級封裝)型晶片組的整體銷售額,2012年約150億。該市場今後預計以6.7%的年複合成長率擴大,銷售額預計從2013年的163億到2018年達到225億。

本報告提供全球SiP(系統級封裝)晶片組市場相關調查、全球市場概要與趨勢(實際成果、估計、年複合成長率預測)分析、依二個主要標準(晶片技術、終端應用)的市場明細、各產業市場分析,及主要企業簡介等,為您概述為以下內容。

第1章 簡介

第2章 摘要整理

第3章 SIP的理論的概要

  • 定義
  • 出貨的地區性分析
  • SIP實施中包含的階段
  • SIP市場分析:晶片的結構
  • 半導體的理解
  • 基板與其包裝的作用
  • SIP型晶片組市場明細:終端使用應用領域
  • SIP的特徵和優點
  • SIP的限制與課題
  • SOC:競爭手法

第4章 全球SIP支援晶片組市場

  • 通訊
  • 測量、科學研究
  • 醫藥品
  • 能源、國防及監視
  • 家電
  • 產業、汽車
  • 零售、其他

第5章 地區分析:南北美洲

  • 地區的主要國家市場概要
  • 詳細的市場標準
  • 主要國家簡介
    • 美國
    • 巴西
    • 加拿大
    • 墨西哥

第6章 地區分析:EMEA

  • 地區的主要國家市場概要
  • 主要國家簡介
    • 德國
    • 法國
    • 英國
    • 義大利
    • 俄羅斯
    • 西班牙
    • 荷蘭
    • 土耳其

第7章 地區分析:亞太地區

  • 地區的主要國家市場概要
  • 主要國家簡介
    • 中國
    • 日本
    • 印度
    • 印尼
    • 韓國

第8章 主要相關利益者、企業

  • 獨立包裝服務供應商
  • 半導體製造公司
  • 半導體設備、零組件廠商
  • OEM
  • EDA(電子設計自動化)企業
  • 包裝材料費供應商、設備廠商
  • 主要企業簡介

第9章 專利分析

圖表清單

目錄
Product Code: SMC091A

Global sales for System-in-Package (SiP)-based chipsets totaled nearly $15 billion in 2012. This market is expected to grow at a compound annual growth rate (CAGR) of 6.7% from nearly $16.3 billion forecast for 2013 to $22.5 billion forecast for 2018.

This report provides:

  • An overview of the global market for System-in-Package (SiP) chipsets.
  • Analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) through 2018.
  • A breakdown of the market along two major criteria; die technologies and end-use applications.
  • A look at many market verticals including telecommunications; medicine; computing and entertainment; consumer electronics, instrumentation and scientific research; energy, defense, and surveillance; and industrial and automotive.
  • Comprehensive profiles of leading companies in the industry.

REPORT SCOPE

INTRODUCTION

System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format.

SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex.

SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP's simplicity has opened a wide array of uses for it in less than a decade since its inception. However, SiP also faces significant challenges in being able to assure form yield maximization.

This report attempts to weigh the positives of SiP with the negatives in quantitative as well as qualitative contexts.

STUDY GOALS AND OBJECTIVES

This study has the following goals and objectives:

  • Measuring and forecasting the global market size for SiP-based chipsets in value (dollar sales) and volume (shipment sales) terms.
  • Breaking down the market for global SiP-enabled chipsets components along the following end applications in value and volume terms: telecommunications; instrumentation and scientific research; medicine; energy, defense and surveillance; consumer electronics; industrial and automotive; retail; and others.
  • Breaking down individual SiP-enabled chipset end-use applications along the following die compositions in value and volume terms: compound semiconductors and silicon (Si).
  • Breaking down individual SiP-enabled chipset end-use applications along the following regions in value and volume terms: the Americas; Europe, Middle East and Africa (EMEA); and Asia-Pacific (APAC).
  • Breaking down individual SiP-enabled chipset end-use applications along the following countries in value and volume terms: U.S., Brazil, Canada, Mexico, Germany, U.K., France, Italy, Spain, Russia, the Netherlands, Turkey, China, Japan, India, Indonesia and South Korea.
  • Analyzing the stakeholder landscape in the SiP-enabled chipset value chain.
  • Analyzing the patenting activity involving SiP-enabled chipsets.

REASONS FOR DOING THE STUDY

SiP is unique in its ability to combine the principles of electronic circuit design along with that of semiconductor packaging. It is also the only packaging technique that is pitted against SoC, a completely different methodology of integrating multiple functionalities. The simplicity of SiP makes it possible to combine diverse functionalities that SoC cannot cater to.

SiP thus caters to a wide array of uses across application areas. This report is an effort to quantify the market in terms of dollar sales and shipment volumes-a departure from the predominantly service-focused coverage of the semiconductor-packaging market.

SiP-based chipsets are essentially systems or subsystems that combine multiple passive components and active dies. The quantification of such subsystems is not the mainstream tracking mode. Most market studies track the market at individual component level-active or passive. This report quantifies the entire package, which provides new insight into the market dynamics.

This report also sheds light on the challenges and limitations faced by SiP. It also gives due coverage to alternative integration methodologies, such as SoC. This look at the alternatives provides a balance to the report coverage.

Essentially, the report focuses on end-use applications, which can be easily quantified and whose physical attributes can be compared, contrasted, tracked and analyzed.

Each end-use application has its own dynamics, benefits and challenges with respect to levels of adoption of SiP-enabled chipsets. On a larger note, each end-use application has its own market momentum dictated by the health of the regional and country markets. When these aspects are mapped for individual countries, they produce a fascinating collage of local market conditions that add to the larger picture. This report provides a refined view of individual country markets in volume and value terms for 17 key nations spanning all global regions.

SCOPE OF THE REPORT

The report measures and forecasts the size of the market in current U.S. dollars as well as in millions of shipment units for chipsets packaged using SiP.

The report forecasts the market size for the following:

  • Individual end-use application such as telecommunications; instrumentation and scientific research; medicine; energy, defense and surveillance; consumer electronics; industrial and automotive; retail; and others.
  • The above forecasts are classified in terms of die compositions, geographical regions and countries on volume and value bases; they are also classified in terms of value chain contributors on a value basis.

The Executive Summary provides a snapshot of key findings of the report.

The chapter on theoretical overview of SiP defines SiP and explains its morphology. SiP is placed in the context of other advanced packaging techniques, and a wider view is presented of where semiconductor packaging itself fits in the device-synthesis chain. The chapter dwells on simple and compound semiconductors and elaborates their pros and cons. Further, a high-level view of the SiP market is provided.

The chapter on global markets for SiP-enabled chipsets provides a closer look at the global market for those chipsets. End-use applications are used as the principal classification factor, and individual end-application markets are broken down by region and die composition.

The chapter on regional analysis for the Americas presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as the U.S., Brazil, Canada and Mexico.

The chapter on regional analysis for EMEA presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as Germany, France, the U.K., Spain, Italy, Russia, the Netherlands and Turkey.

The chapter on regional analysis for APAC presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as China, Japan, India, South Korea and Indonesia.

The chapter on major stakeholders and key companies identifies the influential stakeholder categories and leading companies that dominate the market for SiP-based chipsets.

The U.S. Patent Analysis chapter analyzes the U.S. patents granted in the relevant areas of SiP. The chapter classifies the patents awarded according to categories such as: analog-digital converter (ADC), digital-analog converter (DAC), radiofrequency (RF), antenna and other communication-component-specific integration; assembly and integration end-to-end process; bond, resin, solder, interposer and lead frame; design and alignment; die stacking and side-by-side placement facilitation; end-application-specific innovation-data transmission; memory-component-specific innovation; passive component integration; performance testing and verification; and power management, heat sink, inductor and capacitor.

INTENDED AUDIENCE

This report will be relevant to the following audiences:

  • Semiconductor-packaging-service providers, to analyze the relative potency of end-application sectors further broken down by die compositions, geographical regions and key country markets.
  • Semiconductor foundries, to formulate frameworks and standards based on demand for specific end application and die composition.
  • Semiconductor-device makers, to analyze the relative potency of end-application sectors further broken down by die compositions, geographical regions and key country markets; as well as to compare and contrast SiP with SoC.
  • SiP material and packaging-equipment suppliers, to identify the potential of their output across leading SiP end applications.
  • Original equipment manufacturers, to analyze the benefits and prospects of SiP-enabled chipsets used by them in their devices, equipment and products.

Table of Contents

CHAPTER 1 INTRODUCTION

  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • SCOPE OF THE REPORT
  • INTENDED AUDIENCE
  • METHODOLOGY AND INFORMATION SOURCES
  • ABOUT THE AUTHOR
  • RELATED BCC RESEARCH REPORTS
  • BCC RESEARCH ONLINE SERVICES
  • DISCLAIMER

CHAPTER 2 EXECUTIVE SUMMARY

  • SUMMARY TABLE DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018 ($ MILLIONS)
  • SUMMARY FIGURE DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, 2011-2018 ($ MILLIONS)

CHAPTER 3 THEORETICAL OVERVIEW OF SIP

  • DEFINITION
  • REGIONAL ANALYSIS OF SHIPMENTS
  • TABLE 1 SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • UNDERSTANDING SEMICONDUCTOR PACKAGING
    • SEMICONDUCTOR MANUFACTURING STAGES
    • FIGURE 1 POSITION OF PACKAGING AND TESTING IN SEMICONDUCTOR MANUFACTURING CYCLE
    • TYPES OF ADVANCED PACKAGING TECHNIQUES
  • STEPS INVOLVED IN SIP IMPLEMENTATION
  • SIP MARKET BREAKDOWN BY DIE COMPOSITION
  • TABLE 2 DOLLAR SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 3 SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • UNDERSTANDING SEMICONDUCTORS
    • THE CHEMISTRY OF SEMICONDUCTOR ELEMENTS
    • THE TITANIUM FAMILY
    • THE BORON FAMILY
      • COMPOUND SEMICONDUCTORS
    • LATTICE PARAMETER
    • BAND-GAP ENGINEERING
    • HETEROSTRUCTURE AND HETEROJUNCTIONS
    • ADVANTAGES OF COMPOUND SEMICONDUCTORS
    • GROUP III-V: NITRIDES, ANTIMONIDES, PHOSPHIDES AND ARSENIDES
    • TABLE 4 GROUP III-V COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
      • Gallium Arsenide
      • Indium Phosphide
      • Gallium Nitride
    • GROUP II-VI: OXIDES, SULFIDES, SELENIDES AND TELLURIDES
    • TABLE 5 GROUP II-VI COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
      • Zinc Selenide
      • Cadmium Telluride
      • Cadmium Zinc Telluride
      • Mercury Cadmium Telluride
    • GROUP IV: SILICON-BASED COMPOUNDS AND ALLOYS
    • TABLE 6 GROUP IV COMPOUND SEMICONDUCTORS
      • Silicon Germanium
      • Silicon Carbide
    • OTHERS
    • TABLE 7 OTHER COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
  • SUBSTRATES AND THEIR ROLE IN PACKAGING
  • BREAKDOWN OF SIP-BASED CHIPSET MARKET BY END APPLICATIONS
  • TABLE 8 DOLLAR SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 9 SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • FEATURES AND BENEFITS OF SIP
    • SIZE EFFICIENCY
    • PERFORMANCE ENHANCEMENT
    • DESIGN AND REVIEW FLEXIBILITY
    • COST ADVANTAGE
    • REDUCED TIME-TO-MARKET
  • LIMITATIONS AND CHALLENGES FOR SIP
    • LIMITED AVAILABILITY OF SKILLS AND RESOURCES
    • RE-ALIGNMENT OF EDA PROCESSES
    • LACK OF KGD
    • LARGER PACKAGE SIZE AS COMPARED TO SOC
    • PRESSURES ON WAFERING PROCESS
  • SOC-THE COMPETING METHODOLOGY

CHAPTER 4 GLOBAL MARKETS FOR SIP-ENABLED CHIPSETS

  • TELECOMMUNICATIONS
    • OVERVIEW OF DRIVERS AND APPLICATIONS
    • BREAKDOWN BY REGION
    • TABLE 10 DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
    • TABLE 11 SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • BREAKDOWN BY DIE COMPOSITION
    • TABLE 12 DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
    • TABLE 13 SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • INSTRUMENTATION AND SCIENTIFIC RESEARCH
    • OVERVIEW OF DRIVERS AND APPLICATIONS
    • BREAKDOWN BY REGION
    • TABLE 14 DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
    • TABLE 15 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • BREAKDOWN BY DIE COMPOSITION
    • TABLE 16 DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
    • TABLE 17 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • MEDICINE
    • OVERVIEW OF DRIVERS AND APPLICATIONS
    • BREAKDOWN BY REGION
    • TABLE 18 DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
    • TABLE 19 SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • BREAKDOWN BY DIE COMPOSITION
    • TABLE 20 DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
    • TABLE 21 SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • ENERGY, DEFENSE AND SURVEILLANCE
    • OVERVIEW OF DRIVERS AND APPLICATIONS
    • BREAKDOWN BY REGION
    • TABLE 22 DOLLAR SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
    • TABLE 23 SHIPMENT SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • BREAKDOWN BY DIE COMPOSITION
    • TABLE 24 DOLLAR SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
    • TABLE 25 SHIPMENT SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • CONSUMER ELECTRONICS
    • OVERVIEW OF DRIVERS AND APPLICATIONS
    • BREAKDOWN BY REGION
    • TABLE 26 DOLLAR SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
    • TABLE 27 SHIPMENT SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • BREAKDOWN BY DIE COMPOSITION
    • TABLE 28 DOLLAR SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
    • TABLE 29 SHIPMENT SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY DIE COMPOSITION (MILLIONS OF UNITS)
  • INDUSTRIAL AND AUTOMOTIVE
    • OVERVIEW OF DRIVERS AND APPLICATIONS
    • BREAKDOWN BY REGION
    • TABLE 30 DOLLAR SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND
    • AUTOMOTIVE END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
    • TABLE 31 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND
    • AUTOMOTIVE END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • BREAKDOWN BY DIE COMPOSITION
    • TABLE 32 DOLLAR SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
    • TABLE 33 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • RETAIL AND OTHERS
    • OVERVIEW OF DRIVERS AND APPLICATIONS
    • BREAKDOWN BY REGION
    • TABLE 34 DOLLAR SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
    • TABLE 35 SHIPMENT SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
    • BREAKDOWN BY DIE COMPOSITION
    • TABLE 36 DOLLAR SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
    • TABLE 37 SHIPMENT SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)

CHAPTER 5 REGIONAL ANALYSIS-AMERICAS

  • SNAPSHOT OF KEY COUNTRY MARKETS IN THE REGION 67
  • TABLE 38 DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE AMERICAS REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 39 SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE AMERICAS REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • DETAILED MARKET METRICS
  • TABLE 40 DOLLAR SALES OF SIP-BASED CHIPSETS TO THE AMERICAS REGION, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 41 SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE AMERICAS REGION, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • MAJOR COUNTRY PROFILES
    • U.S.
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 42 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE U.S., THROUGH 2018
      • Health of End Applications
      • TABLE 43 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE U.S., BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 44 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR U.S., BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • BRAZIL
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 45 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR BRAZIL 75
      • Health of End Applications
      • TABLE 46 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR BRAZIL, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 47 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR BRAZIL, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • CANADA
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 48 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR CANADA, THROUGH 2018
      • Health of End Applications
      • TABLE 49 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR CANADA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 50 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR CANADA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • MEXICO
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 51 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR MEXICO, THROUGH 2018
      • Health of End Applications
      • TABLE 52 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR MEXICO, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 53 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR MEXICO, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview

CHAPTER 6 REGIONAL ANALYSIS-EMEA

  • SNAPSHOT OF KEY COUNTRY MARKETS IN THE REGION
  • TABLE 54 DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE EMEA REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 55 SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE EMEA REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 56 DOLLAR SALES OF SIP-BASED CHIPSETS TO THE EMEA REGION, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 57 SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE EMEA REGION, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • MAJOR COUNTRY PROFILES
    • GERMANY
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 58 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR GERMANY, THROUGH 2018
      • Health of End Applications
      • TABLE 59 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR GERMANY, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 60 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR GERMANY, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • FRANCE
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 61 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR FRANCE, THROUGH 2018
      • Health of End Applications
      • TABLE 62 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR FRANCE, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 63 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR FRANCE, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • U.K
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 64 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE U.K., THROUGH 2018
      • Health of End Applications
      • TABLE 65 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE U.K., BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 66 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR THE U.K., BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • ITALY
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 67 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR ITALY, THROUGH 2018
      • Health of End Applications
      • TABLE 68 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR ITALY, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 69 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR ITALY, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • RUSSIA
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 70 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR RUSSIA, THROUGH 2018
      • Health of End Applications
      • TABLE 71 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR RUSSIA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 72 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR RUSSIA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • SPAIN
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 73 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR SPAIN, THROUGH 2018
      • Health of End Applications
      • TABLE 74 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR SPAIN, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 75 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR SPAIN, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • THE NETHERLANDS
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 76 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE NETHERLANDS, THROUGH 2018
      • Health of End Applications
      • TABLE 77 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE NETHERLANDS, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 78 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR THE NETHERLANDS, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • TURKEY
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 79 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR TURKEY
      • Health of End Applications
      • TABLE 80 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR TURKEY, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 81 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR TURKEY, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview

CHAPTER 7 REGIONAL ANALYSIS-APAC

  • SNAPSHOT OF KEY COUNTRY MARKETS IN THE REGION
  • TABLE 82 DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE APAC REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 83 SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE APAC REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • OVERALL MARKET METRICS
  • TABLE 84 DOLLAR SALES OF SIP-BASED CHIPSETS TO THE APAC REGION, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 85 SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE APAC REGION, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • MAJOR COUNTRY PROFILES
    • CHINA
      • State of SiP, Semiconductor Packaging and the larger Semiconductor Industry in the Country
      • TABLE 86 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR CHINA, THROUGH 2018
      • Health of End Applications
      • TABLE 87 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR CHINA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 88 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR CHINA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • JAPAN
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 89 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR JAPAN, THROUGH 2018
      • Health of End Applications
      • TABLE 90 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR JAPAN, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 91 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR JAPAN, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • INDIA
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 92 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR INDIA, THROUGH 2018
      • Health of End Applications
      • TABLE 93 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR INDIA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 94 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR INDIA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • INDONESIA
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 95 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR INDONESIA, THROUGH 2018
      • Health of End Applications
      • TABLE 96 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR INDONESIA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 97 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR INDONESIA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview
    • SOUTH KOREA
      • State of SiP, Semiconductor Packaging and the Larger Semiconductor Industry in the Country
      • TABLE 98 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR SOUTH KOREA, THROUGH 2018
      • Health of End Applications
      • TABLE 99 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR SOUTH KOREA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
      • TABLE 100 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR SOUTH KOREA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
      • Macroeconomic Overview

CHAPTER 8 MAJOR STAKEHOLDERS AND KEY COMPANIES

  • INDEPENDENT PACKAGING-SERVICES PROVIDERS
  • SEMICONDUCTOR FOUNDRIES
  • SEMICONDUCTOR-DEVICE AND COMPONENT MAKERS
  • ORIGINAL EQUIPMENT MANUFACTURERS (OEMS)
  • ELECTRONIC DESIGN AUTOMATION (EDA) PLAYERS 1
  • PACKAGING-MATERIAL SUPPLIERS AND EQUIPMENT MAKERS
  • PROFILES OF KEY COMPANIES 1
    • 3D PLUS
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • AMKOR 1
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • ASE GROUP
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • ATMEL
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • ATP
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK (AT&S)
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • CADENCE
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • ENDICOTT INTERCONNECT (I3 ELECTRONICS)
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • FREESCALE
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • FUJITSU
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • GLOBAL UNICHIP CORP (GUC)
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • INSIGHT SIP
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • KEYASIC
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • KYOCERA
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • MENTOR GRAPHICS
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • NANIUM
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • NXP
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • ORIENT SEMICONDUCTOR ELECTRONICS (OSE)
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • PALOMAR TECHNOLOGIES
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • QPI GROUP
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • QUALCOMM (ATHEROS)
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • RENESAS ELECTRONICS
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • SEQUANS
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • SHINKO ELECTRIC
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • SILEX TECHNOLOGY
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • SILICONWARE PRECISION INDUSTRIES CO., LTD (SPIL)
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • STATS CHIPPAC
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • SUSS MICROTEC
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • TEKTRONIX COMPONENT SOLUTIONS
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • TEXAS INSTRUMENTS (TI)
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • TOSHIBA
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • TSMC
      • Introduction
      • Role in SiP
      • Analysis and Prospects
    • WI2WI
      • Introduction
      • Role in SiP
      • Analysis and Prospects

CHAPTER 9 U.S. PATENT ANALYSIS

  • INTRODUCTION
  • TRENDS BY FUNCTIONAL CATEGORIES
  • TABLE 101 U.S. PATENTS IN SIP BY PATENT CATEGORY, 1976-NOVEMBER 2013
  • TRENDS BY YEAR
  • TABLE 102 U.S. PATENT TRENDS IN SIP BY YEAR OF GRANT, 1976-NOVEMBER 2013
  • TRENDS BY COUNTRY
  • TABLE 103 SHARES OF U.S. PATENTS IN SIP BY COUNTRY OF GRANT, 1976-NOVEMBER 2013
  • TRENDS BY ASSIGNEE
  • TABLE 104 LIST OF ASSIGNEES FOR THE U.S. PATENTS IN SIP, 1976-NOVEMBER 2013
  • TABLE 105 ASSIGNEES OF FOUR OR MORE U.S. PATENTS IN SIP, 1976 THROUGH NOVEMBER 2013

LIST OF TABLES

  • SUMMARY TABLE DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 1 SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 2 DOLLAR SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 3 SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 4 GROUP III-V COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
  • TABLE 5 GROUP II-VI COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
  • TABLE 6 GROUP IV COMPOUND SEMICONDUCTORS
  • TABLE 7 OTHER COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
  • TABLE 8 DOLLAR SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 9 SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 10 DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 11 SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 12 DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 13 SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 14 DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 15 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 16 DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 17 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 18 DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 19 SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 20 DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 21 SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 22 DOLLAR SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 23 SHIPMENT SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 24 DOLLAR SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 25 SHIPMENT SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 26 DOLLAR SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 27 SHIPMENT SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 28 DOLLAR SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 29 SHIPMENT SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY DIE COMPOSITION (MILLIONS OF UNITS)
  • TABLE 30 DOLLAR SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 31 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 32 DOLLAR SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 33 SHIPMENT SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 34 DOLLAR SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 35 SHIPMENT SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 36 DOLLAR SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 ($ MILLIONS)
  • TABLE 37 SHIPMENT SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 38 DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE AMERICAS REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 39 SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE AMERICAS REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 40 DOLLAR SALES OF SIP-BASED CHIPSETS TO THE AMERICAS REGION, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 41 SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE AMERICAS REGION, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 42 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE U.S., THROUGH 2018
  • TABLE 43 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE U.S., BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 44 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR U.S., BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 45 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR BRAZIL
  • TABLE 46 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR BRAZIL, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 47 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR BRAZIL, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 48 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR CANADA, THROUGH 2018
  • TABLE 49 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR CANADA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS) 80
  • TABLE 50 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR CANADA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS) 81
  • TABLE 51 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR MEXICO, THROUGH 2018 83
  • TABLE 52 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR MEXICO, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 53 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR MEXICO, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 54 DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE EMEA REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 55 SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE EMEA REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 56 DOLLAR SALES OF SIP-BASED CHIPSETS TO THE EMEA REGION, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 57 SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE EMEA REGION, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 58 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR GERMANY, THROUGH 2018
  • TABLE 59 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR GERMANY, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 60 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR GERMANY, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 61 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR FRANCE, THROUGH 2018
  • TABLE 62 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR FRANCE, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 63 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR FRANCE, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 64 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE U.K., THROUGH 2018
  • TABLE 65 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE U.K., BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 66 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR THE U.K., BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 67 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR ITALY, THROUGH 2018
  • TABLE 68 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR ITALY, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 69 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR ITALY, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 70 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR RUSSIA, THROUGH 2018
  • TABLE 71 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR RUSSIA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 72 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR RUSSIA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 73 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR SPAIN, THROUGH 2018
  • TABLE 74 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR SPAIN, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 75 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR SPAIN, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 76 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE NETHERLANDS, THROUGH 2018
  • TABLE 77 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE NETHERLANDS, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 78 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR THE NETHERLANDS, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 79 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR TURKEY
  • TABLE 80 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR TURKEY, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 81 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR TURKEY, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 82 DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE APAC REGION, THROUGH 2018 ($ MILLIONS)
  • TABLE 83 SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE APAC REGION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 84 DOLLAR SALES OF SIP-BASED CHIPSETS TO THE APAC REGION, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 85 SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE APAC REGION, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS) 126
  • TABLE 86 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR CHINA, THROUGH 2018
  • TABLE 87 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR CHINA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 88 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR CHINA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 89 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR JAPAN, THROUGH 2018
  • TABLE 90 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR JAPAN, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 91 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR JAPAN, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 92 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR INDIA, THROUGH 2018
  • TABLE 93 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR INDIA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS) 135
  • TABLE 94 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR INDIA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS) 137
  • TABLE 95 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR INDONESIA, THROUGH 2018 139
  • TABLE 96 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR INDONESIA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 97 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR INDONESIA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 98 SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR SOUTH KOREA, THROUGH 2018
  • TABLE 99 DOLLAR SALES FOR SIP-BASED CHIPSETS FOR SOUTH KOREA, BY END APPLICATION, THROUGH 2018 ($ MILLIONS)
  • TABLE 100 SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR SOUTH KOREA, BY END APPLICATION, THROUGH 2018 (MILLIONS OF UNITS)
  • TABLE 101 U.S. PATENTS IN SIP BY PATENT CATEGORY, 1976-NOVEMBER 2013 177 TABLE 102 U.S. PATENT TRENDS IN SIP BY YEAR OF GRANT, 1976-NOVEMBER 2013 178
  • TABLE 103 SHARES OF U.S. PATENTS IN SIP BY COUNTRY OF GRANT, 1976-NOVEMBER 2013
  • TABLE 104 LIST OF ASSIGNEES FOR THE U.S. PATENTS IN SIP, 1976-NOVEMBER 2013
  • TABLE 105 ASSIGNEES OF FOUR OR MORE U.S. PATENTS IN SIP, 1976 THROUGH NOVEMBER 2013

LIST OF FIGURES

  • SUMMARY FIGURE DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, 2011-2018 ($ MILLIONS)
  • FIGURE 1 POSITION OF PACKAGING AND TESTING IN SEMICONDUCTOR MANUFACTURING CYCLE
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