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市場調查報告書

覆晶技術和全球市場

Flip-Chip Technologies and Global Markets

出版商 BCC Research 商品編碼 292623
出版日期 內容資訊 英文 139 Pages
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覆晶技術和全球市場 Flip-Chip Technologies and Global Markets
出版日期: 2016年07月21日 內容資訊: 英文 139 Pages
簡介

全球覆晶技術市場,2015年達249億美元的規模。該市場預計從2016年到2021年以8.8%的年複合成長率擴大,市場規模從2016年的272億美元達到2021年的414億美元。

本報告提供覆晶技術的全球市場概觀,趨勢分析,技術的進步、架構、價值鏈等相關的說明,市場力學的檢驗,各地區市場現狀,產業的結構與競爭情形,各主要企業的簡介等,為您概述為以下內容。

那個

第1章 簡介

第2章 摘要

第3章 概要

  • 市場定義
  • 覆晶晶圓凸塊(晶圓植球)技術的演進
  • 銲料沉澱
  • 銲料合金的電鍍
  • 錫膏的篩檢
  • 銲料球的替換
  • C4NP流程
  • 有關覆晶技術的重要專利

第4章 利用晶圓凸塊流程的覆晶技術的市場

  • 簡介
  • 市場動態

第5章 覆晶技術市場:各應用領域

  • 簡介
  • 市場動態
    • 促進要素
    • 抑制因素
    • 機會
    • 2維邏輯SoC
    • 記憶體
    • 影像處理
    • 高亮度LED(HB LED)
    • 小型邏輯電路、高頻設備、電力設備、類比IC
    • 2.5維及3維的SiP/SoC

第6章 覆晶技術市場:各最終用途

  • 簡介
  • 市場動態
    • 促進要素
    • 抑制因素
    • 機會
    • 智慧型手機
    • 筆記型電腦
    • 桌上型電腦
    • PU和晶片組
    • 其他運算設備
    • 汽車
    • 機器人技術
    • 醫療設備
    • 智慧技術
    • 產業應用

第7章 覆晶技術市場:各地區

  • 簡介
  • 市場概要
  • 北美
  • 歐洲
  • 亞太地區
  • 其他的地區

第8章 產業結構、競爭分析

  • 產業結構
    • 影響因素
    • 預測零組件
    • 市場佔有率分析
  • 覆晶市場影響因素
  • 專利分析

第9章 企業簡介

  • AMKOR TECHNOLOGY INC.
  • ASE GROUP
  • FARADAY TECHNOLOGY CORP.
  • FLIPCHIP INTERNATIONAL LLC
  • GIGPEAK INC.
  • GLOBAL FOUNDRIES INC.
  • IBM CORP.
  • INTEL CORP.
  • KYOCERA AMERICA INC.
  • NANIUM SA
  • 日亞化學工業
  • NTK TECHNOLOGIES INC.
  • PHILIPS LUMILEDS LIGHTING CO.
  • POWERTECH TECHNOLOGY INC.
  • RENESAS ELECTRONICS AMERICA INC.
  • SAMSUNG ELECTRONICS CO. LTD.
  • SIGNETICS CORP.
  • SILICONWARE PRECISION INDUSTRIES CO. LTD.
  • SK HYNIX INC.
  • STATS CHIPPAC LTD.
  • STMICROELECTRONICS NV (STM)
  • SUSS MICROTEC AG
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO.
  • TEKTRONIX COMPONENT SOLUTIONS INC.
  • TESSERA TECHNOLOGIES INC.
  • TEXAS INSTRUMENTS INC.
  • Tokyo Electron Glass
  • TOSHIBA ELECTRONICS EUROPE GMBH
  • UNISEM (M) BERHAD
  • UTAC HOLDINGS LTD.

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目錄
Product Code: SMC089B

REPORT HIGHLIGHTS

The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

This report provides:

  • An overview of the global markets for flip-chip technologies, a process to interconnect IC's and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.
  • Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.
  • Discussion of the evolution, architecture, and value chain of flip-chip technologies.
  • Examination of market dynamics, including drivers, restraints, and opportunities.
  • Analysis of the flip-chip assembly markets by geography, including North America, Europe, Asia-Pacific, and others.
  • Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
  • Profiles of major players in the industry.

SCOPE OF REPORT

The market for flip-chip technology is segmented by the following categories:

  • Wafer bumping process.
    • Copper (Cu) pillar.
    • Lead (Pb)-free solder.
    • Tin-lead (Sn-Pb) eutectic solder.
    • Gold stud + plated solder.
  • Application area.
    • 2-D logic system-on-a-chip (SoC).
    • Memory.
    • Imaging, high-brightness light-emitting diode (HB-LED) small logic.
    • Radio-frequency (RF), power, analog, and mixed-signal integrated circuits (ICs).
    • μ-bumping for 2.5-D/3-D system-in-package/system-on-a-chip (SiP/SoC).
  • End use.
    • Smartphones.
    • Laptops.
    • Desktop CPUs.
    • Graphics processing units (GPUs) and chipsets.
    • Other computing devices.
    • Automotive.
    • Robotics.
    • Medical devices.
    • Smart technologies.
    • High-performance/industrial applications.
  • Region.
    • North America (the U.S., Canada and Mexico).
    • Europe (Italy, France, Germany, U.K., and other countries).
    • Asia-Pacific (China, Japan, Taiwan, South Korea, India. and other countries).
    • ROW (Middle East and Africa).

This report also provides a competitive analysis of the industry, a patent analysis, and a chapter including company profiles. All estimated values used are based on manufacturers' total revenues, and are given in current U.S. dollars, unadjusted for inflation.

ANALYST'S CREDENTIALS

Sinha Gaurav holds an MBA in finance from ICFAI Business School, Hyderabad (India), and a bachelor's degree in electrical engineering from Rajasthan University (India). His primary focus is in the electronics, semiconductor, photonics, chemical, and communications markets, and he helps clients understand these markets in a concise and intellectual manner. He has researched various markets for several years, including electronics, semiconductors, chemicals, photonics, and information technology. Specific market research reports have covered quantum dots, ultrafast lasers, vertical-cavity surface-emitting lasers (VCSEL), ultraviolet (UV)-cured resins, and metrology.

Table of Contents

CHAPTER 1 - INTRODUCTION

  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR CONDUCTING THE STUDY
  • SCOPE OF REPORT
  • INTENDED AUDIENCE
  • INFORMATION SOURCES
  • ANALYST'S CREDENTIALS
  • RELATED BCC RESEARCH REPORTS
  • BCC RESEARCH WEBSITE
  • DISCLAIMER

CHAPTER 2 - SUMMARY

  • SUMMARY TABLE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
  • SUMMARY FIGURE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015-2021 ($ MILLIONS)

CHAPTER 3 - OVERVIEW

  • MARKET DEFINITION
  • EVOLUTION OF FLIP-CHIP WAFER BUMPING TECHNOLOGIES
    • FIGURE 1: DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004
  • SOLDER EVAPORATION
    • FIGURE 2: SOLDER EVAPORATION PROCESS
  • ELECTROPLATING OF SOLDER ALLOYS
    • FIGURE 3: SOLDER ALLOY ELECTROPLATING PROCESS
  • SOLDER PASTE SCREENING
    • FIGURE 4: SOLDER PASTE SCREENING PROCESS
  • SOLDER BALL REPLACEMENT
  • C4NP PROCESS
  • SIGNIFICANT PATENTS ON FLIP-CHIP TECHNOLOGIES
    • METHOD FOR FLIP CHIP PACKAGING CO-DESIGN
      • Abstract
    • USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING
      • Abstract
    • LEADLESS MULTI-LAYERED CERAMIC CAPACITOR STACKS
      • Abstract
    • FLIP-CHIP LED PACKAGE
      • Abstract
    • MEMS SENSOR INTEGRATED WITH A FLIP-CHIP
      • Abstract
    • COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
      • Abstract
    • LOW NOISE FLIP-CHIP PACKAGES AND FLIP-CHIPS THEREOF
      • Abstract
    • COPPER POST SOLDER BUMPS ON SUBSTRATES
      • Abstract
    • MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE
      • Abstract
    • FLIP-CHIP MMIC HAVING MOUNTING STIFFENER
      • Abstract
    • FLIP-CHIP BONDER AND FLIP-CHIP BONDING METHOD
      • Abstract
    • RED FLIP-CHIP LIGHT EMITTING DIODE, PACKAGE AND METHOD OF MAKING THE SAME
      • Abstract
    • FLIP-CHIP TYPE LASER DIODE
      • Abstract
    • SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
      • Abstract
    • COPPER PILLAR SIDEWALL PROTECTION
      • Abstract
    • ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
      • Abstract
    • METHOD OF FORMING COPPER PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP
      • Abstract
    • SUBSTRATES FOR PACKAGING FLIP-CHIP LIGHT EMITTING DEVICE AND FLIP-CHIP LIGHT EMITTING DEVICE PACKAGE STRUCTURES
      • Abstract
    • FLIP-CHIP SOLAR CELL CHIP AND FABRICATION METHOD THEREOF
      • Abstract
    • FLIP CHIP OVERMOLD PACKAGE
      • Abstract
    • FLIP-CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE
      • Abstract
    • ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING STRUCTURE COMPRISING THE SAME
      • Abstract
    • SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
      • Abstract
    • LEAD-FREE SOLDER ALLOY
      • Abstract
    • DUMMY FLIP CHIP BUMPS FOR REDUCING STRESS
      • Abstract
    • ELECTRONIC ASSEMBLY WITH COPPER PILLAR ATTACH SUBSTRATE
      • Abstract
    • FLIP-CHIP ASSEMBLY COMPRISING AN ARRAY OF VERTICAL CAVITY SURFACE EMITTING LASERS (VCSELSS), AND AN OPTICAL TRANSMITTER ASSEMBLY THAT INCORPORATES THE FLIP-CHIP ASSEMBLY
      • Abstract
    • LEAD-FREE SOLDER BUMP BONDING STRUCTURE
      • Abstract
    • EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
      • Abstract
    • APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR INTEGRATED CIRCUITS
      • Abstract
    • HIGH VOLTAGE FLIP-CHIP LED STRUCTURE AND MANUFACTURING METHOD THEREOF
      • Abstract
    • FLIP-CHIP INTERCONNECTION STRUCTURE
      • Abstract
    • STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
      • Abstract
    • FLIP-CHIP PACKAGE
      • Abstract
    • LOCALIZED HEATING FOR FLIP CHIP BONDING
      • Abstract
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
      • Abstract
    • CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
      • Abstract
    • FLIP-CHIP PACKAGE FOR MONOLITHIC SWITCHING REGULATOR
      • Abstract

CHAPTER 4 - FLIP-CHIP TECHNOLOGY MARKET BY WAFER BUMPING PROCESS

  • INTRODUCTION
  • MARKET DYNAMICS
    • DRIVERS
      • Expansion of Semiconductor Business
      • Application of Flip Chips in Packaging
      • End-User Demand Among Consumers
    • RESTRAINTS
      • Stringent Government Regulations
        • European Union
      • High Investment Cost
      • Structural Problems in Solder Bumps
    • OPPORTUNITIES
      • Lead-Free Flip-Chip Assembly
        • TABLE 1: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
        • FIGURE 5: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
        • TABLE 2: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH 2021 (MILLION UNITS)
        • FIGURE 6: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, 2015-2021 (MILLION UNITS)
        • TABLE 3: GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER BUMPING PROCESS, 2015-2021 ($)
      • Copper Pillar
        • TABLE 4: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 7: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
      • Copper Bumping Features
      • Tin-Lead Eutectic Solder
        • TABLE 5: MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB)
        • TABLE 6: PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB)
        • TABLE 7: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 8: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
      • Advantages of Tin-Lead Eutectic Solder
      • Lead-Free Solder
        • TABLE 8: CHARACTERISTICS OF VARIOUS ELEMENTS
        • TABLE 9: CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS
      • Properties of Some Commonly Used Alloy Systems
        • 58Bi-42Sn
        • 52In-48Sn
          • TABLE 10: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
          • FIGURE 9: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
      • Gold Stud Bumping
        • TABLE 11: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 10: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)

CHAPTER 5 - FLIP-CHIP TECHNOLOGY MARKET BY APPLICATION

  • INTRODUCTION
    • FIGURE 11: MARKET SEGMENTATION BY APPLICATION
  • MARKET DYNAMICS
    • DRIVERS
      • New and Improved 3-D Integrated Circuits
      • Invention of Double Data Rate Fourth-Generation (DDR4) Memory
    • RESTRAINTS
      • Challenges in Transition
    • OPPORTUNITIES
      • DDR5 Memory for the Future
        • TABLE 12: GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, THROUGH 2021 ($ MILLIONS)
        • FIGURE 12: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, 2015-2021 ($ MILLIONS)
    • 2-D LOGIC SYSTEM-ON-A-CHIP
      • FIGURE 13: STRUCTURE OF MULTI-CHIP MODULE
      • FIGURE 14: STRUCTURE OF SYSTEM-ON-CHIP
      • TABLE 13: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, 2015-2021 ($ MILLIONS)
    • MEMORY
      • TABLE 14: COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY
      • TABLE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • IMAGING
      • TABLE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, 2015-2021 ($ MILLIONS)
    • HIGH-BRIGHTNESS LIGHT-EMITTING DIODE (HB-LED)
      • FIGURE 18: STRUCTURE OF HB-LED
      • TABLE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • SMALL LOGIC, RADIO FREQUENCY, POWER, ANALOG, AND MIXED-SIGNAL INTEGRATED CIRCUITS
      • TABLE 18: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 20: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • 2.5-D AND 3-D SYSTEM-IN-PACKAGE/SYSTEM-ON-A-CHIP
      • FIGURE 21: ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT
      • FIGURE 22: STRUCTURE OF 3-D INTEGRATED CIRCUIT
      • TABLE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 23: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)

CHAPTER 6 - FLIP-CHIP TECHNOLOGY MARKET BY END USE

  • INTRODUCTION
  • MARKET DYNAMICS
    • DRIVERS
      • Increased Application of Flip Chip in Automotive
      • Application of Smart Technologies
      • Extensive Research and Development
    • RESTRAINTS
      • Time Consumption for New Innovation
    • OPPORTUNITIES
      • Household Robots in the Future
        • TABLE 20: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 24: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, 2015-2021 ($ MILLIONS)
    • SMARTPHONES
      • TABLE 21: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 25: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • LAPTOPS
      • TABLE 22: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 26: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • DESKTOP CENTRAL PROCESSING UNITS
      • TABLE 23: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 27: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • GRAPHICS PROCESSING UNIT AND CHIPSETS
      • TABLE 24: GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 28: GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • OTHER COMPUTING DEVICES
      • TABLE 25: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 29: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • AUTOMOTIVE
      • TABLE 26: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 30: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • ROBOTICS
      • TABLE 27: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 31: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • MEDICAL DEVICES
      • TABLE 28: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 32: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • SMART TECHNOLOGIES
      • TABLE 29: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 33: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • INDUSTRIAL APPLICATIONS
      • TABLE 30: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 34: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)

CHAPTER 7 - FLIP-CHIP TECHNOLOGY MARKET BY REGION

  • INTRODUCTION
    • FIGURE 35: REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET
  • MARKET SNAPSHOT
    • TABLE 31: GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 32: GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, THROUGH 2021 ($ MILLIONS)
  • NORTH AMERICA
    • OVERVIEW
      • TABLE 33: NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 34: NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 35: NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 36: NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • RULES AND REGULATIONS IN NORTH AMERICA
  • EUROPE
    • OVERVIEW
      • TABLE 37: EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 38: EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 39: EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 40: EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • RULES AND REGULATIONS IN EUROPE
      • RoHS
        • RoHS 2
  • ASIA-PACIFIC REGION
    • OVERVIEW
      • TABLE 41: ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 42: ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 43: ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 44: ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • RULES AND REGULATIONS OF VARIOUS ASIA-PACIFIC ECONOMIES
      • China
  • REST OF THE WORLD
    • OVERVIEW
      • TABLE 45: ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 46: ROW FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)

CHAPTER 8 - INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS

  • INDUSTRY STRUCTURE
    • INFLUENTIAL FACTORS
    • FORECAST COMPONENTS
      • FIGURE 36: INDUSTRY REVENUE MODEL
    • MARKET SHARE ANALYSIS
      • TABLE 47: GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%)
  • FACTORS IMPACTING THE FLIP-CHIP MARKET
    • SUPPLIERS' POWER
    • BARGAINING POWER OF BUYERS
    • THREAT FROM SUBSTITUTES
    • THREAT FROM NEW ENTRANTS
    • DEGREE OF COMPETITION
  • PATENT ANALYSIS
    • PATENTS BY REGION
      • FIGURE 37: REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER 2015
    • PATENTS BY YEAR
      • FIGURE 38: NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER 2015 (NO OF PATENTS)

CHAPTER 9 - COMPANY PROFILES

  • AMKOR TECHNOLOGY INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Innovation in Product Portfolio Through Research and Development
    • RECENT DEVELOPMENTS
  • ASE GROUP
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Licensing Agreement
    • RECENT DEVELOPMENTS
  • FARADAY TECHNOLOGY CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • FLIPCHIP INTERNATIONAL LLC
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Expanding Business Portfolio Through Agreements
    • RECENT DEVELOPMENTS
  • GIGPEAK INC.
    • OVERVIEW
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion by Acquisition
    • RECENT DEVELOPMENTS
  • GLOBALFOUNDRIES INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • IBM CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Acquisition
    • RECENT DEVELOPMENTS
  • INTEL CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Acquisitions to Extend Product Portfolio
    • RECENT DEVELOPMENTS
    • KYOCERA AMERICA INC.
  • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • NANIUM SA
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
      • Business Expansion Through Partnership
    • RECENT DEVELOPMENTS
  • NICHIA CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Expanding Business Through Agreements
    • RECENT DEVELOPMENTS
  • NTK TECHNOLOGIES INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion
    • RECENT DEVELOPMENTS
  • PHILIPS LUMILEDS LIGHTING CO.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Innovation in Product Portfolio
    • RECENT DEVELOPMENTS
  • POWERTECH TECHNOLOGY INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Agreements
    • RECENT DEVELOPMENTS
  • RENESAS ELECTRONICS AMERICA INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • SAMSUNG ELECTRONICS CO. LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
      • Business Expansion Through Acquisition
    • RECENT DEVELOPMENTS
  • SIGNETICS CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion
    • RECENT DEVELOPMENTS
  • SILICONWARE PRECISION INDUSTRIES CO. LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strategic Business Agreement
    • RECENT DEVELOPMENTS
  • SK HYNIX INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
      • Research and Development
    • RECENT DEVELOPMENTS
  • STATS CHIPPAC PTE. LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • STMICROELECTRONICS NV
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • SUSS MICROTEC AG
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Collaboration
    • RECENT DEVELOPMENTS
  • TEKTRONIX COMPONENT SOLUTIONS INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • TESSERA TECHNOLOGIES INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • TEXAS INSTRUMENTS INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • TOKYO ELECTRON LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio Through New Product Development
    • RECENT DEVELOPMENTS
  • TOSHIBA ELECTRONICS EUROPE GMBH
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • UNISEM (M) BERHAD
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion
    • RECENT DEVELOPMENTS
  • UTAC HOLDINGS LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS

LIST OF TABLES

  • SUMMARY TABLE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 1: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
    • TABLE 2: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH 2021 (MILLION UNITS)
    • TABLE 3: GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER BUMPING PROCESS, 2015-2021 ($)
    • TABLE 4: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
    • TABLE 5: MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB)
    • TABLE 6: PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB)
    • TABLE 7: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
    • TABLE 8: CHARACTERISTICS OF VARIOUS ELEMENTS
    • TABLE 9: CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS
    • TABLE 10: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
    • TABLE 11: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
    • TABLE 12: GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • TABLE 13: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 14: COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY
    • TABLE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 18: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 20: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH 2021 ($ MILLIONS)
    • TABLE 21: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 22: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 23: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 24: GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 25: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 26: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 27: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 28: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 29: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 30: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
    • TABLE 31: GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 32: GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 33: NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
    • TABLE 34: NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
    • TABLE 35: NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
    • TABLE 36: NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • TABLE 37: EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
    • TABLE 38: EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
    • TABLE 39: EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
    • TABLE 40: EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • TABLE 41: ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
    • TABLE 42: ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
    • TABLE 43: ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
    • TABLE 44: ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • TABLE 45: ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
    • TABLE 46: ROW FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • TABLE 47: GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%)

LIST OF FIGURES

  • SUMMARY FIGURE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 1: DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004
    • FIGURE 2: SOLDER EVAPORATION PROCESS
    • FIGURE 3: SOLDER ALLOY ELECTROPLATING PROCESS
    • FIGURE 4: SOLDER PASTE SCREENING PROCESS
    • FIGURE 5: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
    • FIGURE 6: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, 2015-2021 (MILLION UNITS)
    • FIGURE 7: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
    • FIGURE 8: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
    • FIGURE 9: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
    • FIGURE 10: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
    • FIGURE 11: MARKET SEGMENTATION BY APPLICATION
    • FIGURE 12: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, 2015-2021 ($ MILLIONS)
    • FIGURE 13: STRUCTURE OF MULTI-CHIP MODULE
    • FIGURE 14: STRUCTURE OF SYSTEM-ON-CHIP
    • FIGURE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, 2015-2021 ($ MILLIONS)
    • FIGURE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • FIGURE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, 2015-2021 ($ MILLIONS)
    • FIGURE 18: STRUCTURE OF HB-LED
    • FIGURE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • FIGURE 20: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • FIGURE 21: ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT
    • FIGURE 22: STRUCTURE OF 3-D INTEGRATED CIRCUIT
    • FIGURE 23: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • FIGURE 24: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, 2015-2021 ($ MILLIONS)
    • FIGURE 25: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 26: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 27: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 28: GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 29: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 30: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 31: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 32: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 33: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 34: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • FIGURE 35: REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET
    • FIGURE 36: INDUSTRY REVENUE MODEL
    • FIGURE 37: REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER 2015
    • FIGURE 38: NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER 2015 (NO OF PATENTS)
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