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市場調查報告書

系統晶片技術與市場

System on a Chip: Technology, Markets

出版商 BCC Research
出版日期 2004年11月 商品編碼 24732
內容資訊 英文 510 Pages
價格
本報告書已不再販售

本報告已在2011年07月19日停止出版。

簡介

市場對削減成本、產品單純化、高效能的需求節節高昇,造成半導體業內的系統晶片 SoC(System on a Chip:內含電腦主要功能的晶片)部門顯著成長。未來全球市場規模將以24.6%的年成長率,從2003年的104億美元,擴大至2009年的432億美元左右。

擅長多種產業分析,著重於成長迅速領域的專業市調公司 Business Communications Company, Inc. (總公司:康乃迪克州)調查分析了系統晶片技術與市場後,出版了一本綜合報告書“System on a Chip: Technology, Markets”

報告書內容包括:SoC市場規模、獲利動態、最新研發動向、技術研發的牽引因素、各技術之互相取代性、極限與材料相關分析、各部門市場概要與競爭動向、至2009年的獲利預測、以及主要企業資訊等等。全書附圖表共93頁,內容綱要摘記如下:

前言

總結

SoC 業界概要

  • 背景與概要
    • SoC 概要
    • 附屬市場
    • 市場牽引因素
    • SoC 全球市場預測
    • SoC 大小與單元趨勢
    • SoC 各地區趨勢
    • SoC 各末端用戶市場趨勢
    • SoC 技術相關探討
    • SoC 未來動向

SoC 市場

  • 各產品市場概要
  • 標準元件基礎(Standard Cell Based)之SoC
    • 全球市場預測
    • 各地區趨勢
    • 各末端用戶市場趨勢
    • 技術相關探討
    • 未來動向
  • 內建 IP 基礎之 SoC
    • 業界結構
    • 內建 IP 之定義
    • 全球市場預測
    • 各地區趨勢
    • 各末端用戶市場趨勢
  • 內建 IP 基礎之 SoC 零件種類
    • 全球市場預測
    • 各地區趨勢
    • 各末端用戶市場趨勢
    • 技術相關探討
    • 未來動向

SoC 相關產業

  • EDA(電子設計自動化)業界概要
    • 全球市場預測
    • 各地區趨勢
    • 各末端用戶市場趨勢
    • 技術相關探討
    • 未來動向
  • IC 製造業概要
    • 全球市場預測
    • 各地區趨勢
    • 各末端用戶市場趨勢
    • 技術相關探討
    • 未來動向
  • 無晶圓(Fabless)產業概要
    • 全球市場預測
    • 各地區趨勢
    • 各末端用戶市場趨勢
    • 技術相關探討
    • 未來動向

SoC 市佔率

  • SoC 供應商的市佔率
    • 標準元件基礎之 SoC 供應商
    • 內建 IP 基礎之 SoC 供應商
  • EDA 供應商的市佔率
  • IC 製造商的市佔率
  • 無晶圓供應商的市佔率

企業資訊(200 間)

附錄

圖表

目錄

REPORT HIGHLIGHTS

  • The world market for SOC will grow from about $10.4 billion in 2003 to $43.2 billion by 2009, at an average annual growth rate (AAGR) of 24.6%.
  • Unit growth will be at the aggregate rate of 18.4% to reach 2.2 billion in 2009, while average unit prices will increase to $19.60.
  • SOC average selling prices (ASPs) are higher than stand-alone chips, as is to be expected due to integrated functionality.
  • SOC unit sales are cannibalizing the consumption volume of other ICs.
  • The growth of SOC components has led to the birth and popularity of new end-use devices, such as ultrasmall mobile gadgets, ultrawideband Internet, and certain automobile gadgetry.

INTRODUCTION

The development of the system-on-chip (SOC) industry within the semiconductor industry is one of the most interesting subplots of rapid innovation in the high-tech industry. As pressure continues to achieve higher levels of device integration while reducing cost, size and complexity, the issue of process innovation has become very significant. In addition, economic and market forces are fueling the market. This environment calls for an assessment of current market and technology trends as well as potential breakthroughs in the near- and long-term future.

To accommodate exponential growth demands for larger and faster transistors, chip designers and manufacturers have constantly pushed the envelope of technological, physical, and design constraints. Various innovations and paradigm-defining ideas have taken shape as a result. The SOC concept is one significant trend in this context. SOC can deliver the headroom necessary to continue pushing the envelope for at least the next five years.

This BCC report provides an up-to-date analysis of recent developments and current trends in the global SOC industry marketplace. It examines the SOC market, its fundamental basis, key technology drivers, primary uses, critical applications, and component segments. The study identifies significant drivers of revenue growth in specific product categories. The objective of this kind of systematic research is to quantify the projected impact of the forces, from within and from outside, at work on this industry today.

SCOPE OF STUDY

The report contains:

  • Coverage of SOC segments in terms of market size and revenue trends
  • Revenue forecasts through 2009 for the most important product applications
  • Technology discussion, concentrating on trends that will develop during the forecast period
  • Analysis of compatibility, limitations and materials for each technology
  • Discussion of the competitive aspects of each segment, along with several successful suppliersEstrategies in the market
  • A current industry directory, a survey of U.S. SOC-related patents from 2000 to 2004 (partial), and profiles of leading SOC vendors.

METHODOLOGY

Research for this report was conducted via a number of data channels. The primary sources of information were Internet searches, industry association data, and interviews conducted with chip component suppliers, custom engineering companies, and manufacturers of representative applications. In addition, other secondary sources were consulted for the report, including reviews of industry journals and publications, product literature, white papers and technical journals, and financial reports for industry suppliers. Internal sources included earlier reports from BCC on advanced electronic materials technologies.

The approach used to deduce growth projections for the SOC market should be elucidated at this point, especially considered is its relationship to the overall high-tech electronics and semiconductor industry. The methodology is described below:

First, we tabulated annual revenue numbers for the overall high-technology industry, the semiconductor business, and for chip-categories for the past 15 years (1988 through 2003). The goal was to determine trend lines, potential drift cycles, and, most importantly, relationship formulae between the industries. Using the historical data, we were able to decipher a relationship equation between chip component segment revenues and the high-tech industry revenues.

Next we assessed extraneous factors, such as the following:

  • Economy (for example the slowdown over the past few years).
  • Vacillation in market demand-downturn in telecom and rise in auto, for example.
  • New technology innovation in end-use markets (signifying greater feature demands on the chip features arena). A popular example was the pervading Internet phenomenon.
  • Geographical trends-the rise of Asia-Pacific region as a major consumer, for example.

These key points were factored into the original relationship equation to get a more realistic and customized growth rate trend, especially catering to the varying demand and growth projected for different end-use applications within the SOC landscape.

Finally, the end results were compared to the initial relationship matrix to ensure that the SOC numbers are aligned to a reasonable extent with estimated projections that have been stated for the semiconductor and overall technology industry..

From an applications perspective, the SOC market forecast is based on the estimated demand in six major applications-computing, communications, consumer electronics, automotive, medical and office equipment, and industrial and military electronics. Application demand was aligned with corresponding demand for chip component categories.

ABOUT THE AUTHOR

Ravi Krishnan has over 11 years of extensive professional and research experience in high technology with a special focus on the semiconductor industry. His work experience in this regard includes research analyst and subject-matter expert roles at market research firms, Cahners In-Stat Group and Integrated Circuit Engineering Corp. in Scottsdale AZ, and as a high-tech strategy consultant for PricewaterhouseCoopers Consulting. Currently, Ravi is with Cognizant Technology Solutions in a technology strategy capacity.

Ravi has an MBA and a graduate degree in Mass Communications, both from the Arizona State University, and an undergraduate degree in technology from the Birla Institute of Technology and Science, India.

TABLE OF CONTENTS

  • INTRODUCTION
      • STUDY GOAL AND OBJECTIVES
      • REASONS FOR DOING THE STUDY
      • CONTRIBUTION OF THE STUDY AND FOR WHOM
      • SCOPE AND FORMAT
      • METHODOLOGY
      • ABOUT THE AUTHOR
      • RELATED BCC PUBLICATIONS
        • REPORTS
        • MONTHLY NEWSLETTERS
      • BCC ON-LINE SERVICES
      • DISCLAIMER
  • SUMMARY
    • Summary Table:
      WORLD SOC MARKET, THROUGH 2009 ($ MILLIONS, MILLION UNITS)
    • Summary Figure:
      WORLD SOC MARKET, 2003-2009 ($ MILLIONS)
  • INDUSTRY OVERVIEW
      • BACKGROUND AND DESCRIPTION
        • SOC OVERVIEW
          • SOC Device Types-Definition
            • SOC Based on Standard Cells-Definition
            • SOC based on Embedded IP-Definition
              • SOC Based on Micro Logic IP
              • SOC Based on Memory IP
              • SOC Based on Analog IP and Other Components
              • SOC Based on ASIC/PLDs
    • Figure 1 SOC INDUSTRY BREAKDOWN BY PRODUCT CATEGORY
        • ANCILLARY INDUSTRIES
          • EDA, Pure-Play Foundry and Fabless Companies
        • KEY INDUSTRY DRIVERS
          • Intellectual Property
          • Internet and E-Commerce
          • Multiple Systems on a Chip
          • Cyclicality of Industry
          • Investment Risk
          • Fundamentals and Stock Prices
            • Threat of New Entrants
            • Power of Suppliers
            • Power of Buyers
            • Availability of Substitutes
            • Competitive Rivalry
          • Technology-Fueled Consumer Electronics Industry Creates New Supplier Category
          • Technical Feature Drivers
            • Deverticalization and Programmability
            • Chip Development Costs
              • Good IP Design
        • WORLDWIDE SOC MARKET FORECAST
    • Table 1 WORLD SOC REVENUE, THROUGH 2009 ($ MILLIONS)
          • Market Segments
            • Automotive Market
            • Set-top Boxes
          • Market Boundaries
          • SOC Growth Rate Computational Assumptions and Approach
            • SOC versus Total Semiconductor Revenues
    • Figure 2 DATA PARAMETERS FOR GROWTH RATE-TOTAL SEMICONDUCTOR VS. SOC MARKET (%, $ BILLION)
            • SOC versus ASIC Revenues
    • Figure 3 DATA PARAMETERS FOR GROWTH RATE-ASIC VS. SOC MARKET (%, $ BILLION)
            • Growth Patterns
          • Market Share
    • Table 2 SOC REVENUES AS PERCENT OF TOTAL SEMICONDUCTOR REVENUES, THROUGH 2009 ($ MILLIONS)
          • Production and Price Trends
    • Table 3 WORLD SOC UNITS, THROUGH 2009 (MILLIONS)
    • Table 4 WORLD SOC AVERAGE SELLING PRICE (ASP) TRENDS, THROUGH 2009 ($)
        • SOC DIAMETER AND UNIT TRENDS
    • Table 5 WORLD SOC UNIT TRENDS BY DIAMETER CATEGORIES, THROUGH 2009 (MILLIONS)
    • Figure 4 WORLD SOC UNIT TRENDS BY DIAMETER CATEGORIES, 2003-2009 (MILLIONS)
        • REGIONAL TRENDS FOR SOC
    • Table 6 WORLD SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
    • Figure 5 WORLD SOC REVENUE BY REGION, 2003-2009 ($ MILLIONS)
          • Electronic Product Supply and Demand Factors
            • Electronic Product Supply and EContinued)
          • Americas
          • Mexico versus China
            • Mexico versus China (Continued)
          • Europe
          • Asia-Pacific
            • China
              • Outlook
          • Japan
            • Japan (Continued)
            • Joint R&D Companies
              • ASPLA
            • Fab Operations
            • Other Ventures
        • SOC END-USE APPLICATION TRENDS
    • Table 7 WORLD SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
    • Figure 6 WORLD SOC REVENUE BY APPLICATION, 2003-2009 ($ MILLIONS)
          • Platform Design
          • Recovery Trends
          • Growth Markets
            • Convergence Applications
            • Niche Markets
            • Computing Applications
            • Communications Applications
              • Communications Applications (Continued)
            • Public Networking/Telecommunications, and Wireless Infrastructure
            • Enterprise and Access Network Systems
            • Voice Market
            • Broadband Access
            • Home Entertainment/Internet Access
            • Wireless Devices
            • Growth Opportunities
          • Consumer Applications
            • PDAs versus Smart Phones
            • DVD Players
            • Broadband Satellite
            • Mobile Platforms
            • Entertainment/Information/Communications Convergence
            • Cell Phones
          • Set-top Boxes
          • HDTV
          • Automotive Applications
            • Navigational Systems
            • Advanced Transportation
            • Telematics
            • Other New Electronic Features
            • Systems Design
            • Top Accessories
    • Table 8 INNOVATIVE FEATURES IN THE AUTOMOTIVE INDUSTRY, 2004-2009
    • Table 8 (CONTINUED)
            • DSP-Based Chipsets
            • Market Outlook
          • Medical/Office Equipment Applications
            • Medical/Office Equipment Applications (Continued)
            • Embedded SOM
            • Product Life Cycle
            • Single Board Standards
            • Multi-function Implantable Devices
              • Pacemakers and ICDs
              • Diagnostics
              • Neurostimulators
              • Pacemaker Market
          • Industrial/Military Applications
            • Power-over-Ethernet
        • SOC TECHNOLOGY DISCUSSION
          • SOC Basic Design
          • Field Programmable Gate Array in SOC
          • SOC or Multichip Modules
          • SOC Design Concerns
            • Architecture Strategy
            • Design-for-Test Strategy
            • Validation Strategy
            • Synthesis and Back-End Strategy
            • Integration Strategy
          • SOC Design Reuse
          • Extraneous Constraints to SOC
          • Analog and Mixed-Signal Functions
            • Noise, Ground Bounce and Signal Integrity
            • Design Rules
          • Cultural Factors in SOC Design
            • Cultural Factors in SOC Design (Continued)
          • Pessimists Voice on SOC
          • Configurable Platform-based SOC Design Techniques
            • Platform Base Foundation
            • Standard VCI Interface
            • Buses
            • Shared Memory
            • Derivative Designs
            • Palmchip
              • Palmbus
            • Dual Processors
          • SOC Testing and 3-D Bin Packing
            • Test Scheduling
          • SOC and Signal Integrity
            • Virtual Component Integration
            • Processing Improvements Create SI Issues
            • Power Grid IR Drop and Ground Bounce
            • Inductive Noise
            • Power Grid Design: Component Author
            • Power Grid Models
            • Power Grid Design: Component Integrator
            • Crosstalk
              • Interconnect Crosstalk: Component Author
              • Interconnect Crosstalk: Component Integrator
              • Interconnect Crosstalk:EContinued)
              • Interconnect Crosstalk:EContinued)
            • Substrate Coupling: Component Author
            • Substrate Coupling: Component Integrator
          • Derivative SOC Projects
            • Developing Realistic Project Plans
            • Assembling the Right Resources and Managing them Efficiently
            • Reusing the Methods and Knowledge Gained from Previous Designs
              • Traditional Concurrent Design Model
              • Four-Phase Design Maturity Model
              • Team Structure
              • Building and Analyzing Results
              • Design Reuse and Team Continuity
          • SOC and Integration Challenges
            • SOC and Integration Challenges (Continued)
          • Electronic System Level (ESL) Designs
            • First Steps
            • Implementation
            • Main Stages of Design
            • Design Tools
        • FUTURE TRENDS IN SOC
          • SOC and Line Cards
            • Distributed versus Centralized Architectures
              • Distributed versus Centralized EContinued)
            • Additional Advanced SOC Features
          • SOCs Implication on Global Chips
            • Trend 1: Shrinking Product Life Cycles and Increasing Design Times
            • Trend 2: Improving Quality of SOC IP
            • Trend 3: Availability of Complex Analog/Mixed-Signal IP
            • Trend 4: High Nonrecurring Engineering Charges
            • Trend 5: Codependency of Design Efforts
            • Trend 6: Silicon Foundries Implement SOC Initiatives
            • Trend 7: SOC as a Growing Market Advantage
          • Analog Lag as a Concern
            • Digital Circuitry
          • Silicon-on-Insulator (SOI) in SOC
            • Optimizing SOI Design
            • Advantages
            • Models
              • Models (Continued)
            • Design Flow
    • Figure 7 SOC DESIGN FLOW UTILIZING SOI
          • SOC Critical-to-Compete Characteristics
            • Leading-Edge Process Technology
            • Transition to Copper
            • Customer-Centric Process Flexibility
            • Focus on IP
            • Design Time as the Essence of Improvement
            • Embedding Memory in ICs
            • Embedded Reprogrammability
            • Packaging-Escalating Pin Counts in SOC ICs
          • New Design Culture
          • Hot Application Drivers
            • Portal Phones
            • Multinetwork Imaging
            • Videoconferencing on Internet Protocols
            • Wider Wireless
            • Cars to Dial Cell Phones
            • World Phone and Adaptive Computing
            • Broadband Convergence in the Mainstream
          • Voice-over-Broadband SOC
            • Voice-over-Broadband SOC (Continued)
            • Scenario 1: Fully Integrated VOIP
            • Scenario 2: Partially Integrated VOIP
            • Scenario 3: No Integrated VOIP
          • Challenges to Broadband Wireless
          • Famous Industry Postulates and Their Future Validity
            • More Integration Is Better.
            • CMOS Is Better
            • Third-Party IP Savings
          • Latest Updates
            • MEDEA+ on Security, Health and Biochips
            • Fujitsus Mobile Media Processor
            • Satellite-Like Features to Cable
            • 3-D versus SOC
            • Microns Image Sensor SOC
            • IP Marriage Begets Integrated SOC
              • New Design Rules
  • SOC MARKET
      • PRODUCT SUMMARY MARKET OVERVIEW
    • Table 9 SOC REVENUE BY PRODUCT CATEGORY, THROUGH 2009 ($ MILLIONS)
    • Table 10 SOC UNITS BY PRODUCT CATEGORY, THROUGH 2009 (MILLIONS OF UNITS)
    • Table 11 SOC UNIT PRICE TRENDS BY PRODUCT CATEGORY, THROUGH 2009 ($)
      • STANDARD CELL-BASED SOC
        • WORLDWIDE SC-BASED SOC MARKET FORECAST
    • Table 12 SC-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
    • Table 13 SC-BASED SOC UNITS, THROUGH 2009 (MILLIONS)
    • Table 14 SC-BASED SOC ASP, THROUGH 2009 ($)
        • REGIONAL TRENDS FOR SC-BASED SOC
    • Table 15 SC-BASED SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
        • SC-BASED SOC END-USE APPLICATION TRENDS
    • Table 16 SC-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
          • Market Drivers
            • Mobile Phone Market
            • Automotive Market
            • Optoelectronics
            • Passive Optical Networks
            • Home Entertainment
        • SC-BASED SOC TECHNOLOGY DISCUSSION
          • Standard Cell ASIC Design Layout
            • Full Custom Layout
            • Semicustom Layout
        • FUTURE TRENDS IN SC-BASED SOC
          • Automotive
          • Set-top Boxes
          • Technical Problems
          • Design Cycle Time Struggles
          • Convergence of ASSP and SOC Functionality
          • Motorola Customizable Standard Product Design
    • Figure 8 MOTOROLAS CSP DESIGN FLOW
          • Advantages of Standard Products
          • Escalating Gate Density in ASICs
          • Embedded IP Providers as a Threat to SC-based SOC Vendors
          • Virtual SC-based SOCs
          • Structured and Platform-ASIC
      • EMBEDDED IP-BASED BASED SOC
        • INDUSTRY STRUCTURE
          • Vertical Disintegration
    • Table 17 VERTICAL DISINTEGRATION OF SEMICONDUCTOR INDUSTRY
          • Industry Evolution
    • Figure 9 SEMICONDUCTOR INDUSTRY EVOLUTION
        • EMBEDDED IP-DEFINITION
          • Hard, Firm and Soft Cores
    • Figure 10 DIFFERENCES BETWEEN SOFT, FIRM, AND HARD CORES
            • IP Core Features
    • Figure 11 IP CORE FEATURES
          • Traditional versus Open IP Solutions
    • Figure 12 PROBLEM SOLVING VIA THE IP CONCEPT
        • WORLDWIDE EMBEDDED IP-BASED SOC MARKET FORECAST
    • Table 18 EMBEDDED IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
    • Table 19 EMBEDDED IP-BASED SOC UNITS, THROUGH 2009 (MILLIONS)
    • Table 20 EMBEDDED IP-BASED SOC ASP, THROUGH 2009 ($)
          • Growth Factors
    • Table 21 NUMBER OF NEW SOC DESIGN STARTS, THROUGH 2009
          • Physical Libraries
    • Table 22 CAPTIVE AND COMMERCIAL IP LIBRARY MARKET, THROUGH 2009 ($ MILLIONS)
        • REGIONAL TRENDS FOR EMBEDDED IP-BASED SOC
    • Table 23 EMBEDDED IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
        • EMBEDDED IP-BASED SOC END-USE APPLICATION TRENDS
    • Table 24 EMBEDDED IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
      • EMBEDDED IP-BASED SOC-COMPONENT TYPES
        • WORLDWIDE EMBEDDED IP MARKET FORECAST BY COMPONENT TYPE
    • Table 25 EMBEDDED IP-BASED SOC REVENUES BY COMPONENT TYPE, THROUGH 2009 ($ MILLIONS)
          • Micro Logic IP-based SOC Market Forecast
    • Table 26 MICROLOGIC IP-BASED SOC REVENUES BY COMPONENT TYPE, THROUGH 2009 ($ MILLIONS)
          • MPU IP
    • Table 27 MPU IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
          • MCU/MPR IP
    • Table 28 MCU/MPR IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
            • Trends
            • Definition
            • Memory
            • Market Players
            • Market Growth
          • DSP IP
    • Table 29 DSP IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
            • Market Growth
            • Defining the Market
          • Memory IP-based SOC Market Forecast
            • Market Growth
    • Table 30 MEMORY IP-BASED SOC REVENUES BY COMPONENT TYPE, THROUGH 2009 ($ MILLIONS)
            • DRAM IP
    • Table 31 DRAM IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
            • SRAM IP
    • Table 32 SRAM IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
            • Flash IP
    • Table 33 FLASH MEMORY IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
            • Other Memory IP
    • Table 34 OTHER MEMORY IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
            • Nonvolatile Memory
            • Major Players
          • ASIC/PLD IP-based SOC Market Forecast
            • Market Growth
    • Table 35 ASIC/FPLD IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
          • Analog IP-based SOC Market Forecast
            • End-Use Applications
    • Table 36 ANALOG IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
          • Other Component IP-based SOC Market Forecast
    • Table 37 OTHER COMPONENT IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
            • Other Component IP-BasedEContinued)
        • REGIONAL TRENDS FOR EMBEDDED IP BY COMPONENT TYPE
          • Micrologic IP-based SOC by Region
    • Table 38 MICROLOGIC IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • MPU IP
    • Table 39 MPU IP-BASED SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • MCU/MPR IP
    • Table 40 MCU/MPR IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • DSP IP
    • Table 41 DSP IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
          • Memory IP-based SOC by Region
    • Table 42 MEMORY IP-BASED SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • DRAM IP
    • Table 43 DRAM IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • SRAM IP
    • Table 44 SRAM IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • Flash Memory IP
    • Table 45 FLASH MEMORY IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • Other Memory IP
    • Table 46 OTHER MEMORY IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
          • ASIC/PLD IP-based SOC by Region
    • Table 47 ASIC/PLD IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
            • United States
            • Europe
            • Japan
            • Asia-Pacific
              • China
          • Analog IP-based SOC by Region
    • Table 48 ANALOG IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
          • Other Component IP-based SOC by Region
    • Table 49 OTHER COMPONENT IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
        • EMBEDDED IP BY COMPONENT TYPE END-USE APPLICATION TRENDS
          • Micro Logic IP-based SOC by Application
    • Table 50 MICRO LOGIC IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • MPU IP
    • Table 51 MPU IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • MCU/MPR IP
    • Table 52 MCU/MPR IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
    • Table 53 DSP IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • DSP IP
              • DSP IP (Continued)
          • Memory IP-based SOC by Application
            • Memory IP-based SOCEContinued)
    • Table 54 MEMORY IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • DRAM IP
    • Table 55 DRAM IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • SRAM IP
    • Table 56 SRAM IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • Flash Memory IP
    • Table 57 FLASH MEMORY IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • Other Memory IP
    • Table 58 OTHER MEMORY IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
          • ASIC/PLD IP-based SOC by Application
    • Table 59 ASIC/PLD IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • Emerging Applications
              • Bluetooth
              • Field Programmable Logic Devices
          • Analog IP-based SOC by Application
    • Table 60 ANALOG IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
          • Other Component IP-based SOC by Application
    • Table 61 OTHER COMPONENT IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
            • Microelectromechnical Systems
              • Microelectromechnical EContinued)
        • EMBEDDED IP-BASED SOC TECHNOLOGY DISCUSSION
          • SOC Value Factors
    • Figure 13 SOC VALUE FACTORS
          • IC Paradigms
    • Figure 14 SHIFTING PARADIGMS IN THE IC WORLD, 1970-2000+
          • Process Technology
    • Figure 15 PROCESS TECHNOLOGY AS A DRIVER OF THE IC INDUSTRY, 1992-2002
          • Silicon Process Projection
    • Figure 16 PROJECTED ROAD MAP FOR SILICON PROCESS, 1989-2009
          • IP Design Process Advances
    • Figure 17 SOC PROCESS AND DESIGN ADVANCEMENTS
          • Trend toward IP Core Integration
          • IP Quality-General Overview and Issues
            • IP Design Guidelines
            • Institutionalizing IP Reuse
          • Critical Considerations in Embedding IP
            • Vendor Selection
            • IP Valuation
            • IP Design Reuse Trends
    • Table 62 NUMBER OF SOC DESIGNS WITH REUSABLE IP, THROUGH 2009
            • IP Protection
            • IP Process Verification
            • Roles and Responsibilities
            • IP Challenges
            • IP Licensing Issues
            • IP Make-or-Buy Dilemma
            • IP Concept: Financial Considerations
    • Table 63 COST % OF TOTAL REVENUE FOR INTEGRATED VS. FABLESS COMPANIES
    • Table 64 COST % OF TOTAL REVENUE FOR NO EXTERNAL IP VS. EXTERNAL IP
              • Pricing Models
    • Figure 18 IP COMPONENT PRICES
          • Examples of Embedded IP Cores in SOC
    • Figure 19 TYPICAL SOC STRUCTURE
    • Figure 20 SET-TOP BOX CHIP
          • MPU Make-or-Buy Dilemma
          • Synthesizable CPU Cores
          • Consequences of Embedding MPU Core
            • Multiple Instruction Issue
            • SIMD Architecture
            • Deep Pipelines
            • Application-Optimized Resources
          • Embedded DSP Control Issues
          • DSP Functionality to an MCU
            • DSP Functionality to an MCU (Continued)
          • DSP Functionality to Embedded MPU IP
            • DSP-RISC MPU Compilation Issue
            • DSP-RISC MPU Implementation
            • DSP/RISC MPU for Voice-over-Internet Protocol
          • The Function and Algorithm-Specific IC Market
    • Table 65 WORLDWIDE FASIC MARKET, THROUGH 2009 ($ MILLIONS)
          • The Embedded Memory Advantage
            • Reduced Cost
            • Lower Power
            • Increased Performance
            • Multiple Memory Types
            • Multiple Configurations
            • Design Reuse Enabler
            • Proven Silicon from Multiple Sources
          • Embedded Arrays
          • Pre-Silicon Prototypes for SOC Designs
            • The Aptix Model
            • Utility Factors
            • Implementation
          • Choosing CPU for SOC Design
    • Figure 21 CPU DATA/ADDRESS DYNAMICS
            • Main Architectures
            • System Performance
            • Cost
            • Processor Subsystems
          • Risk Avoidance in Embedded SOC Design
          • IP Expectations
          • Standards-based IP
        • FUTURE TRENDS IN EMBEDDED IP-BASED SOC
          • FPGA as a Significant SOC Component
          • Hearing-aid SOCs
            • Verilog Equivalent Models
            • Development Cycle and Power Savings
          • Embedded SOC Design Challenges
            • Automatic Gain Control Loop Simulation
            • The Validation Process
            • Product Compliance Testing
          • Increasing I/O Density in ICs
          • Time to Production
          • IP Trading Viability in SOC
          • IP Core Royalty Issues
          • Merging IP Core Architectures
          • Multimedia Processing in SOC
          • IP Formal Design
          • Embedded Memory IP Issues
          • Multiple Systems-on-a-Chip
          • Software Business Model
          • Asias Rise in IP
          • Virtual Prototyping as a Solution to Fragmentation
          • Putting the IP in Field Programmable Logic Devices
          • Smaller IP Designer Trends
          • SOC-based Service Strategy
          • Synthesizable DSP Cores
          • Perfect Embedded MCU
            • Configurable Peripheral MCU
          • Embedded DSP for Kids
    • Table 66 WORLDWIDE DSP IN THE TOY MARKET, THROUGH 2009 ($ MILLIONS)
            • DSP Technology Developments
            • IC Technology Developments
          • Embedded DSP Considerations: the 3Ps
            • Embedded DSP Considerations:EContinued)
          • Examples of Embedded IP in SOC
            • Philips REAL DSP™ Architecture
              • Philips REAL DSP™EContinued)
    • Figure 22 REAL DSP IN SOC
          • Field Programmable Logic Devices as SOC
            • Field Programmable Logic DevicesEContinued)
            • Field Programmable Logic DevicesEContinued)
            • Altera
            • Xilinx
          • Field Programmable Logic Devices as SOC-Contrarion View
          • IP Chip Design Alternatives
          • IP Implications on SOC-By the Law
            • Contributory Infringement
            • Inducement of Infringement
            • Method Claims
            • First-Sale Doctrine
            • Manufacturer Indemnification
          • Lessons in SIP Production
            • Lessons in SIP Production (Continued)
          • Overcoming Technical Challenges of SIP
            • The Known-Good-Die Issue
            • The Die-Attach Process
            • Contract Manufacturing
            • Time to Market
          • IP Residence-Software or IC Hardware?
          • Impact of Flexibility in SOC
          • IP Baggage
          • Latest Updates
            • Digital Signal Processor-Free, WiFi Handset for Voice Over Internet Protocol
            • Tower Foundry Partner to Ceva
            • Spec Raises Bar for IP and SOC Verification
            • PalmChip Patent Effect on SOC
            • French Startup Tackles SOC for WiMAX
            • Revolution in SOC Methodology
            • System-Level Tools Slash SOC Dynamic Power
            • MIPS Launches SOC Controller Cores
            • Infrastructure IP Assisting SOC Yields
            • SOC Service Cuts Manufacturing Costs
            • Toshiba to Promote MeP Core
            • Pixelworks Video Decoder SOC
            • IBM Sells PowerPC™ Lline to AMCC
            • Analog and Digital Integration
            • Software SOC Cuts 3G Infrastructure Costs
            • STMicros SOC in Atomic Particle Experiment
            • Sharps Flash Memory for Mobile Applications
              • Sharps Flash Memory forEContinued)
  • ALLIED INDUSTRY SEGMENTS TO SOC
      • ELECTRONIC DESIGN AUTOMATION (EDA) OVERVIEW
        • WORLDWIDE EDA MARKET FORECAST
          • Electronic System-Level Tools
            • Electronic System-Level ToolsEContinued)
          • Business Model Changes
          • Costs
          • Investment
          • Risk
          • Projected Revenues
    • Table 67 EDA REVENUES, THROUGH 2009 ($ MILLIONS)
    • Table 68 EDA REVENUES AS A PERCENTAGE OF TOTAL SEMICONDUCTOR MARKET, THROUGH 2009 ($ MILLIONS)
        • REGIONAL EDA TRENDS
    • Table 69 EDA REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
        • EDA END-USE APPLICATION TRENDS
    • Table 70 EDA REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
        • EDA TECHNOLOGY DISCUSSION
          • Industry Standards in EDA
          • Embedded Arrays and EDA
          • Field Programmable Gate Arrays and EDA
          • Different Platform Types for SOC Design
            • Different Platform Types E(Continued)
          • 90-Nanometer Design Hopes
          • FUTURE TRENDS IN EDA
          • Role of EDA Vendors in the New Universe
          • EDA and the System on a Programmable Chip Phenomenon
          • New EDA Landscape
          • Tools Discussion-Silicon Vendors
          • Tools Discussion-EDA Vendors
          • Design Styles in EDA
            • Design Styles in EDA (Continued)
          • EDA Design Chain Management
          • EDA-Core Enabler to Cost-Effective SOC
            • Concurrent Core Test
              • Design for Concurrent Core Test
              • Crosstalk and Noise Issues
              • Test Independence and Test Access
              • Test Access Mechanism
              • Quality Control and Cost
          • Virtual Prototypes Impact on SOC Hardware Design
            • Traditional Design Development
            • Parallel Design Development
            • Hardware and Software Development Issues in Traditional Design
            • Hardware and Software Development Issues in Parallel Design
            • Virtual Prototype Advantages
              • Virtual PrototypeEContinued)
              • Hardware Design Benefits
          • Holistic Verification in SOC
          • Design for Testability for SOC-the Economic Myths
            • Design for Testability for SOCEContinued)
          • Next Horizons for EDA
            • Design for Manufacturing
            • Design Infrastructure
            • Return on Investment Considerations
            • Design Starts
            • Market Growth
            • Design Methods
              • Consumer Applications
              • Software versus Hardware Implementation
            • Next-generation Silicon-implementation Fabric
          • Embracing Standards and Practices
          • Testing Future of SOCs
            • Testing Future of SOCs (Continued)
          • Risk in EDA Innovation
          • Profitable EDA Design
          • Key EDA Industry Propellers
          • EDA Trends and Challenges on the Horizon
            • Full-Chip Dynamic Power Integrity
            • Simulation of High-Speed Systems
            • RF Design Productivity
            • Key Considerations
          • EDA Technologies on the Horizon
            • EDA Technologies on the Horizon (Continued)
          • EDA Supplier Priorities on the Horizon
          • Latest Updates
            • Test Suite Measures Protocol Compliance
            • Flourishing Chip Design
            • Low Power SOC EDA
              • Bad Signals Interfere with 90-nanometer Designs
      • FOUNDRY MARKET OVERVIEW
        • WORLDWIDE MARKET FORECAST
    • Table 71 FOUNDRY REVENUES, THROUGH 2009 ($ MILLIONS)
        • REGIONAL TRENDS
    • Table 72 FOUNDRY REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
        • END-USE APPLICATION TRENDS
    • Table 73 FOUNDRY REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
        • FOUNDRY MARKET TECHNOLOGY DISCUSSION
          • Economics of IC Manufacturing
    • Figure 23 ECONOMICS OF SUBMICRON ICS
            • Process Feature Sizes
            • Wafer Diameter
            • Masking and Metal Levels
            • Packaging and I/O Requirements
        • FUTURE TRENDS IN FOUNDRY MARKET
          • Revisiting Foundrys Role in SOC
            • Revisiting Foundrys Role in SOC (Continued)
          • Benefits and Risks in 90-nanometer SOC Solutions
          • Wafer-Level Processing
            • Wafer-Level Processing (Continued)
          • Nanometer Approach
          • Latest Updates
            • IBM Chip Yields Under Par
              • Foundries Not Seeing Demand From System Houses
              • Flextronics Expands In-house SOC Capability
              • DongbuAnam Obtains Capacity Expansion Loan
              • Fab Capital Spending to Double this Year
              • German Foundry Sinks
      • FABLESS INDUSTRY SEGMENT
        • WORLDWIDE MARKET FORECAST
    • Table 74 FABLESS MARKET REVENUES, THROUGH 2009 ($ MILLIONS)
        • REGIONAL TRENDS
    • Table 75 FABLESS MARKET REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
        • END-USE APPLICATION TRENDS
    • Table 76 FABLESS MARKET REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
        • FABLESS MARKET TECHNOLOGY DISCUSSION
          • Drivers for the Fabless Sector
            • Mitigation of Transaction Costs
            • Communication Difficulties
            • Reduction in R&D Costs
            • Increase in Minimum Efficient Scale of Manufacturing
            • Increased Range of Process Technology Requirements
            • Cost Improvements Due to Learning Effects
          • Value Generation and Capture Under the Fabless Model
            • Value Generated by Foundries
            • Value Generated by Fabless Companies
            • Value Captured by Foundries
            • Value Captured by Fabless Companies
              • Value Captured by FablessEContinued)
        • FUTURE TRENDS IN THE FABLESS MARKET SEGMENT
          • Maintaining Innovation
          • Flexibility is Critical
          • Latest Updates
            • Qualcore Logic Geared for IBM
            • Alteras 90-nanometer, Low-k Products Taste Success
            • Peregrine and QThink Partner on Rad-hard ASIC
            • Sequans Raises its Financing Round
  • SOC MARKET SHARES
    • Table 77 SOC VENDOR LANDSCAPE AND KEY PRODUCTS
      • MARKET SHARES: SOC VENDORS
    • Table 78 TOP FIVE VENDORS-SOC, 2002-2003 ($ MILLIONS)
        • MARKET SHARES: STANDARD CELL-BASED SOC VENDORS
    • Table 79 TOP FIVE VENDORS-SC-BASED SOC, 2002-2003 ($ MILLIONS)
        • MARKET SHARES: EMBEDDED IP-BASED SOC VENDORS
    • Table 80 TOP FIVE VENDORS-EMBEDDED IP-BASED SOC, 2002-2003 ($ MILLIONS)
          • Market Shares: Micro Logic IP Vendors
    • Table 81 TOP FIVE VENDORS-MICRO LOGIC IP SOC, 2002-2003 ($ MILLIONS)
            • Renesas
            • Intel
          • Market Shares: Memory IP Vendors
    • Table 82 TOP FIVE VENDORS-MEMORY IP SOC, 2002-2003 ($ MILLIONS)
          • Market Shares: Analog IP Vendors
    • Table 83 TOP FIVE VENDORS-ANALOG IP SOC, 2002-2003 ($ MILLIONS)
          • Market Shares: ASIC/PLD IP Vendors
    • Table 84 TOP FIVE VENDORS-ASIC/PLD IP SOC VENDORS, 2002-2003 ($ MILLIONS)
      • MARKET SHARES: EDA VENDORS
        • SYNOPSYS
    • Table 85 TOP FIVE VENDORS-EDA, 2002-2003 ($ MILLIONS)
        • CADENCE
        • MENTOR GRAPHICS
        • IBM
      • MARKET SHARES: FOUNDRY MARKET VENDORS
    • Table 86 TOP FIVE VENDORS-FOUNDRY MARKET VENDORS, 2002-2003 ($ MILLIONS)
        • TSMC
    • Table 87 TSMC PROCESS TECHNOLOGY PORTFOLIO
        • UMC
    • Table 88 UMC PROCESS TECHNOLOGY PORTFOLIO
        • CHARTERED SEMICONDUCTOR MANUFACTURING
    • Table 89 CHARTERED PROCESS TECHNOLOGY PORTFOLIO
      • MARKET SHARES: FABLESS VENDORS
    • Table 90 TOP FIVE VENDORS-FABLESS SEGMENT, 2002-2003 ($ MILLIONS)
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        • RECENT DEVELOPMENTS
      • SANDCRAFT
        • PROFILE
      • SANDISK CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SANMINA-SCI CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SANYO ELECTRIC CO., LTD.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SEIKO EPSON CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SEQUENCE DESIGN, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SHARP ELECTRONICS
        • PROFILE
        • RECENT DEVELOPMENTS
      • SIGMA DESIGNS, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SILICON DESIGN SOLUTIONS, INC.
        • PROFILE
      • SILICON INTEGRATED SYSTEMS CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SILICON LOGIC ENGINEERING, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SILICORE CORP.
        • PROFILE
      • SILTERRA MALAYSIA
        • PROFILE
        • RECENT DEVELOPMENTS
      • SIPEX CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SONICS, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SONY CORP.
        • PROFILE
      • STMICROELECTRONICS
        • PROFILE
        • RECENT DEVELOPMENTS
      • SUN MICROSYSTEMS, INC.
        • PROFILE
      • SUNPLUS TECHNOLOGY COMPANY LTD.
        • PROFILE
      • SUPERH, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • SYNOPSYS
        • PROFILE
        • RECENT DEVELOPMENTS
      • SYNPLICITY
        • PROFILE
        • RECENT DEVELOPMENTS
      • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
        • PROFILE
        • RECENT DEVELOPMENTS
      • TAKASIC
        • PROFILE
      • TELAIRITY SEMICONDUCTOR, INC.
        • PROFILE
      • TENSILICA, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • TEXAS INSTRUMENTS
        • PROFILE
        • RECENT DEVELOPMENTS
      • THESEUS LOGIC, INC.
        • PROFILE
      • TOSHIBA SEMICONDUCTOR CO.
        • PROFILE
        • RECENT DEVELOPMENTS
      • TOWER SEMICONDUCTOR, LTD.
        • PROFILE
        • RECENT DEVELOPMENTS
      • TRANSMETA CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • TRIAD SEMICONDUCTOR, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • TRIDENT MICROSYSTEMS, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • TRISCEND CORP.
        • PROFILE
      • TUNDRA SEMICONDUCTOR CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • UNITED MICROELECTRONICS CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • VERISITY
        • PROFILE
        • RECENT DEVELOPMENTS
      • VIA TECHNOLOGIES, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • VIRAGE LOGIC CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • VIRTUAL SILICON TECHNOLOGY, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • VITESSE SEMICONDUCTOR CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • WHITE ELECTRONIC DESIGNS CORP.
        • PROFILE
      • WINBOND ELECTRONICS CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
      • XILINX, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • ZAIQ TECHNOLOGIES, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • ZARLINK SEMICONDUCTOR INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • ZETTACORE, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • ZILOG, INC.
        • PROFILE
        • RECENT DEVELOPMENTS
      • ZORAN CORP.
        • PROFILE
        • RECENT DEVELOPMENTS
  • APPENDIX
      • SOC PATENTS
    • Table 91 NUMBER OF SOC PATENTS, THROUGH 2004*
    • Table 92 SOC PATENTS BY AREA OF STUDY, 2001-2004*
    • Table 93 TOP GLOBAL SOC ASSIGNEES, 2001-2004
      • GLOSSARY
        • GLOSSARY (CONTINUED)
        • GLOSSARY (CONTINUED)
        • GLOSSARY (CONTINUED)

LIST OF TABLES

  • Summary Table: WORLD SOC MARKET, THROUGH 2009 ($ MILLIONS, MILLION UNITS)
  • Table 1 WORLD SOC REVENUE, THROUGH 2009 ($ MILLIONS)
  • Table 2 SOC REVENUES AS PERCENT OF TOTAL SEMICONDUCTOR REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 3 WORLD SOC UNITS, THROUGH 2009 (MILLIONS)
  • Table 4 WORLD SOC AVERAGE SELLING PRICE (ASP) TRENDS, THROUGH 2009 ($)
  • Table 5 WORLD SOC UNIT TRENDS BY DIAMETER CATEGORIES, THROUGH 2009 (MILLIONS)
  • Table 6 WORLD SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 7 WORLD SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 8 INNOVATIVE FEATURES IN THE AUTOMOTIVE INDUSTRY, 2004-2009
  • Table 9 SOC REVENUE BY PRODUCT CATEGORY, THROUGH 2009 ($ MILLIONS)
  • Table 10 SOC UNITS BY PRODUCT CATEGORY, THROUGH 2009 (MILLIONS OF UNITS)
  • Table 11 SOC UNIT PRICE TRENDS BY PRODUCT CATEGORY, THROUGH 2009 ($)
  • Table 12 SC-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 13 SC-BASED SOC UNITS, THROUGH 2009 (MILLIONS)
  • Table 14 SC-BASED SOC ASP, THROUGH 2009 ($)
  • Table 15 SC-BASED SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 16 SC-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 17 VERTICAL DISINTEGRATION OF SEMICONDUCTOR INDUSTRY
  • Table 18 EMBEDDED IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 19 EMBEDDED IP-BASED SOC UNITS, THROUGH 2009 (MILLIONS)
  • Table 20 EMBEDDED IP-BASED SOC ASP, THROUGH 2009 ($)
  • Table 21 NUMBER OF NEW SOC DESIGN STARTS, THROUGH 2009
  • Table 22 CAPTIVE AND COMMERCIAL IP LIBRARY MARKET, THROUGH 2009 ($ MILLIONS)
  • Table 23 EMBEDDED IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 24 EMBEDDED IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 25 EMBEDDED IP-BASED SOC REVENUES BY COMPONENT TYPE, THROUGH 2009 ($ MILLIONS)
  • Table 26 MICROLOGIC IP-BASED SOC REVENUES BY COMPONENT TYPE, THROUGH 2009 ($ MILLIONS)
  • Table 27 MPU IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 28 MCU/MPR IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 29 DSP IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 30 MEMORY IP-BASED SOC REVENUES BY COMPONENT TYPE, THROUGH 2009 ($ MILLIONS)
  • Table 31 DRAM IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 32 SRAM IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 33 FLASH MEMORY IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 34 OTHER MEMORY IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 35 ASIC/FPLD IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 36 ANALOG IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 37 OTHER COMPONENT IP-BASED SOC REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 38 MICROLOGIC IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 39 MPU IP-BASED SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 40 MCU/MPR IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 41 DSP IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 42 MEMORY IP-BASED SOC REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 43 DRAM IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 44 SRAM IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 45 FLASH MEMORY IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 46 OTHER MEMORY IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 47 ASIC/PLD IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 48 ANALOG IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 49 OTHER COMPONENT IP-BASED REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 50 MICRO LOGIC IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 51 MPU IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 52 MCU/MPR IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 53 DSP IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 54 MEMORY IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 55 DRAM IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 56 SRAM IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 57 FLASH MEMORY IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 58 OTHER MEMORY IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 59 ASIC/PLD IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 60 ANALOG IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 61 OTHER COMPONENT IP-BASED SOC REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 62 NUMBER OF SOC DESIGNS WITH REUSABLE IP, THROUGH 2009
  • Table 63 COST % OF TOTAL REVENUE FOR INTEGRATED VS. FABLESS COMPANIES
  • Table 64 COST % OF TOTAL REVENUE FOR NO EXTERNAL IP VS. EXTERNAL IP
  • Table 65 WORLDWIDE FASIC MARKET, THROUGH 2009 ($ MILLIONS)
  • Table 66 WORLDWIDE DSP IN THE TOY MARKET, THROUGH 2009 ($ MILLIONS)
  • Table 67 EDA REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 68 EDA REVENUES AS A PERCENTAGE OF TOTAL SEMICONDUCTOR MARKET, THROUGH 2009 ($ MILLIONS)
  • Table 69 EDA REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 70 EDA REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 71 FOUNDRY REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 72 FOUNDRY REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 73 FOUNDRY REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 74 FABLESS MARKET REVENUES, THROUGH 2009 ($ MILLIONS)
  • Table 75 FABLESS MARKET REVENUE BY REGION, THROUGH 2009 ($ MILLIONS)
  • Table 76 FABLESS MARKET REVENUE BY APPLICATION, THROUGH 2009 ($ MILLIONS)
  • Table 77 SOC VENDOR LANDSCAPE AND KEY PRODUCTS
  • Table 78 TOP FIVE VENDORS-SOC, 2002-2003 ($ MILLIONS)
  • Table 79 TOP FIVE VENDORS-SC-BASED SOC, 2002-2003 ($ MILLIONS)
  • Table 80 TOP FIVE VENDORS-EMBEDDED IP-BASED SOC, 2002-2003 ($ MILLIONS)
  • Table 81 TOP FIVE VENDORS-MICRO LOGIC IP SOC, 2002-2003 ($ MILLIONS)
  • Table 82 TOP FIVE VENDORS-MEMORY IP SOC, 2002-2003 ($ MILLIONS)
  • Table 83 TOP FIVE VENDORS-ANALOG IP SOC, 2002-2003 ($ MILLIONS)
  • Table 84 TOP FIVE VENDORS-ASIC/PLD IP SOC, 2002-2003 VENDORS ($ MILLIONS)
  • Table 85 TOP FIVE VENDORS-EDA, 2002-2003 ($ MILLIONS)
  • Table 86 TOP FIVE VENDORS-FOUNDRY MARKET VENDORS, 2002-2003 ($ MILLIONS)
  • Table 87 TSMC PROCESS TECHNOLOGY PORTFOLIO
  • Table 88 UMC PROCESS TECHNOLOGY PORTFOLIO
  • Table 89 CHARTERED PROCESS TECHNOLOGY PORTFOLIO
  • Table 90 TOP FIVE VENDORS-FABLESS SEGMENT, 2002-2003 ($ MILLIONS)
  • Table 91 NUMBER OF SOC PATENTS, THROUGH 2004
  • Table 92 SOC PATENTS BY AREA OF STUDY, 2001-2004
  • Table 93 TOP GLOBAL SOC ASSIGNEES, 2001-2004

LIST OF FIGURES

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