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市場調查報告書

電子元件的塑膠:技術及全球市場

Plastics in Electronics Components: Technologies and Global Markets

出版商 BCC Research 商品編碼 232001
出版日期 內容資訊 英文 196 Pages
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電子元件的塑膠:技術及全球市場 Plastics in Electronics Components: Technologies and Global Markets
出版日期: 2015年09月11日 內容資訊: 英文 196 Pages
簡介

全球電子元件市場2014年以重量為基礎達到了36億磅。該市場預計從2015年到2020年以3.3%的年複合成長率發展,到2015年達約38億磅,到2020年達44億磅以上。

本報告提供全球電子元件用塑膠市場與其技術的相關調查、電子元件所使用的聚合物與其開發趨勢、電子元件產品、專利、產業趨勢及技術趨勢的分析、主要企業簡介等彙整,為您概述為以下內容。

第1章 簡介

第2章 摘要

第3章 電子元件所使用的聚合物

  • 概要
  • 聚合物的種類
  • 熱塑性物質
    • 熱塑性聚酯
    • 聚苯硫
    • 聚醯亞胺
    • 聚碳酸酯
    • 聚鄰苯二甲醯胺
    • 液晶聚合物
    • 磺酸鹽聚合物
    • 合金/混合
    • 含氟聚合物
    • 聚芳基醚酮
    • 環狀烯烴共聚物 (COC)
    • 熱塑性物質市場估計、預測摘要
    • 熱固性樹脂
    • 酚類
    • 不飽和聚酯
    • BT環氧樹脂、氰基酸酯
    • 熱固性樹脂市場估計、預測摘要

第4章 主要零件、印刷電路板 (PCB) 、膠囊材料概要

  • 簡介
  • 本調查的關注點
  • 樹脂的消費
  • 印刷電路板 (PCB)
  • 膠囊材料
  • 環氧樹脂封裝配方
  • 封裝電器及電子零件
  • 環氧樹脂膠囊材料系統
  • 矽膠囊材料
  • 熱塑性物質膠囊材料
  • 主要的膠囊材料廠商與其產品線
  • 市場估計、預測

第5章 成型電子元件

  • 概要
  • 背景
  • 使用聚合物
  • 市場成長的促進要素
  • 連接器
  • 終端用途市場
  • 市場估計、預測
  • 交換器
  • 線圈架
  • 繼電器
  • 電容器
  • 其他成型電子元件

第6章 利用、產業趨勢

  • 概要
  • 電子設備市場概要
  • 電腦
  • 電子顯示器
  • 「All-in-one」機器
  • 電話
  • 傳真
  • 掃描機
  • 行動電子設備
  • 汽車市場

第7章 電子元件相關的技術趨勢、最新的專利

  • 背景
  • 細微化的重要性
  • 薄壁掛式電子元件
  • 軟性電子產品
  • 穿戴式電子產品
  • 雲端運算、巨量資料
  • 萬物聯網
  • 帶來樹脂的選擇的影響的電子元件製造商變化
  • 產業相關的最新的專利

第8章 電子元件產業概要、塑膠廠商

  • 主要的半導體廠商、客戶
  • 製造、行銷的方面
  • 塑膠廠商
  • 各材料種類的聚合物廠商

第9章 環境問題

  • 概要
  • 印刷電路板 (PCB) 的廢棄
  • 無溴的印刷電路板 (PCB)
  • 鹵素自由的面向熱塑性物質阻燃劑
  • 回收
  • 電子工業的介面

第10章 電子元件相關的效能必要條件

  • 概要
    • 可燃性標準
    • 可燃性檢驗
    • 其他標準

第11章 主要企業簡介

  • 旭化成Chemicals Corp.
  • ASHLAND SPECIALTY CHEMICALS
  • BASF
  • CELANESE
  • COVESTRO
  • CYTEC INDUSTRIES INC.
  • DSM
  • DUPONT
  • EMS GRIVORY
  • EPIC RESINS
  • HENKEL AG
  • HUNTSMAN ADVANCED MATERIALS
  • INTERPLASTIC CORP.
  • KINGFA
  • LANXESS
  • MITSUBISHI ENGINEERING PLASTICS
  • POLYPLASTICS
  • SABIC INNOVATIVE PLASTICS
  • SOLVAY SPECIALTY POLYMERS
  • Sumitomo Bakelite
  • TORAY PLASTICS
  • VICTREX

第12章 附錄

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目錄
Product Code: PLS027D

REPORT HIGHLIGHTS

The global electronic component market volume was 3.6 billion pounds in 2014. This market should reach nearly 3.8 billion pounds in 2015 and more than 4.4 billion pounds by 2020, demonstrating a compound annual growth rate (CAGR) of 3.3% from 2015 to 2020.

This report provides:

  • An overview of the global market for plastics in electronic components.
  • Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020.
  • Information about pricing of resins, molders of electronic components, testing agencies and requirements related to electronic components.
  • Discussion of emerging and developmental technologies and applications that have the greatest commercial potential through 2020.
  • Coverage of single devices such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
  • Comprehensive company profiles of major players in the industry.

SCOPE AND FORMAT

This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.

The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.

ANALYST'S CREDENTIALS

Research analyst Peter Mapleston has been working in and with the plastics industry for 38 years. Since 1983, he has written for some of the world's leading publications in the sector, covering developments in materials, equipment, processing technologies and markets. He holds a Bachelor of Science degree in polymer science and technology.

Table of Contents

CHAPTER 1 - INTRODUCTION

  • OBJECTIVES
  • SCOPE AND FORMAT
  • REASONS FOR DOING THE STUDY
  • INTENDED AUDIENCE
  • METHODOLOGY AND INFORMATION SOURCES
  • RELATED BCC RESEARCH REPORTS
  • ANALYST'S CREDENTIALS
  • BCC RESEARCH WEBSITE
  • DISCLAIMER

CHAPTER 2 - SUMMARY

  • SUMMARY TABLE: GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, THROUGH 2020 (MILLION POUNDS)
  • SUMMARY FIGURE: GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, 2014-2020 (MILLION POUNDS)

CHAPTER 3 - POLYMERS USED IN ELECTRONIC COMPONENTS

  • OVERVIEW
  • TYPES OF POLYMERS
  • THERMOPLASTICS
    • STANDARD NYLONS
      • Background
      • Properties
      • Major Types
        • Nylon 66
        • Nylon 6
        • Reinforced Nylons
          • Background
          • Processing
          • Applications
            • TABLE 1: EXAMPLES OF STANDARD NYLONS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
      • Recent Developments
        • BASF Nylon Polymerization Plant in China
        • Invista to Make Nylon 66 Polymer in China
        • Lanxess Starts Up Nylons Unit in Antwerp
        • "Super 66" from Solvay Engineering Plastics
        • Wax-Free Nylons from Akro-Plastic
        • Enhanced Thermal Aging in New Zytel from DuPont
        • Halogen-Free Flame-Retardant Reinforced Nylon From BASF
      • Market Estimates and Forecasts
        • TABLE 2: GLOBAL STANDARD NYLON ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • THERMOPLASTIC POLYESTERS
    • Background
    • Polybutylene Terephthalate
      • Properties
      • Applications
        • TABLE 3: EXAMPLES OF POLYBUTYLENE TEREPHTHALATES USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
      • Recent Developments
        • Sipchem Starts Up Polybutylene Terephthalate Plant
        • Carbon-Fiber-Reinforced Polybutylene Terephthalate From BASF
        • Flame Retardant Polybutylene Terephthalate from Polyplastics
        • Halogen-Free Reinforced Flame Retardant Grades From Lanxess
        • Hydrolysis-Resistant Polybutylene Terephthalates from BASF
        • Hydrolysis-Resistant Polybutylene Terephthalates from DuPont
        • Hydrolysis-Resistant Polybutylene Terephthalates from Lanxess
    • Polyethylene Terephthalate
      • Background
      • Properties and Grades
      • Applications
      • Recent Developments
        • Halogen-Free Rynite from DuPont
        • Thermally Conductive Polyethylene Terephthalate from DSM
    • Polycyclohexylenedimethylene Terephthalate
      • Background
      • Properties
      • Recent Developments
        • Glass-Reinforced Compound from Solvay
      • Market Estimates and Forecasts
        • TABLE 4: GLOBAL POLYBUTYLENE TEREPHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
        • TABLE 5: GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • POLYPHENYLENE SULFIDE
    • Background
    • Properties
    • Advantages and Disadvantages
    • Applications
      • TABLE 6: EXAMPLES OF POLYPHENYLENE SULFIDE AND POLYPHENYLENE SULFIDE BLENDS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • Recent Developments
      • Solvay Completes Acquisition of Ryton PPS
      • Lumena Completes Polyphenylene Sulfide Expansion, Has Some Liquidity Problems
      • DIC Planning Polyphenylene Sulfide Compounding Plant in China
      • Chlorine-Free Polyphenylene Sulfide From SK Chemicals
      • Celanese Adds Polyphenylene Sulfide to Compounding Capacity in Nanjing
      • Idemitsu Transfers Polyphenylene Sulfide Business to Lion Idemitsu Composites
      • Toray to Establish New Production Base for Torelina Polyphenylene Sulfide in South Korea
      • Halogen-Free Polyphenylene Sulfide from Celanese
    • Market Estimates and Forecasts
      • TABLE 7: GLOBAL POLYPHENYLENE SULFIDE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • POLYIMIDES
    • Background
    • Properties and Applications
    • Polyimide Films
    • Polyetherimide
      • Background and Properties
      • Applications
      • Recent Developments
        • Ultem Shortage
    • Polyamide-Imide
      • Background and Properties
      • Applications
    • Market Estimates and Forecasts
      • TABLE 8: GLOBAL POLYIMIDE* ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • POLYCARBONATES
    • Background
    • General Grades
    • Properties
      • Overview
      • Property Advantages and Disadvantages
    • Polyester Carbonates
    • Impact of Bisphenol A on Polycarbonate Usage
    • Processing
    • Applications
      • TABLE 9: EXAMPLES OF POLYCARBONATES USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • Alloys/Blends
    • Supply and Demand
    • Recent Developments
      • Sabic Codevelops Conductive Transparent Polycarbonate Film
      • Mitsubishi Gas Chemical Doubles Specialty Polycarbonate Capacity
      • Teijin Shutting Polymer Plant in Singapore
      • Trinseo Realigns Businesses
    • Market Estimates and Forecasts
      • TABLE 10: GLOBAL POLYCARBONATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • POLYPHTHALAMIDES AND OTHER HIGH-TEMPERATURE NYLONS
    • Overview
    • Polyphthalamides
      • Properties and Applications
        • TABLE 11: EXAMPLES OF POLYPHTHALAMIDE POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • Other High-Temperature Nylons
      • Nylon 46
      • Nylon 4T
      • Nylon 9T
      • MXD6
      • Recent Developments
      • Biosourced Nylon 610, MXD6-Based Compound from Solvay Specialty Polymers
      • DuPont Adding Zytel HTN Capacity
      • 6T and 10T Types from Evonik
      • Solvay Compounding in China
    • Market Estimates and Forecasts
      • TABLE 12: GLOBAL POLYPHTHALAMIDES AND HIGH-TEMPERATURE NYLONS ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • LIQUID CRYSTAL POLYMERS
    • Background
    • Properties
    • Applications
      • TABLE 13: EXAMPLES OF LIQUID CRYSTAL POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • Recent Developments
      • Polyplastics Launches Second-Generation Laperos Liquid Crystal Polymer
      • New Xydar Liquid Crystal Polymer for High-Speed Surface-Mount Device Connectors
    • Market Estimates and Forecasts
      • TABLE 14: GLOBAL LIQUID CRYSTAL POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • SULFONE POLYMERS
    • Background
    • Properties
    • Applications
    • Producer Scenario
    • Recent Developments
      • BASF Opens Ultrason Plant in South Korea
      • Another High-Temperature Sulfone from Solvay
    • Market Estimates and Forecasts
      • TABLE 15: GLOBAL SULFONE POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • ALLOYS/BLENDS
    • Background
    • Polyphenylene Ether/High-Impact Polystyrene
      • Background
      • Properties
    • Polyphenylene Ether/Nylon
      • Background and Properties
    • Polycarbonate/Polyester Blends
    • Market Estimates and Forecasts
      • TABLE 16: GLOBAL POLYMER ALLOY/BLEND ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • FLUOROPOLYMERS
    • Background
    • Properties and Applications
    • Producers
    • Recent Developments
      • DuPont Establishes Chemours
      • Solvay Sets Up Fluoropolymer Joint Venture in China
    • Market Estimates and Forecasts
      • TABLE 17: GLOBAL FLUOROPOLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • POLYARYLETHERKETONES
    • Background
    • Properties
    • Applications
      • TABLE 18: EXAMPLES OF PAEK USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • Recent Developments
      • Solvay Builds U.S. Specialty Polymers PEEK Production Unit
      • New Victrex Polymer Plant
      • Victrex Opens PAEK Films Plant
      • New Capacity from Gharda
    • Market Estimates and Forecasts
      • TABLE 19: GLOBAL POLYARYLETHERKETONE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • CYCLIC OLEFIN COPOLYMERS
    • Background
    • Properties and Applications
    • Producers
  • THERMOPLASTIC MARKET ESTIMATES AND FORECASTS SUMMARY
    • TABLE 20: GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020 (MILLION POUNDS)
  • THERMOSET POLYMERS
    • OVERVIEW
    • GENERAL PROPERTIES
      • TABLE 21: THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
    • EPOXY RESINS
      • Background
      • Chemistry and Properties
      • Processing
      • Applications
      • Important Epoxy Grades and Producers
        • TABLE 22: EXAMPLES OF EPOXY RESINS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
      • Recent Developments
        • Dow Possibly Exiting Epoxies
        • PPE from Sabic Acts as Epoxy Modifier
      • Market Estimates and Forecasts
        • TABLE 23: GLOBAL EPOXY RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • POLYURETHANES
      • Background
      • Reaction-Injection Molding Products
      • Applications
      • Producers
        • TABLE 24: EXAMPLES OF POLYURETHANE SYSTEMS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
    • Recent Developments
    • Market Estimates and Forecasts
      • TABLE 25: GLOBAL POLYURETHANE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS
  • PHENOLICS
    • Background
    • Molding Compounds
    • Applications
    • Producers
      • TABLE 26: EXAMPLES OF PHENOLICS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
    • Market Estimates and Forecasts
      • TABLE 27: GLOBAL PHENOLIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • UNSATURATED POLYESTERS
    • Background
    • Applications
      • Overview
      • Electrical/Electronic
    • Producers
      • TABLE 28: EXAMPLES OF UNSATURATED POLYESTER AND VINYL ESTER RESINS AND COMPOUNDS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
    • Market Estimates and Forecasts
      • TABLE 29: GLOBAL UNSATURATED POLYESTER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • DIALLYL PHTHALATE
    • Overview
    • Background and Applications
    • Producers
    • Market Estimates and Forecasts
      • TABLE 30: GLOBAL DIALLYL PHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
  • BT-EPOXY RESINS AND CYANATE ESTERS
  • THERMOSET MARKET ESTIMATES AND FORECASTS SUMMARY
    • TABLE 31: GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020 (MILLION POUNDS)

CHAPTER 4 - OVERVIEW OF KEY COMPONENTS, PRINTED CIRCUIT BOARDS AND ENCAPSULANTS

  • INTRODUCTION
  • FOCUS OF THIS REPORT
  • RESIN CONSUMPTION
    • BACKGROUND
    • MARKETS
    • GROWTH
    • MARKET DRIVERS
  • PRINTED CIRCUIT BOARDS
    • OVERVIEW
    • PROPERTY REQUIREMENTS FOR LAMINATES
      • Electrical
      • Mechanical
      • Thermal
      • Other Property Requirements
    • PHYSICAL COMPOSITION
    • ASSEMBLY TECHNOLOGIES
    • PCB SUBSTRATES
      • TABLE 32: IMPORTANT TECHNICAL FACTORS TO CONSIDER WHEN SELECTING PRINTED CIRCUIT BOARD SUBSTRATE MATERIALS
      • FR-2 Paper/Phenolic
      • FR-4 Epoxy
      • Other Types
    • SPECIFIC POLYMERS USED IN PRINTED CIRCUIT BOARDS
      • Epoxies
      • Polyimides
      • Cyanate Esters
      • Polytetrafluoroethylene
      • Bismaleimide-Triazine Resins
      • Phenolics
      • Melamine
    • OTHER MATERIALS USED IN PRINTED CIRCUIT BOARDS
      • Copper Foils
    • FIBER REINFORCEMENTS
      • Glass Cloth
      • Aramid Fibers
    • PRODUCTION OF CIRCUITRY
    • ENVIRONMENTAL ISSUES
      • Flame Retardants
    • RECENT DEVELOPMENTS
      • Extruded Thermoplastic Circuit Board
      • High Thermal Conductivity PCB Material
    • FLEXIBLE PRINTED CIRCUIT BOARDS
      • Background
      • Applications
      • Technology
      • Standards
      • Advantages
      • Materials Used
        • Overview
        • Polyimides
        • Polyesters
        • Aramids
        • Epoxy Resins
        • Adhesiveless Laminates
      • Rigid-Flex Circuits
      • Recent Developments
        • High-Temperature Flexible Circuit Material System From DuPont
        • Flame-Retardant Polyester Film From Teijin DuPont Films
        • Polyimide-Based System for High Temperatures
        • Kaneka Expands Film Business
        • SKC Kolon PI Expanding
      • Comparison Between Rigid and Flexible Circuit Boards
        • TABLE 33: COMPARISON BETWEEN RIGID AND FLEXIBLE CIRCUIT BOARDS
      • Producers of Rigid and Flexible Circuit Boards
        • TABLE 34: MAJOR PRODUCERS OF RIGID AND FLEXIBLE CIRCUIT BOARDS
    • SOLDERING
    • Background
    • Some Technologies
    • Lead-Free Electronic Soldering
    • PRODUCTION STATISTICS
    • INDUSTRY TRENDS
    • ELECTRONIC PACKAGING
      • Overview
      • Background
      • Wire Bonding
      • Chip-On-Board
      • Tape Automated Bonding
      • Flip Chip Bonding
      • Package Types
        • Dual-in-Line
        • Pin Grid Arrays
        • Ball Grid Arrays
      • Other Key, Selected Electronic Packaging/Interconnection Technologies
        • Multichip Modules
      • Printed Circuit Board Assembly Techniques
        • Overview
        • Through-Hole technology
        • Surface-Mount Technology
        • Intrusive Reflow
        • Process
        • Advantages and Disadvantages of SMT vs. Through-Hole
          • Advantages
          • Disadvantages
      • Soldering Techniques
        • Resin and Material Usage
        • Competitive Resin Scenario for Surface-Mount Technology Devices
      • Three-Dimensional Molded Interconnected Devices
        • Background
        • Applications
        • Manufacturing Technologies
          • TABLE 35: POLYMERS SUITABLE FOR PRODUCTION OF 3D-MIDS USING LDS TECHNOLOGY
        • Alternative MID Technologies
          • TABLE 36: ADVANTAGES AND DISADVANTAGES OF LDS AND TWO-COMPONENT MOLDING FOR 3D-MIDS
        • Recent Developments
          • Laser Plasma Coating
          • Integrated Plastic-Metal Injection Molding
          • Three-Dimensional Printed Electronics
    • MARKET ESTIMATES AND FORECASTS
      • TABLE 37: GLOBAL PRINTED CIRCUIT BOARD MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 38: GLOBAL PCB* MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 39: GLOBAL PRINTED CIRCUIT BOARD MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
  • ENCAPSULANTS
    • DEFINITIONS AND BACKGROUND
    • PRIMARY PURPOSES OF ENCAPSULATION
    • ENCAPSULANT MATERIALS
      • Overview
      • Impact of Thermoplastics
      • Types
        • TABLE 40: TYPES OF ENCAPSULANT MATERIALS - ADVANTAGES AND DISADVANTAGES
  • EPOXY ENCAPSULATION FORMULATIONS
    • TABLE 41: EPOXY ENCAPSULANT FORMULATIONS
  • ENCAPSULATED ELECTRICAL AND ELECTRONIC COMPONENTS
    • Background
    • Specific Encapsulant Applications
  • EPOXY ENCAPSULANT SYSTEMS
  • SILICONE ENCAPSULANTS
  • THERMOPLASTIC ENCAPSULANTS
  • MAJOR SELECTED ENCAPSULANT PRODUCERS AND THEIR PRODUCT LINES
    • Bostik
    • Henkel
    • Huntsman
    • Lord Chemical
  • MARKET ESTIMATES AND FORECASTS
    • TABLE 42: GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 43: GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 44: GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)

CHAPTER 5 - MOLDED ELECTRONIC PRODUCTS

  • OVERVIEW
  • BACKGROUND
  • POLYMERS USED
  • MARKET DRIVERS
  • CONNECTORS
    • BACKGROUND
    • TRENDS
    • APPLICATIONS FOR ELECTRONIC CONNECTORS
    • MATERIAL SELECTION
    • FLAME RETARDANCE
    • STANDARDS RELATING TO CONNECTORS
    • MANUFACTURERS
      • TABLE 45: MAJOR MANUFACTURERS OF ELECTRONIC CONNECTORS
  • END-USE MARKETS
    • Background
    • Automotive Industry
    • Appliances
    • Other Markets
  • MARKET ESTIMATES AND FORECASTS
    • TABLE 46: GLOBAL ELECTRONIC CONNECTOR MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 47: GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 48: GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
  • SWITCHES
    • BACKGROUND
    • MARKET ESTIMATES AND FORECASTS
      • TABLE 49: GLOBAL ELECTRONIC SWITCH MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 50: GLOBAL ELECTRONIC SWITCH MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 51: GLOBAL ELECTRONIC COMPONENT SWITCH MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
  • COIL FORMERS
    • BACKGROUND
    • MANUFACTURERS
      • TABLE 52: SELECTED MANUFACTURERS MOLDING COIL FORMERS FOR ELECTRONIC APPLICATIONS
    • MARKET ESTIMATES AND FORECASTS
      • TABLE 53: GLOBAL COIL-FORMER MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 54: GLOBAL COIL-FORMER MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 55: GLOBAL COIL-FORMER MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
  • RELAYS
    • BACKGROUND
    • MARKET ESTIMATES AND FORECASTS
      • TABLE 56: GLOBAL RELAY MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 57: GLOBAL RELAY MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 58: GLOBAL RELAY MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
  • CAPACITORS
    • BACKGROUND
    • APPLICATIONS
    • CAPACITOR MATERIALS
    • CONSUMPTION BY MARKET SEGMENT
    • MARKET ESTIMATES AND FORECASTS
      • TABLE 59: GLOBAL CAPACITOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
  • OTHER MOLDED ELECTRONIC COMPONENTS
    • RESISTORS
      • Background
      • Applications
      • Inductors/Transformers
      • Plastics Usage
    • MARKET ESTIMATES AND FORECASTS
      • TABLE 60: GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 61: GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
      • TABLE 62: GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • SUMMARY OF MARKET ESTIMATES AND FORECASTS
      • TABLE 63: GLOBAL ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
      • TABLE 64: GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
      • TABLE 65: GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)

CHAPTER 6 - USES AND INDUSTRY TRENDS

  • OVERVIEW
  • SNAPSHOT OF THE ELECTRONIC DEVICE MARKET
  • COMPUTERS
    • OVERVIEW
    • DESKTOPS
  • ELECTRONIC DISPLAYS
    • BACKGROUND
    • PRINTERS
    • OVERVIEW
    • INKJET PRINTERS
    • MONOCHROME LASER PRINTERS
    • COLOR LASER PRINTERS
    • MANUFACTURERS
  • “ALL-IN-ONE” MACHINES
  • PHONES
    • CORDED
    • CORDLESS
  • FAX MACHINES
  • SCANNERS
  • MOBILE ELECTRONIC DEVICES
    • PHONES
    • LAPTOPS/NOTEBOOKS/NETBOOKS
    • TABLETS
    • E-READERS
    • DIGITAL MUSIC PLAYERS
  • AUTOMOTIVE MARKET
    • OVERVIEW
    • ELECTRIC CARS
    • CAFE ISSUES
    • OVERVIEW OF ELECTRONIC COMPONENTS IN AUTOMOTIVE PRODUCTS
    • MATERIAL USAGE
    • CONNECTORS
    • SENSORS
    • FLEXIBLE CIRCUITRY IN AUTOMOTIVE

CHAPTER 7 - TECHNOLOGY TRENDS AND RECENT PATENTS RELATED TO ELECTRONIC COMPONENTS

  • BACKGROUND
  • IMPORTANCE OF MINIATURIZATION
  • THIN-WALLING ELECTRONIC COMPONENTS
    • BACKGROUND
    • EFFECTS OF THIN-WALLING ON PERFORMANCE REQUIREMENTS AND DESIGN
    • APPLICATION REQUIREMENTS
    • MATERIAL AND PROCESS SELECTION
    • PROPERTIES REQUIRED
    • CHALLENGES IN DOWNSIZING
    • SOFTWARE THAT AIDS THIN-WALL DESIGN
  • FLEXIBLE ELECTRONICS
    • OVERVIEW
  • WEARABLE ELECTRONICS
  • CLOUD COMPUTING AND BIG DATA
  • THE INTERNET OF EVERYTHING
  • CHANGES IN ELECTRONIC COMPONENT MANUFACTURING THAT COULD IMPACT RESIN CHOICES
  • RECENT PATENTS RELATED TO THE INDUSTRY
    • MULTI-FUNCTIONAL KEYBOARD ASSEMBLIES - APPLE INC. (CUPERTINO, CALIF.) - 20140118264 - MAY 1, 2014
    • ELECTRONIC DEVICE IN PLASTIC - THIEL, DAVID (NATHAN, AUSTRALIA), MADHUSUDANRAO, NEELI (NATHAN, AUSTRALIA) - 20140146501 - MAY 29, 2014
    • A METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT - BASF (LUDWIGSHAFEN, GERMANY) - WO/2014/113323 - JULY 24, 2014
    • METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED THEREON - OMRON CORP. (KYOTO, JAPAN) - 20130175074 - JULY 24, 2014
    • PRINTED THREE-DIMENSIONAL (3D) FUNCTIONAL PART AND METHOD OF MAKING - PRESIDENT AND FELLOWS OF HARVARD COLLEGE - WO2014209994 A2 - DECEMBER 31, 2014
    • FLEXIBLE ELECTRONIC DEVICES - APPLE INC. (CUPERTINO, CALIF.) - 8929085 A2 - JANUARY 6, 2015
    • PRINTED CIRCUIT BOARD ASSEMBLY - SAMSUNG ELECTRO-MECHANICS CO. (SUWON-SI, GYEONGGI-DO, SOUTH KOREA) - 8971047- MARCH 3, 2015
    • CASE OF ELECTRONIC DEVICE HAVING LOW-FREQUENCY ANTENNA PATTERN EMBEDDED THEREIN, MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF - SAMSUNG ELECTRO-MECHANICS CO. (SUWON-SI, GYEONGGI-DO, SOUTH KOREA) - 8976074- MARCH 10, 2015
    • EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE - SUMITOMO BAKELITE CO. LTD. (TOKYO, JAPAN) - 8987355 - MARCH 24, 2015
    • PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD - AJINOMOTO CO. INC. (TOKYO, JAPAN) - 8992713- MARCH 31, 2015

CHAPTER 8 - ELECTRONIC COMPONENT INDUSTRY OVERVIEW AND PLASTICS PRODUCERS

  • TOP SEMICONDUCTOR PRODUCERS AND CUSTOMERS
    • TABLE 66: TOP GLOBAL SEMICONDUCTOR PRODUCER COMPANIES, 2014 ($ BILLIONS)
    • TABLE 67: TOP GLOBAL SEMICONDUCTOR CUSTOMERS, 2014 ($ BILLIONS)
  • MANUFACTURING AND MARKETING ASPECTS
    • GLOBALIZATION
    • WHAT COMPONENT SUPPLIERS ARE DOING
  • PLASTICS PRODUCERS
    • OVERVIEW
      • TABLE 68: TRADE NAMES OF SELECTED, KEY PLASTICS USED IN ELECTRONIC COMPONENTS
  • POLYMER PRODUCERS ACCORDING TO MATERIAL TYPE
    • THERMOSETS
      • Epoxy Resins
      • Polyurethanes
      • Phenolics
      • Unsaturated Polyesters
      • Diallyl Phthalate
    • THERMOPLASTICS
      • Standard Nylons
      • Polyesters
      • Polyphenelene Sulfide
      • Polyimides
      • Polycarbonates
      • Liquid Crystal Polymers
      • Sulfone Polymers
      • Fluoropolymers
      • Polyphthalamides/HTNs
      • Polyaryletherketones
      • Alloys and Blends

CHAPTER 9 - ENVIRONMENTAL ISSUES

  • OVERVIEW
  • PRINTED CIRCUIT BOARD DISPOSAL
  • BROMINE-FREE PRINTED CIRCUIT BOARDS
  • HALOGEN-FREE FLAME RETARDANTS FOR THERMOPLASTICS
  • RECYCLING
  • ELECTRONIC INDUSTRY INTERFACE
    • OVERVIEW
    • REASONS FOR INCREASED ENVIRONMENTAL REGULATIONS FOR ELECTRONIC EQUIPMENT
    • THE EUROPEAN UNION ROHS DIRECTIVE
    • THE EUROPEAN UNION WEEE DIRECTIVE
    • EPEAT

CHAPTER 10 - PERFORMANCE REQUIREMENTS RELATED TO ELECTRONIC COMPONENTS

  • OVERVIEW
    • FLAMMABILITY STANDARDS
      • Definitions
    • FLAMMABILITY TESTS
      • Overview
      • UL 94
      • Glow-Wire Flammability Index - IEC 60695
      • UL 1694
      • UL 746C
    • OTHER STANDARDS
      • UL 1446
      • UL 1950

CHAPTER 11 - SELECTED COMPANY PROFILES

  • ASAHI KASEI CHEMICAL
  • ASHLAND SPECIALTY CHEMICALS
  • BASF
  • CELANESE
  • COVESTRO
  • CYTEC INDUSTRIES INC.
  • DSM
  • DUPONT
  • EMS GRIVORY
  • EPIC RESINS
  • HENKEL AG
  • HUNTSMAN ADVANCED MATERIALS
  • INTERPLASTIC CORP.
  • KINGFA
  • LANXESS
  • MITSUBISHI ENGINEERING PLASTICS
  • POLYPLASTICS
  • SABIC INNOVATIVE PLASTICS
  • SOLVAY SPECIALTY POLYMERS
  • SUMITOMO BAKELITE
  • TORAY PLASTICS
  • VICTREX

CHAPTER 12 - APPENDIX: ACRONYMS

LIST OF TABLES

  • SUMMARY TABLE: GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, THROUGH 2020 (MILLION POUNDS) 7
    • TABLE 1: EXAMPLES OF STANDARD NYLONS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 2: GLOBAL STANDARD NYLON ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 3: EXAMPLES OF POLYBUTYLENE TEREPHTHALATES USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 4: GLOBAL POLYBUTYLENE TEREPHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 5: GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 6: EXAMPLES OF POLYPHENYLENE SULFIDE AND POLYPHENYLENE SULFIDE BLENDS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 7: GLOBAL POLYPHENYLENE SULFIDE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 8: GLOBAL POLYIMIDE* ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 9: EXAMPLES OF POLYCARBONATES USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 10: GLOBAL POLYCARBONATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 11: EXAMPLES OF POLYPHTHALAMIDE POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 12: GLOBAL POLYPHTHALAMIDES AND HIGH-TEMPERATURE NYLONS ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 13: EXAMPLES OF LIQUID CRYSTAL POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 14: GLOBAL LIQUID CRYSTAL POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 15: GLOBAL SULFONE POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 16: GLOBAL POLYMER ALLOY/BLEND ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 17: GLOBAL FLUOROPOLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 18: EXAMPLES OF PAEK USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 19: GLOBAL POLYARYLETHERKETONE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 20: GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 21: THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
    • TABLE 22: EXAMPLES OF EPOXY RESINS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 23: GLOBAL EPOXY RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 24: EXAMPLES OF POLYURETHANE SYSTEMS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 25: GLOBAL POLYURETHANE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS
    • TABLE 26: EXAMPLES OF PHENOLICS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 27: GLOBAL PHENOLIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 28: EXAMPLES OF UNSATURATED POLYESTER AND VINYL ESTER RESINS AND COMPOUNDS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
    • TABLE 29: GLOBAL UNSATURATED POLYESTER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 30: GLOBAL DIALLYL PHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 31: GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 32: IMPORTANT TECHNICAL FACTORS TO CONSIDER WHEN SELECTING PRINTED CIRCUIT BOARD SUBSTRATE MATERIALS
    • TABLE 33: COMPARISON BETWEEN RIGID AND FLEXIBLE CIRCUIT BOARDS
    • TABLE 34: MAJOR PRODUCERS OF RIGID AND FLEXIBLE CIRCUIT BOARDS
    • TABLE 35: POLYMERS SUITABLE FOR PRODUCTION OF 3D-MIDS USING LDS TECHNOLOGY
    • TABLE 36: ADVANTAGES AND DISADVANTAGES OF LDS AND TWO-COMPONENT MOLDING FOR 3D-MIDS
    • TABLE 37: GLOBAL PRINTED CIRCUIT BOARD MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 38: GLOBAL PCB* MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 39: GLOBAL PRINTED CIRCUIT BOARD MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 40: TYPES OF ENCAPSULANT MATERIALS - ADVANTAGES AND DISADVANTAGES
    • TABLE 41: EPOXY ENCAPSULANT FORMULATIONS
    • TABLE 42: GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 43: GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 44: GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 45: MAJOR MANUFACTURERS OF ELECTRONIC CONNECTORS
    • TABLE 46: GLOBAL ELECTRONIC CONNECTOR MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 47: GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 48: GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 49: GLOBAL ELECTRONIC SWITCH MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 50: GLOBAL ELECTRONIC SWITCH MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 51: GLOBAL ELECTRONIC COMPONENT SWITCH MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 52: SELECTED MANUFACTURERS MOLDING COIL FORMERS FOR ELECTRONIC APPLICATIONS
    • TABLE 53: GLOBAL COIL-FORMER MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 54: GLOBAL COIL-FORMER MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 55: GLOBAL COIL-FORMER MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 56: GLOBAL RELAY MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 57: GLOBAL RELAY MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 58: GLOBAL RELAY MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 59: GLOBAL CAPACITOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 60: GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 61: GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 62: GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
    • TABLE 63: GLOBAL ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 64: GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 65: GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
    • TABLE 66: TOP GLOBAL SEMICONDUCTOR PRODUCER COMPANIES, 2014 ($ BILLIONS)
    • TABLE 67: TOP GLOBAL SEMICONDUCTOR CUSTOMERS, 2014 ($ BILLIONS)
    • TABLE 68: TRADE NAMES OF SELECTED, KEY PLASTICS USED IN ELECTRONIC COMPONENTS

LIST OF FIGURES

  • SUMMARY FIGURE: GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, 2014-2020 (MILLION POUNDS)
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