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市場調查報告書

電子元件的塑膠:技術及全球市場

Plastics in Electronics Components: Technologies and Global Markets

出版商 BCC Research 商品編碼 232001
出版日期 內容資訊 英文 177 Pages
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電子元件的塑膠:技術及全球市場 Plastics in Electronics Components: Technologies and Global Markets
出版日期: 2017年09月26日 內容資訊: 英文 177 Pages
簡介

全球電子元件市場在2016年以重量為準,達到了39億磅。該市場預計在2017年到2022年這段期間將以7.7%的年複合成長率 (CAGR) 推移,從2017年的42億磅到2020年擴大到約61億磅的規模。

本報告提供全球電子元件用塑膠市場及其技術相關調查,彙整電子元件所使用的聚合物及其開發趨勢,電子元件產品,專利,產業趨勢及技術趨勢分析,主要企業簡介等資訊,為您概述為以下內容。

第1章 簡介

第2章 摘要·亮點

第3章 市場·技術背景

  • 概要
  • 電子設備市場概要
  • 電腦
  • 電子產品顯示器
  • 印表機
  • 「All-in-one」機器
  • 電話
  • 傳真
  • 掃描機
  • 行動電子設備
  • 汽車市場

第4章 市場分析:技術類別

  • 概要
  • 聚合物的種類
  • 熱塑性物質
    • 標準尼龍
    • 熱塑性聚合物
    • 聚苯硫
    • 聚醯亞胺
    • 聚碳酸酯
    • 聚鄰苯二甲醯胺·其他高溫尼龍
    • 液晶聚合物
    • 磺酸鹽聚合物
    • 合金/混合
    • 含氟聚合物
    • 聚芳基醚酮
    • 環狀烯烴共聚物 (COC)
    • 熱塑性物質市場估計·預測摘要
  • 熱固性樹脂
    • 概要
    • 一般的特徵
    • 環氧樹脂
    • 聚氨酯
    • 酚類
    • 不飽和聚酯
    • 鄰苯二甲酸二烯丙酯
    • BT環氧樹脂·氰基酸酯
    • 熱固性樹脂市場估計·預測摘要

第5章 主要零件·印刷電路板 (PCB) ·密封劑概要

  • 簡介
  • 本調查的關注點
  • 樹脂的消費
    • 背景
    • 市場
    • 成長
    • 促進成長要素
  • 印刷電路板 (PCB)
    • 概要
    • 層壓板的特性要件
    • 物理組成
    • 集合技術
    • PCB基板
    • PCB所使用的特定聚合物
    • PCB所使用的其他材料、其他
  • 密封劑
    • 定義·背景
    • 密封劑的主要目的
    • 環氧樹脂封裝配方
    • 封裝電器及電子零件
    • 環氧樹脂密封劑系統
    • 矽密封劑
    • 熱塑性物質密封劑
    • 主要的密封劑廠商與其產品線
    • 市場估計·預測

第5章 成型電子元件

  • 概要
    • 背景
    • 使用聚合物
    • 市場成長的促進要素
  • 連接器
    • 背景
    • 趨勢
    • 應用
    • 材料的選擇
    • 阻燃性
    • 連接器相關的規格
    • 廠商
    • 終端用途市場
    • 市場估計·預測
  • 交換器
    • 背景
    • 市場估計·預測
  • 線圈架
    • 背景
    • 廠商
    • 市場估計·預測
  • 繼電器
    • 背景
    • 市場估計·預測
  • 電容器(冷凝器)
    • 背景
    • 應用
    • 電容器(冷凝器)材料
    • 消費:市場部門別
    • 市場估計·預測
  • 其他成型電子元件
    • 暫存器
    • 市場估計·預測
  • 市場估計·預測的摘要

第7章 專利檢討/新開發

  • 背景
  • 細微化的重要性
  • 薄壁掛式電子元件
  • 軟性電子產品
  • 穿戴式電子產品
  • IoE (Internet of Everything)
  • 電子元件製造中可能影響樹脂選擇的變化
  • 產業相關的最新專利

第8章 電子元件產業概要·塑膠廠商

  • 主要的半導體廠商·客戶
  • 製造·行銷的方面
  • 塑膠廠商
  • 材料種類別聚合物廠商

第9章 環境問題

  • 概要
  • 印刷電路板 (PCB)的廢棄
  • 無溴的印刷電路板 (PCB)
  • 無鹵素的熱塑性物質阻燃劑
  • 回收
  • 電子工業的介面

第10章 電子元件相關的效能要件

  • 概要
  • 可燃性標準
  • 可燃性檢驗
  • 其他標準

第11章 主要企業簡介

BCC 關於Research

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目錄
Product Code: PLS027E

Report Highlights

The global electronics components market reached nearly 3.9 billion pounds in 2016. This market is estimated to reach nearly 6.1 billion pounds in 2022 from 4.2 billion pounds in 2017 at a compound annual growth rate (CAGR) of 7.7% for 2017-2022.

Report Includes:

  • An overview of the global market for plastics in electronic components
  • Analyses of global market trends, with data from 2016, estimates for 2017, and projections of compound annual growth rates (CAGRs) through 2022
  • Information about pricing of resins, molders of electronic components, testing agencies, and requirements related to electronic components
  • Coverage of single devices, such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
  • Comprehensive company profiles of major players in the industry

Report Scope

This study covers all electronics components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.

The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronics components, and it looks at interpolymer competition.

Analyst Credentials

Andrew McWilliams spent more than 25 years as a consultant with Ernst & Young, McKinsey & Company and A.T. Kearny focused on manufacturing before segueing into research analysis. He has been covering myriad technology categories for BCC Research for more than 15 years. McWilliams has a BA from Princeton University and an MA from Harvard University. He has worked in more than 40 countries and he resides in the greater Boston area.

Table of Contents

Chapter 1: Introduction

  • Study Goals and Objectives
  • Reasons for Doing This Study
  • Scope of Report
  • Information Sources
  • Methodology
  • Geographic Breakdown
  • Analyst's Credentials
  • Related BCC Research Reports

Chapter 2: Summary and Highlights

Chapter 3: Market and Technology Background

  • Overview
  • Snapshot of the Electronics Device Market
  • Computers
    • Overview
    • Desktops
  • Electronics Displays
    • Background
  • Printers
    • Overview
    • Inkjet Printers
    • Monochrome Laser Printers
    • Color Laser Printers
    • Manufacturers
  • “All-in-One” Machines
  • Phones
    • Corded
    • Cordless
  • Fax Machines
  • Scanners
  • Mobile Electronics Devices
    • Phones
    • Laptops/Notebooks/Netbooks
    • Tablets
    • E-Readers
    • Portable Music Players
  • Automotive Market
    • Overview
    • Electric Cars
    • CAFE Issues
    • Overview of Electronics Components in Automotive Products
    • Material Usage
    • Connectors
    • Sensors
    • Flexible Circuitry in Automotive Applications

Chapter 4: Market Breakdown by Technology Type

  • Overview
  • Types of Polymers
  • Thermoplastics
    • Standard Nylons
    • Thermoplastic Polymers
    • Polyphenylene Sulfide
    • Polyimides
    • Polycarbonates
    • Polyphthalamides and Other High-Temperature Nylons
    • Liquid Crystal Polymers
    • Sulfone Polymers
    • Alloys/Blends
    • Fluoropolymers
    • Polyaryletherketones
    • Cyclic Olefin Copolymers
    • Thermoplastic Market Estimates and Forecasts Summary
  • Thermoset Polymers
    • Overview
    • General Properties
    • Epoxy Resins
    • Polyurethanes
    • Phenolics
    • Unsaturated Polyesters
    • Diallyl Phthalate
    • BT-Epoxy Resins and Cyanate Esters
    • Thermoset Market Estimates and Forecasts Summary

Chapter 5: Overview of Key Components, PCBs and Encapsulants

  • Introduction
  • Focus of This Report
  • Resin Consumption
    • Background
    • Markets
    • Growth
    • Market Drivers
  • Printed Circuit Boards
    • Overview
    • Property Requirements for Laminates
    • Physical Composition
    • Assembly Technologies
    • PCB Substrates
    • Specific Polymers Used in Printed Circuit Boards
    • Other Materials Used in Printed Circuit Boards
    • Fiber Reinforcements
    • Production of Circuitry
    • Environmental Issues
    • Flexible Printed Circuit Boards
    • Soldering
    • Production Statistics
    • Industry Trends
    • Electronics Packaging
    • Market Estimates and Forecasts
  • Encapsulants
    • Definitions and Background
    • Primary Purposes of Encapsulation
    • Encapsulant Materials
    • Epoxy Encapsulation Formulations
    • Encapsulated Electrical and Electronics Components
    • Epoxy Encapsulant Systems
    • Silicone Encapsulants
    • Thermoplastic Encapsulants
    • Selected Major Encapsulant Producers and Their Product Lines
    • Market Estimates and Forecasts

Chapter 6: Molded Electronics Products

  • Overview
    • Background
    • Polymers Used
    • Market Drivers
  • Connectors
    • Background
    • Trends
    • Applications for Electronics Connectors
    • Material Selection
    • Flame Retardance
    • Standards Relating to Connectors
    • Manufacturers
    • End-Use Markets
    • Market Estimates and Forecasts
  • Switches
    • Background
    • Market Estimates and Forecasts
  • Coil Formers
    • Background
    • Manufacturers
    • Market Estimates and Forecasts
  • Relays
    • Background
    • Market Estimates and Forecasts
  • Capacitors
    • Background
    • Applications
    • Capacitor Materials
    • Consumption by Market Segment
    • Market Estimates and Forecasts
  • Other Molded Electronics Components
    • Resistors
    • Market Estimates and Forecasts
  • Summary of Market Estimates and Forecasts

Chapter 7: Patent Review/ New Developments

  • Background
  • Importance of Miniaturization
  • Thin-Walling Electronics Components
    • Background
    • Effects of Thin-Walling on Performance Requirements and Design
    • Application Requirements
    • Material and Process Selection
    • Properties Required
    • Challenges in Downsizing
    • Software that Aids Thin-wall Design
  • Flexible Electronics
    • Overview
  • Wearable Electronics
  • Cloud Computing and Big Data
  • The Internet of Everything
  • Changes in Electronics Component Manufacturing that Could Influence Resin Choices
  • Recent Patents Related to the Industry

Chapter 8: Electronics Components Industry Overview and Plastics Producers

  • Top Semiconductor Producers and Customers
  • Manufacturing and Marketing Aspects
    • Globalization
    • What Component Suppliers Are Doing
  • Plastics Producers
    • Overview
  • Polymer Producers According to Material Type
    • Thermosets
    • Thermoplastics

Chapter 9: Environmental Issues

  • Overview
  • Printed Circuit Board Disposal
  • Bromine-Free Printed Circuit Boards
  • Halogen-Free Flame Retardants for Thermoplastics
  • Recycling
  • Electronics Industry Interface
    • Overview
    • Reasons for Increased Environmental Regulations for Electronics Equipment
    • The European Union RoHS Directive
    • The European Union WEEE Directive
    • EPEAT

Chapter 10: Performance Requirements Related to Electronics Components

  • Overview
  • Flammability Standards
    • Definitions
  • Flammability Tests
    • Overview
    • UL 94
    • Glow-Wire Flammability Index - IEC 60695
    • UL 1694
    • UL 746C
  • Other Standards
    • UL 1446
    • UL 1950

Chapter 11: Company Profiles

  • Appendix: Acronyms

About BCC Research

  • About BCC Research
  • BCC Membership
  • BCC Custom Research

List of Tables

  • Summary Table: Global Electronics Components Market, by Type of Polymer, Through 2022 (Million Pounds)
    • Table 1: Examples of Standard Nylons Used to Mold Electronics Components, by Trade Name
    • Table 2: Global Standard Nylon Electronics Components Consumption, by Application, Through 2022 (Million Pounds)
    • Table 3: Examples of Polybutylene Terephthalates Used to Mold Electronics Components, by Trade Name
    • Table 4: Global Polybutylene Terephthalate Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 5: Global PET/PCT Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 6: Examples of Polyphenylene Sulfide and Polyphenylene Sulfide Blends Used to Mold Electronics Components, by Trade Name
    • Table 7: Global Polyphenylene Sulfide Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 8: Global Polyimide* Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 9: Examples of Polycarbonates Used to Mold Electronics Components, by Trade Name
    • Table 10: Global Polycarbonate Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 11: Examples of Polyphthalamide Polymers used to Mold Electronics Components, by Trade Name
    • Table 12: Global Polyphthalamides and High-Temperature Nylon Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 13: Examples of Liquid Crystal Polymers Used to Mold Electronics Components, by Trade Name
    • Table 14: Global Liquid Crystal Polymer Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 15: Global Sulfone Polymer Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 16: Global Polymer Alloy/Blend Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 17: Global Fluoropolymer Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 18: Examples of PAEK Used to Mold Electronics Components, by Trade Name
    • Table 19: Global Polyaryletherketone Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 20: Global Thermoplastic Electronics Components Market, by Type, Through 2022 (Million Pounds)
    • Table 21: Thermoset Properties and Manufacturing Processes
    • Table 22: Examples of Epoxy Resins Used for Electronics Components, by Trade Name
    • Table 23: Global Epoxy Resin Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 24: Examples of Polyurethane Systems Used for Electronics Components, by Trade Name
    • Table 25: Global Polyurethane Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 26: Examples of Phenolics Used for Electronics Components, by Trade Name
    • Table 27: Global Phenolic Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 28: Examples of Unsaturated Polyester and Vinyl Ester and Compounds Used for Electronics Components, by Trade Name
    • Table 29: Global Unsaturated Polyester Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 30: Global Diallyl Phthalate Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 31: Global Thermoset Electronics Components Market, by Type, Through 2022 (Million Pounds)
    • Table 32: Important Technical Factors to Consider When Selecting Printed Circuit Board Substrate Materials
    • Table 33: Comparison between Rigid and Flexible Circuit Boards
    • Table 34: Major Producers of Rigid and Flexible Circuit Boards
    • Table 35: Polymers Suitable for Production of 3D-MIDs Using LDS Technology
    • Table 36: Advantages and Disadvantages of LDS and Two-component Molding for 3D-MIDs
    • Table 37: Global PCB Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 38: Global PCB* Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 39: Global PCB Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 40: Types of Encapsulant Materials -- Advantages and Disadvantages
    • Table 41: Epoxy Encapsulant Formulations
    • Table 42: Global Electronics Encapsulants Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 43: Global Electronics Encapsulants Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 44: Global Electronics Encapsulants Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 45: Major Manufacturers of Electronics Connectors
    • Table 46: Global Electronics Connector Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 47: Global Electronics Connector Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 48: Global Electronics Connector Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 49: Global Electronics Components Switch Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 50: Global Electronics Components Switch Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 51: Global Electronics Components Switch Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 52: Selected Manufacturers Molding Coil Formers for Electronics Applications
    • Table 53: Global Coil-Former Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 54: Global Coil-Former Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 55: Global Coil-Former Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 56: Global Relay Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 57: Global Relay Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 58: Global Relay Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 59: Global Capacitor Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 60: Global Other Electronics Components Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 61: Global Other Electronics Components Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 62: Global Other Electronics Components Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 63: Global Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 64: Global Thermoplastic Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 65: Global Thermoset Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 66: Top Global Semiconductor Producer Companies, 2016 ($ Billions)
    • Table 67: Top Global Semiconductor Customers, 2016 ($ Billions)
    • Table 68: Trade Names of Selected Plastics Used in Electronics Components

List of Figures

  • Summary Figure: Global Electronics Components Market, by Type of Polymer, 2016-2022 (Million Pounds)
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