Abstract
REPORT HIGHLIGHTS
The global market for plastics used in electronic enclosures was 6.9 billion
pounds in 2011. BCC expects this market to reach 7.4 billion pounds by 2012
and to reach 9.9 billion pounds by 2017, increasing at a compound annual
growth rate (CAGR) of 6.1%.
The stationary electronic device segment was 6.7 billion pounds in 2011, which
is expected to reach to 7.2 billion pounds in 2012. The segment is then
forecast to grow to 9.5 billions pound by 2017, increasing at a CAGR of 5.9%
for the five year period.
The mobile electronic device segment was 179.1 million pounds in 2011 and is
expected to reach 201 million pounds in 2012. BCC forecasts this market will
further grow at a CAGR of 12.6% and will reach 363.4 million pounds in 2017.
REPORT SCOPE
INTRODUCTION
STUDY OBJECTIVES
The surge of new electronic products, led by small and mobile computer-based
devices, has resulted in significant changes in resin selection for
enclosures. Downsizing and thin walling have necessitated a reevaluation of
resins because of more demanding physical-property requirements and molding
challenges. In addition, a reevaluation is also necessary for resins used in
the stationary portion of the market, which includes enclosures for desktop
computers and flat-panel displays.
This study analyzes new developments, particularly the complex scenario of
very small enclosures, given that mobile electronic devices have become
increasingly smaller and lighter. There have also been changes in the market
for stationary electronic devices, especially because of the additional
protection required for power supplies within these units.
REASON FOR DOING STUDY
Many past studies on resins used for electronic enclosures cited data that was
outdated and, in our opinion, not valid. FEW of these studies carefully
defined the parameters. It must also be realized that change is the mantra of
the electronic industry. NEW products are constantly being introduced,
creating different issues for enclosures.
In many instances, past studies did not take into account important data
generated from previous reports. Also not take into consideration were
critical factors such as the actual measurement and calculation of surface
areas and weights for both stationary and mobile electronic enclosures.
The results of this study were generated from such measurements and subsequent
calculations. The report also includes careful estimates of units sold, and,
finally, reasonable estimates of future units to be sold.
SCOPE AND FORMAT
Use of electronic enclosures, often called " housings" , is often classified
as stationary or mobile. and often compete with each other. Many mobile
electronic devices have become multifunctional. This study covers both
stationary and mobile electronic devices; some of the latter are also known as
handheld devices.
Some of the significant changes within the industry include the shift of
desktop computers to notebooks, with the shift to smaller versions called "
netbooks" , and the explosion of the cell phone market, which includes
upgrades such as iPhones, smart phones, and the popular BlackBerry. MP3
players, such as i-pods, bring music to the world. Tablets such as the
popular i-Pad, along with electronic books, or " e-books" , have been the most
recently introduced products in this industry.
Another critical factor in this market is the almost complete shift in North
America, Japan, and Western Europe from cathode-ray-tube (CRT) monitors to
flat-panel monitors for computers and TVs. In both cases, bulky monitors have
been replaced, resulting in less volume for enclosures and shifts away from
polystyrene (PS) to mostly polycarbonate/acrylonitrile-butadiene-styrene
(PC/ABS) resins.
This report deals with electronic enclosures and excludes enclosures used for
servers, which utilize modular enclosures. Servers are a nondescript group of
enclosures, mostly made from metals, especially sheet-metal materials, along
with some reinforced plastics, many of which are thermosets. Many of these
enclosures are termed " cabinets" and are made by simply joining smaller
units together.
Another factor impacting this market, and covered in detail in this report,
relates to the use of flame retardants for resins used in electronic
enclosures to conform to new environmental restrictions related to
bromine-based variants. In some instances, choices of enclosure resins have
changed in order to meet these new standards.
Use of metals in stationary and mobile electronic devices has been considered
in this report. However, the use of metals is still very small and difficult
to quantify; as such, it was not included in the basic calculations to
determine enclosure weights.
The market information contained in this report is considered global.
However, a quantitative breakdown of the data by geographic region was not
deemed feasible. We have included the most recent global analysis of
electronic device sales by major geographic region; this could prove to be a
viable attempt to segment this market by major areas.
METHODOLOGY
A comprehensive review was undertaken of trade and technical literature
relating to electronic enclosures in terms of resin usage, specific
applications, and new technologies and developments, etc. Included in this
review were supplier trade literature, texts, and monographs.
In addition to calculating measurements of enclosures, interviews were
conducted with major manufacturers of electronic enclosures and with original
equipment manufacturers (OEMs) in the electronic industry. Their input was
carefully evaluated and meaningful contributions were included in the
analysis. These electronic-enclosure manufacturers included Buckeye
Enclosures, Bud Industries, Cool Polymers, EAI Enclosures, Electronic Product
Design, Fibox Enclosures, Hammond Manufacturing, Hubell/Wiegman, LCR
Electronics, Met Case/OKW Enclosures, Plastronic Enclosures, Polycase, Polymer
Products, Rose+Bopla, Teko USA Enclosures, Unibox Enclosures, and Vynckier
Enclosures.
ABOUT THE AUTHOR
Research analyst Mel Schlechter has more than 40 years in the chemical
industry, and specializes in plastics market research. He has been with BCC
Research for more than 10 years and holds a B.S. in chemistry, an M.S. in
organic chemistry, and an M.B.A. in marketing.
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DISCLAIMER
The information developed in this report is intended to be as reliable as
possible at the time of publication and to be of a professional nature. This
information does not constitute managerial, legal, or accounting advice; nor
should it serve as a corporate policy guide, laboratory manual, or an
endorsement of any product, as much of the information is speculative in
nature. The author assumes no responsibility for any loss or damage that
might result from reliance on the reported information or from its use.
Table of Contents
Chapter- 1: INTRODUCTION - Complimentary
- STUDY OBJECTIVES
- REASON FOR DOING STUDY
- SCOPE AND FORMAT
- METHODOLOGY
- ABOUT THE AUTHOR
- RELATED BCC REPORTS
- BCC ONLINE SERVICES
- DISCLAIMER
Chapter- 2: SUMMARY
- Table 0 : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE ENCLOSURES BY
TYPE OF ELECTRONIC ENCLOSURE, THROUGH 2017
- Figure 0 : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE ENCLOSURES
BY TYPE OF ELECTRONIC ENCLOSURE, 2011-2017
Chapter- 3: OVERVIEW OF ELECTRONIC ENCLOSURES
- DEFINITIONS
- PLANNING
- FUNCTIONS
- BACKGROUND
- THE EMI ISSUE
- HEAT-MANAGEMENT
- DOWNSIZING
- STILL A COMPETITIVE SCENARIO
- EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN
- MATERIAL AND PROCESS SELECTION
- SIGNIFICANCE OF THIN-WALLING ON RESIN SELECTION
- ISSUE OF FLAME-RETARDANCY
- COSTS
- ORGANIZATIONS PUBLISHING STANDARDS FOR ELECTRONIC ENCLOSURES
- NEW DEVELOPMENTS
- MATERIAL OPTIONS FOR ELECTRONIC ENCLOSURES
Chapter- 4: RESIN CHOICES FOR ELECTRONIC ENCLOSURES
- BACKGROUND
- COSTS
- COST-PERFORMANCE
- TYPES OF PLASTIC ENCLOSURE MATERIALS
Chapter- 5: RESINS
- OVERVIEW
- PC/ABS
- ABS
- PS
- PCS
- PPO/HIPS
- PVC
- BIODEGRADABLE POLYMERS
- THERMOSET RESINS
- CONDUCTIVE PLASTICS
- ESD
Chapter- 6: GENERAL TECHNOLOGY OF ELECTRONIC ENCLOSURE RESINS
- COMPARISON OF KEY PROPERTIES
- PROCESSING
- THERMAL CONSIDERATIONS
- PHYSICAL PARAMETERS
- PROPERTY SUMMARY
Chapter- 7: PROCESS TECHNOLOGY FOR ELECTRONIC ENCLOSURES
- BACKGROUND
- INJECTION-MOLDING
- STRUCTURAL FOAM MOLDING
- THERMOFORMING
- DIFFERENCES IN MOLDING ENCLOSURES FOR MOBILE VS. STATIONARY DEVICES
Chapter- 8: TESTING AGENCIES AND REQUIREMENTS RELATED TO ELECTRONIC ENCLOSURES
- OVERVIEW
- FIRE-PROTECTION STANDARDS FOR ELECTRONIC ENCLOSURES
- UL
- NEMA
- OTHER STANDARDS FOR ELECTRONIC ENCLOSURES
Chapter- 9: FLAME RETARDANCY
- BACKGROUND
- OVERVIEW
- THE BROMINE ISSUE
Chapter- 10: EMI ASPECTS
- BACKGROUND
- OVERVIEW OF EMI-SHIELDING
- MECHANISMS OF SHIELDING
- ELECTROMAGNETIC CONTROL (EMC)
- THE IMPORTANCE OF SHIELDING
- CONTROLLING EMI
- SHIELDING-EFFECTIVENESS
- COST AND PERFORMANCE OF SHIELDING OPTIONS
- USE OF THERMOPLASTICS
- EMI-SHIELDING COMPOUNDS VERSUS COATINGS
- ELECTRONIC INDUSTRY/EMI-SHIELDING INTERFACE
Chapter- 11: THIN WALLING
- INTRODUCTION
- THIN WALLING IS NOT A NOVEL CONCEPT
- UNIQUE CHARACTERISTICS RELATED TO THIN WALLING ELECTRONIC ENCLOSURES
- EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN
- MOBILE VS.. STATIONARY ENCLOSURES
- APPLICATION REQUIREMENTS
- MATERIAL AND PROCESS SELECTION
Chapter- 12: PRICING
- Table 33 : LIST PRICES FOR ENCLOSURE RESINS
Chapter- 13: RESIN MARKET ESTIMATES AND FORECASTS FOR ELECTRONIC ENCLOSURES
- INTRODUCTION
- RESIN CONSUMPTION IN ELECTRONIC ENCLOSURES
- OTHER OBSERVATIONS RELATED TO RESIN USAGE IN ELECTRONIC ENCLOSURES
Chapter- 14: APPLICATIONS
- DEFINITIONS
- FACTORS AFFECTING ELECTRONIC ENCLOSURES
- EXAMPLES OF STATIONARY ELECTRONIC DEVICES
- EXAMPLES OF MOBILE ELECTRONIC DEVICES
- SPECIFICS IN CHOOSING AN ENCLOSURE FOR A HANDHELD DEVICE
Chapter- 15: RESIN ENCLOSURE MARKET ESTIMATES AND FORECASTS BY APPLICATION
- BACKGROUND
- ESTIMATED GLOBAL SALES OF KEY ELECTRONIC DEVICES
- DETERMINING AVERAGE SIZES OF RESIN-BASED ENCLOSURES FOR THE MAJOR TYPES OF
ELECTRONIC DEVICES
- MARKETS FOR MOBILE AND STATIONARY ELECTRONIC DEVICE ENCLOSURES BY TYPE OF
RESIN
- ENCLOSURE RESINS FOR MOBILE ELECTRONIC DEVICES
- RESINS FOR STATIONARY ELECTRONIC DEVICE ENCLOSURES
- Table 71 : GLOBAL CONSUMPTION OF RESINS IN STATIONARY ELECTRONIC
ENCLOSURES, THROUGH 2017
- Table 72 : GLOBAL CONSUMPTION OF RESINS IN ELECTRONIC-DISPLAY ENCLOSURES,
THROUGH 2017
- Table 73 : GLOBAL CONSUMPTION OF RESINS IN DESKTOP-COMPUTER ENCLOSURES,
THROUGH 2017
- Table 74 : GLOBAL CONSUMPTION OF RESINS IN PRINTER ENCLOSURES, THROUGH 2017
- Table 75 : GLOBAL CONSUMPTION OF RESINS IN FAX-MACHINE ENCLOSURES, THROUGH
2017
- Table 76 : CONSUMPTION OF RESINS IN SCANNER ENCLOSURES, THROUGH 2017
- Table 77 : GLOBAL CONSUMPTION OF RESINS FOR ALL-IN-ONE ENCLOSURES, THROUGH
2017
- Table 78 : GLOBAL CONSUMPTION OF RESINS IN KEYBOARD ENCLOSURES, THROUGH
2017
- Table 79 : GLOBAL CONSUMPTION OF RESINS IN PHONE ENCLOSURES, THROUGH 2017
- Table 80 : GLOBAL CONSUMPTION OF RESINS IN OTHER STATIONERY ENCLOSURES,
THROUGH 2017
Chapter- 16: THE ENVIRONMENTAL SCENARIO
- OVERVIEW
- RECYCLING
- ELECTRONIC-INDUSTRY INTERFACE
- STYRENE-EMISSION PROBLEM
Chapter- 17: SELECTED KEY GLOBAL PRODUCERS OF ELECTRONIC ENCLOSURE RESINS
- Table 82 : KEY GLOBAL PRODUCERS OF ELECTRONIC ENCLOSURE RESINS
Chapter- 18: SELECTED COMMENTS FROM ELECTRONIC ENCLOSURE COMPANIES SELECTED
Chapter- 19: PROFILES OF SELECTED ELECTRONIC ENCLOSURE MANUFACTURERS
- ALLIED MOULDED PRODUCTS
- BAFBOX, LTD
- BISON PROFAB
- BOSS ENCLOSURES
- BOX ENCLOSURES
- BUCKEYE SHAPEFORM
- BUD INDUSTRIES
- COMFORT SAFETY PRODUCTS
- COOL POLYMERS, INC.
- DUSTSHIELD ENCLOSURES
- EAI ENCLOSURES
- FIBOX ENCLOSURES
- FREETECH PLASTICS
- HAMMOND MANUFACTURING
- HUBBELL/WIEGMANN
- INCLOSIA SOLUTIONS
- INTEGRA ENCLOSURES, INC.
- LCD ENCLOSURES
- LCR ENCLOSURES, INC.
- OKW ENCLOSURES
- ITS ENCLOSURES
- PEERLESS INDUSTRIES
- POLYCASE, INC.
- QUBE, INC.
- ROSE+BOPLA ENCLOSURES
- SELECTRONIX, LTD.
- SERPAC ELECTRONIC ENCLOSURES
- SIGNATURE ENCLOSURES
- SOLUTIONS DIRECT
- TAKACHI ELECTRONIC ENCLOSURE COMPANY
- TRITON SYSTEMS, INC.
- UNIBOX ENCLOSURES
- VYNCKIER ENCLOSURE SYSTEMS
Chapter- 20: SELECTED ACRONYMS
List of Tables
- Summary Table : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE
ENCLOSURES BY TYPE OF ELECTRONIC ENCLOSURE, THROUGH 2017
- Table 1 : COMPARISON OF KEY PERFORMANCE CRITERIA FOR ELECTRONIC
ENCLOSURES: METALS VS. PLASTICS
- Table 2 : DESIGN PARAMETERS
- Table 3 : COMPARISONS OF RESINS FOR ELECTRONIC ENCLOSURE APPLICATIONS
BASED ON COST-PERFORMANCE
- Table 4 : THE BEST- AND WORST-PERFORMING RESINS AND RESIN BLENDS FOR
ELECTRONIC ENCLOSURES
- Table 5 : FABRICATION METHODS AND USES FOR PS
- Table 6 : ADVANTAGES AND DISADVANTAGES OF PVC IN ELECTRONIC ENCLOSURES
- Table 7 : RIGID PVC APPLICATIONS
- Table 8 : GLOBAL PVC PRODUCERS
- Table 9 : FIBER-REINFORCED THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
- Table 10 : TYPICAL SMC FORMULATION
- Table 11 : SELECTED KEY SMC PRODUCERS
- Table 12 : DIELECTRIC CONSTANTS FOR SELECTED MATERIALS
- Table 13 : HOW TO MAKE PLASTICS CONDUCTIVE
- Table 14 : SELECTED KEY COMPANIES PRODUCING CONDUCTIVE PLASTICS
- Table 15 : SELECTED KEY ESD PLASTIC PRODUCTS
- Table 16 : RESIN COMPARISON: MELT-FLOW RATES
- Table 17 : RESIN COMPARISON: MOLD SHRINKAGE
- Table 18 : RESIN COMPARISON: TENSILE STRENGTH
- Table 19 : RESIN COMPARISON: FLEXURAL STRENGTH
- Table 20 : RESIN COMPARISON: FLEXURAL MODULUS
- Table 21 : RESIN COMPARISON: NOTCHED IZOD IMPACT (FOOT-POUND/INCH,
1/8-INCH SPECIMEN)
- Table 22 : RESIN COMPARISON: CLTE
- Table 23 : RESIN COMPARISON: HDT
- Table 24 : RESIN COMPARISON: WATER ABSORPTION
- Table 25 : RESIN COMPARISON: DIELECTRIC STRENGTH
- Table 26 : CRITERIA FOR UL 94 V CLASSIFICATIONS
- Table 27 : BURN SPECIFICATIONS FOR UL 94 MATERIAL RATINGS
- Table 28 : SELECTED KEY NEMA, UL, AND CSA STANDARDS
- Table 29 : TYPICAL FLAME RETARDANCY LEVELS FOR POLYSTYRENE
- Table 30 : PHOSPHATE FLAME-RETARDANTS USED IN ELECTRONIC ENCLOSURE
APPLICATIONS
- Table 31 : CURRENT SCENARIO FOR POLYNUCLEAR, BROMINATED FLAME-RETARDANTS
IN REGARD TO ELECTRONIC ENCLOSURES
- Table 32 : GENERAL RATINGS OF SHIELDING-EFFECTIVENESS
- Table 33 : LIST PRICES FOR ENCLOSURE RESINS
- Table 34 : GLOBAL ELECTRONIC ENCLOSURE MARKET BY KEY RESINS, THROUGH 2017
- Table 35 : GLOBAL SALES OF ELECTRONIC DEVICES BY MAJOR GEOGRAPHICAL AREA,
2012 AND 2017
- Table 36 : GLOBAL MARKET FOR PC/ABS ENCLOSURES, THROUGH 2017
- Table 37 : GLOBAL MARKET FOR PC/ABS FOR STATIONARY DEVICES, THROUGH 2017
- Table 38 : GLOBAL MARKET FOR PC/ABS ENCLOSURES FOR MOBILE DEVICES THROUGH
2017
- Table 39 : GLOBAL MARKET FOR ABS ENCLOSURES, THROUGH 2017
- Table 40 : GLOBAL MARKET FOR ABS ENCLOSURES FOR STATIONARY DEVICES,
THROUGH 2017
- Table 41 : GLOBAL MARKET FOR ABS ENCLOSURES FOR MOBILE DEVICES, THROUGH
2017
- Table 42 : GLOBAL ENCLOSURE MARKET FOR HIPS BY APPLICATION, THROUGH 2017
- Table 43 : GLOBAL MARKET FOR PC ENCLOSURES, THROUGH 2017
- Table 44 : GLOBAL MARKET FOR PC ENCLOSURES FOR STATIONARY DEVICES, THROUGH
2017
- Table 45 : GLOBAL MARKET FOR PC ENCLOSURES FOR MOBILE DEVICES, THROUGH 2017
- Table 46 : GLOBAL MARKET FOR PPO/HIPS ENCLOSURES IN STATIONARY, DEVICES
THROUGH 2017
- Table 47 : GLOBAL MARKET FOR OTHER RESINS IN ENCLOSURES, THROUGH 2017
- Table 48 : GLOBAL MARKET FOR OTHER RESINS IN ENCLOSURES FOR MOBILE
DEVICES, THROUGH 2017
- Table 49 : GLOBAL MARKET FOR OTHER RESINS FOR ENCLOSURES IN STATIONARY
DEVICES, THROUGH 2017
- Table 50 : ELECTRONIC DISPLAY COMPARISONS
- Table 51 : TOTAL GLOBAL DISPLAY AREA BY FLAT-PANEL TECHNOLOGY
- Table 52 : TYPICAL REQUIREMENTS FOR NOTEBOOK/NETBOOK PLASTIC ENCLOSURES
- Table 53 : GLOBAL SALES AND FORECAST FOR ELECTRONIC DEVICES, THROUGH 2017
- Table 54 : GLOBAL SALES AND FORECAST FOR MOBILE ELECTRONIC DEVICES,
THROUGH 2017
- Table 55 : GLOBAL sales and forecast for STATIONARY ELECTRONIC, DEVICEs
through 2017
- Table 56 : ESTIMATES OF DIMENSIONS OF ELECTRONIC ENCLOSURES FOR MOBILE
DEVICES
- Table 57 : ESTIMATES OF DIMENSIONS OF ELECTRONIC ENCLOSURES FOR STATIONARY
DEVICES
- Table 58 : AVERAGE WEIGHTS OF MOBILE-DEVICE ENCLOSURES
- Table 59 : AVERAGE WEIGHTS OF STATIONARY DEVICE ENCLOSURES
- Table 60 : ENCLOSURE WEIGHTS FOR MOBILE ELECTRONIC DEVICES, THROUGH 2017
- Table 61 : ENCLOSURE WEIGHTS FOR STATIONARY ELECTRONIC DEVICES, THROUGH
2017
- Table 62 : GLOBAL CONSUMPTION OF RESINS IN MOBILE ELECTRONIC DEVICE
ENCLOSURES, THROUGH 2017
- Table 63 : GLOBAL CONSUMPTION OF RESINS IN CELLULAR PHONES, THROUGH 2017
- Table 64 : GLOBAL CONSUMPTION OF RESINS IN SMART PHONES, THROUGH 2017
- Table 65 : GLOBAL CONSUMPTION OF RESINS IN NOTEBOOKS/NETBOOKS, THROUGH 2017
- Table 66 : GLOBAL CONSUMPTION OF RESINS FOR TABLETS/I-PADS, THROUGH 2017
- Table 67 : GLOBAL CONSUMPTION OF RESINS IN COMBINATION DEVICES, THROUGH
2017
- Table 68 : GLOBAL CONSUMPTION OF RESINS FOR E-READERS, THROUGH 2017
- Table 69 : GLOBAL CONSUMPTION OF RESINS FOR I-PODS/MP3 PLAYERS, THROUGH
2017
- Table 70 : GLOBAL CONSUMPTION OF RESINS IN OTHER MOBILE DEVICES, THROUGH
2017
- Table 71 : GLOBAL CONSUMPTION OF RESINS IN STATIONARY ELECTRONIC
ENCLOSURES, THROUGH 2017
- Table 72 : GLOBAL CONSUMPTION OF RESINS IN ELECTRONIC-DISPLAY ENCLOSURES,
THROUGH 2017
- Table 73 : GLOBAL CONSUMPTION OF RESINS IN DESKTOP-COMPUTER ENCLOSURES,
THROUGH 2017
- Table 74 : GLOBAL CONSUMPTION OF RESINS IN PRINTER ENCLOSURES, THROUGH 2017
- Table 75 : GLOBAL CONSUMPTION OF RESINS IN FAX-MACHINE ENCLOSURES, THROUGH
2017
- Table 76 : CONSUMPTION OF RESINS IN SCANNER ENCLOSURES, THROUGH 2017
- Table 77 : GLOBAL CONSUMPTION OF RESINS FOR ALL-IN-ONE ENCLOSURES, THROUGH
2017
- Table 78 : GLOBAL CONSUMPTION OF RESINS IN KEYBOARD ENCLOSURES, THROUGH
2017
- Table 79 : GLOBAL CONSUMPTION OF RESINS IN PHONE ENCLOSURES, THROUGH 2017
- Table 80 : GLOBAL CONSUMPTION OF RESINS IN OTHER STATIONERY ENCLOSURES,
THROUGH 2017
- Table 81 : APPLYING PLASTICS SCORECARD TO ELECTRONIC ENCLOSURES
- Table 82 : KEY GLOBAL PRODUCERS OF ELECTRONIC ENCLOSURE RESINS
List of Figures
- Summary Figure : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE
ENCLOSURES BY TYPE OF ELECTRONIC ENCLOSURE, 2011-2017
