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市場調查報告書 - 204392

導熱界面材料(TIM):技術、應用、全球市場

Thermal Interface Materials: Technologies, Applications and Global Markets

出版商 BCC Research
出版日期 內容資訊 英文 140 Pages
價格
導熱界面材料(TIM):技術、應用、全球市場 Thermal Interface Materials: Technologies, Applications and Global Markets
出版日期: 2013年04月11日 內容資訊: 英文 140 Pages
簡介

近年來,電子設備和系統,無論是技術上還是需求面都有長足的發展。技術上的進步之一─單一設備的功能提升及小型化,在這個進化下,包含熱傳導性材料(TIM),溫度控管技術的重要性正在提升。

本報告為,調查分析導熱界面材料市場,並匯整導熱界面材料之概要及種類、最終用途、熱管理之重要性、各種區隔別市場及應用領域、供應商趨勢、市場參與企業簡介等,以下列摘要形式闡述。

第1章 簡介

第2章 實施概要

第3章 概要

  • 熱管理之概要
  • 導熱界面材料之種類
  • 最終用途
  • 地區別市場
  • 市場規模及區隔

第4章 溫度控管的重要性

  • 溫度控管上的環保、法令因素
  • 全球與各地區溫度控管市場趨勢

第5章 熱傳導性材料

  • 聚合物複合材料
  • 相變材料
  • 金屬
  • 碳基複合材料
  • 點膠材料

第6章 熱潤滑脂(黃油)

  • 摘要
  • 技術
  • 應用和最終用途
  • 供應商
  • 市場

第7章 熱化合物

  • 摘要
  • 技術
  • 應用和最終用途
  • 供應商
  • 市場

第8章 散熱墊

  • 摘要
  • 技術
  • 應用和最終用途
  • 供應商
  • 市場

第9章 熱黏合膠帶

  • 摘要
  • 技術
  • 應用和最終用途
  • 供應商
  • 市場

第10章 環氧熱傳導性材料

  • 摘要
  • 技術
  • 應用和最終用途
  • 供應商
  • 市場

第11章 相變材料

  • 摘要
  • 技術
  • 應用和最終用途
  • 供應商
  • 市場

第12章 金屬製熱傳導性材料

  • 摘要
  • 技術
  • 應用和最終用途
  • 供應商
  • 市場

第13章 產業結構

  • 市場佔有率

第14章 企業簡介

第15章 專利分析

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄

Abstract

REPORT HIGHLIGHTS

This report provides:

  • An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies
  • Analyses of global market trends, with data from 2011 and 2012, and projections of compound annual growth rates (CAGRs) through 2017
  • Identification of thermal interface materials (TIM) technologies and products with the greatest commercial potential in the near to mid-term, and of companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages
  • Discussion of TIM products, such as thermal greases, thermal compounds, thermal pads, adhesive films and tapes, epoxies, and phase-change materials
  • Applications and end users
  • Industry structure and competition
  • Patent analysis
  • Comprehensive company profiles of developers and suppliers.

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REPORT SCOPE

INTRODUCTION

STUDY BACKGROUND

In recent years, tremendous progress, both technologically and in terms of demand, has been made in electronic devices and systems. The technological progress has come on two main fronts: increased functionality on a single-device unit and miniaturization of each unit. Both of these developments have increased the need for thermal management technologies, including thermal interface materials (TIM).

In the thermal management of microelectronics, the interface material layer between a chip and heat spreader presents the single largest barrier to heat flow in the packaging of high-power dissipation devices. The selection of a suitable material to fill the interface between a chip and a heat spreader is critical to the performance and reliability of the semiconductor device. For this reason, continuous effort has been made to develop new thermal interface technologies.

BCC Research has published a report on the market for all types of thermal management technologies (SMC024G The Market for Thermal Management Technologies, now in its seventh edition). BCC Research, however, believes that the importance of TIM materials and the high rate of innovation merit more detailed analysis in a report of their own.

STUDY GOALS AND OBJECTIVES

The goal of this report is to provide an up-to-date analysis of recent developments and current trends in the global TIM materials market. Specific objectives include:

  • Identifying TIM technologies and products with the greatest commercial potential in the near to mid-term (2010-2016).
  • Analyzing the key drivers and constraints that will shape the market for TIM technologies over the next five years.
  • Estimating the current and future demand for TIM technologies and products.
  • Ascertaining which companies are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages.

INTENDED AUDIENCE

This report is intended especially for suppliers of TIM and others with a need to understand the status and dynamics of the market for these products. The report is organized around specific technologies, but it is largely nontechnical in nature and coverage, meaning it is concerned less with theory and jargon than with identifying technologies that work, projecting the amount of the latter the market is likely to purchase and estimating the price that is likely to be paid.

As such, the report's main audience is executive management, business development, marketing departments and financial analysts. It is not written specifically for scientists and technologists, although its findings measure and analyze the market for their work, including the availability of government and corporate research funding for different technologies and applications.

SCOPE AND FORMAT

The report addresses the global market for thermal interface materials products during the period from 2011 through 2017, including:

  • Thermal greases.
  • Thermal compounds.
  • Thermal pads.
  • Adhesive films and tapes.
  • Epoxies.
  • Phase-change materials.
  • Metal-based TIM.

The report format includes these major elements:

  • Executive summary.
  • TIM overview.
  • TIM technologies and products.
  • Applications and end users.
  • Developers and suppliers.
  • Market estimates and projections.
  • Industry structure and competition.
  • Patent analysis.

The geographic scope for this report is the global market.

INFORMATION SOURCES AND METHODOLOGY

The findings and conclusions of this report are based on information gathered using both primary and secondary research methodologies from various sources. The primary sources of information were Internet searches and industry association data, along with interviews conducted with thermal interface material suppliers, custom engineering companies and manufacturers of representative applications. Secondary sources included industry journals and publications, product literature, white papers and technical journals, and financial reports for industry suppliers.

The base year for analysis and projection is 2011. At the time this report was prepared (February 2013), 2012 data were not yet available for all sectors. Therefore, with 2011 as a baseline, market projections were developed for the period from 2012 to 2017. These projections are based on a combination of a consensus among the primary contacts combined with BCC's understanding of the key market drivers and their impact from a historical and analytical perspective. The analytical methodologies used to generate the market estimates are described in detail in the market analysis.

All dollar projections presented in this report are in 2011 constant dollars.

ANALYST CREDENTIALS

Mr. McWilliams, the author responsible for this update, is a partner at 43rd Parallel LLC, a Boston-based international technology and marketing consulting firm. Mr. McWilliams is the author of several other Business Communications Co. reports related to thermal management, semiconductors and electronic products, including SMC024G The Market for Thermal Management Technologies; IFT061A Enabling Technologies for High-Performance Computing; SMC065A Analog and Mixed Signal Devices; IFT054A Data Storage Media: Materials, Technologies, Markets; IFT049A Digital Image Sensing, Storage and Transfer; SMC048A Semiconductor Microlithography: Materials and Markets; SMC064B Semiconductor/ Microelectronics Cleaning; IFT066A Printed Electronics: The Global Market; IFT009E Global Markets for Conformal Coatings in Electronics; SMC043C Electronic Chemicals and Materials-The Global Market; and AVM078A Global Markets for New Electronic Materials and Device Technologies.

Table of Contents

Chapter- 1: INTRODUCTION - Complimentary

  • STUDY BACKGROUND
  • STUDY GOALS AND OBJECTIVES
  • INTENDED AUDIENCE
  • SCOPE AND FORMAT
  • INFORMATION SOURCES AND METHODOLOGY
  • ANALYST CREDENTIALS
  • RELATED BCC RESEARCH REPORTS
  • BCC ON-LINE SERVICES
  • DISCLAIMER

Chapter- 2: EXECUTIVE SUMMARY

  • Table Summary : GLOBAL CONSUMPTION OF THERMAL INTERFACE MATERIALS 2011-2017
  • Figure Summary : GLOBAL THERMAL INTERFACE MATERIAL MARKET BY TYPE, 2011-2017

Chapter- 3: OVERVIEW

  • GENERAL DESCRIPTION OF THERMAL INTERFACE MATERIALS
  • THERMAL INTERFACE MATERIAL TYPES
  • END USES
  • GEOGRAPHIC MARKETS
  • MARKET SIZE AND SEGMENTATION

Chapter- 4: IMPORTANCE OF THERMAL MANAGEMENT IMPORTANCE

  • ENVIRONMENTAL AND REGULATORY FACTORS IN THERMAL MANAGEMENT
  • GLOBAL AND REGIONAL THERMAL MANAGEMENT MARKET TRENDS
  • Figure 18 : CAUSES OF ELECTRONIC FAILURE

Chapter- 5: THERMAL INTERFACE MATERIALS

  • POLYMER COMPOSITES
  • PHASE-CHANGE MATERIALS
  • METALS
  • CARBON-MATRIX COMPOSITES
  • DISPENSING

Chapter- 6: THERMAL GREASES

  • SUMMARY
  • TECHNOLOGIES
  • APPLICATIONS AND END USES
  • SUPPLIERS
  • MARKETS

Chapter- 7: THERMAL COMPOUNDS

  • SUMMARY
  • TECHNOLOGIES
  • APPLICATIONS AND END USES
  • SUPPLIERS
  • MARKETS

Chapter- 8: THERMAL PADS

  • SUMMARY
  • TECHNOLOGIES
  • APPLICATIONS AND END USERS
  • SUPPLIERS
  • MARKETS

Chapter- 9: THERMAL ADHESIVE TAPES

  • SUMMARY
  • TECHNOLOGIES
  • APPLICATIONS AND END USES
  • SUPPLIERS
  • MARKETS

Chapter- 10: EPOXY THERMAL INTERFACE MATERIALS

  • SUMMARY
  • TECHNOLOGIES
  • APPLICATIONS
  • SUPPLIERS
  • MARKETS

Chapter- 11: PHASE-CHANGE MATERIALS

  • SUMMARY
  • TECHNOLOGIES
  • APPLICATIONS AND END USES
  • SUPPLIERS
  • MARKETS

Chapter- 12: METALLIC THERMAL INTERFACE MATERIALS

  • SUMMARY
  • TECHNOLOGIES
  • APPLICATIONS AND END USES
  • SUPPLIERS
  • MARKET

Chapter- 13: INDUSTRY STRUCTURE

  • MARKET SHARES

Chapter- 14: COMPANY PROFILES

  • 3M CO.
  • AAVID THERMALLOY LLC
  • AEGIS TECHNOLOGY
  • AI TECHNOLOGY
  • AKASA CORP.
  • AMETEK SPECIALTY METAL PRODUCTS INC.
  • AOS THERMAL COMPOUNDS
  • ARCTIC SILVER INC.
  • BERGQUIST CO.
  • CAST-COAT INC.
  • CHOMERICS
  • COOKSON ELECTRONICS ASSEMBLY MATERIALS
  • COOL POLYMERS INC.
  • COOLABORATORY
  • COOLER MASTER CO. LTD.
  • DOW CORNING
  • ENERDYNE SOLUTIONS
  • EPIC RESINS
  • EPOXIES ETC.
  • HENKEL CORP.
  • HONEYWELL INTERNATIONAL
  • INDIUM CORP.
  • INNOVATION COOLING LLC
  • LAIRD TECHNOLOGIES
  • LORD CORP.
  • MASTER BOND
  • MATERION
  • MC-21 INC.
  • METAL MATRIX CAST COMPOSITES
  • MG CHEMICALS
  • MOMENTIVE
  • NUSIL TECHNOLOGY LLC
  • PARKER HANNIFIN
  • POLYCAST INDUSTRIES INC.
  • ROGERS CORP.
  • RUBBERCRAFT
  • SEAL KING INDUSTRIAL CO. LTD.
  • SHELDAHL
  • SHENZHEN WESTERN HEMISPHERE TECHNOLOGY CO.
  • SHIN-ETSU CMEMICAL CO. LTD.
  • STOCKWELL ELASTOMERICS, INC.
  • T-GLOBAL TECHNOLOGY CO. LTD.
  • THERMAL TRANSFER COMPOSITES
  • TIMTRONICS
  • UNIVERSAL SCIENCE
  • VANGUARD PRODUCTS CORP.
  • WAKEFIELD SOLUTIONS INC.
  • ZALMAN TECH CO.

Chapter- 15: PATENT ANALYSIS

  • THERMAL INTERFACE MATERIAL TYPES
  • MATERIAL VERSUS APPLICATION-RELATED PATENTS
  • PATENT TRENDS OVER TIME
  • PATENT HOLDER NATIONALITIES

List of Tables

  • Summary Table : GLOBAL CONSUMPTION OF THERMAL INTERFACE MATERIALS 2011-2017
  • Table 1 : THERMAL INTERFACE MATERIAL PROPERTIES
  • Table 2 : THERMAL INTERFACE MATERIAL TYPES
  • Table 3 : GLOBAL THERMAL MANAGEMENT MARKET BY END USE, THROUGH 2017
  • Table 4 : GLOBAL THERMAL MANAGEMENT MARKET BY REGION, THROUGH 2017
  • Table 5 : GLOBAL THERMAL INTERFACE PRODUCT MARKET BY MATERIAL TYPE, THROUGH 2017
  • Table 6 : GLOBAL THERMAL INTERFACE PRODUCT MARKET BY END USE, THROUGH 2017
  • Table 7 : MAJOR THERMAL INTERFACE PRODUCT MARKET BY REGION, THROUGH 2017
  • Table 8 : GLOBAL THERMAL MANAGEMENT MARKET, THROUGH 2017
  • Table 9 : GLOBAL THERMAL MANAGEMENT MARKET BY PRODUCT TYPE, THROUGH 2017
  • Table 10 : THERMAL INTERFACE FILLER MATERIAL PROPERTIES
  • Table 11 : SOLID AND LIQUID PHASE-CHANGE MATERIAL PROPERTIES
  • Table 12 : THERMAL SOLDERS
  • Table 13 : CERAMIC FILLERS USED IN THERMAL GREASES
  • Table 14 : METAL FILLERS USED IN THERMAL GREASES
  • Table 15 : THERMAL GREASE SUPPLIERS
  • Table 16 : GLOBAL THERMAL GREASE MARKET, THROUGH 2017
  • Table 17 : GLOBAL THERMAL GREASE MARKET BY FILLER MATERIAL TYPE, THROUGH 2017
  • Table 18 : GLOBAL THERMAL GREASE MARKET BY REGION, THROUGH 2017
  • Table 19 : GLOBAL THERMAL GREASE MARKET BY REGION, THROUGH 2017
  • Table 20 : THERMAL ELASTOMER SUPPLIERS
  • Table 21 : GLOBAL THERMAL COMPOUND MARKET, THROUGH 2017
  • Table 22 : GLOBAL THERMAL COMPOUND MARKET BY END USE, THROUGH 2017
  • Table 23 : GLOBAL THERMAL COMPOUND MARKET BY REGION, THROUGH 2017
  • Table 24 : THERMAL PAD SUPPLIERS
  • Table 25 : GLOBAL THERMAL PAD MARKET BY END USE, THROUGH 2017
  • Table 26 : GLOBAL THERMAL PAD MARKET BY REGION, THROUGH 2017
  • Table 27 : THERMAL ADHESIVE FILM AND TAPE SUPPLIERS
  • Table 28 : GLOBAL THERMAL ADHESIVE FILM AND TAPE MARKET BY END USE, 2011-2017
  • Table 29 : GLOBAL THERMAL ADHESIVE FILM AND TAPE MARKET BY REGION, THROUGH 2017
  • Table 30 : THERMAL EPOXY SUPPLIERS
  • Table 31 : GLOBAL THERMAL EPOXY MARKET BY END USE, THROUGH 2017
  • Table 32 : GLOBAL THERMAL EPOXY MARKET BY REGION, THROUGH 2017
  • Table 33 : PHASE-CHANGE MATERIAL SUPPLIERS
  • Table 34 : GLOBAL PHASE-CHANGE THERMAL INTERFACE MATERIAL MARKET BY END USE, THROUGH 2017
  • Table 35 : GLOBAL PHASE-CHANGE THERMAL INTERFACE MATERIAL MARKET BY REGION, THROUGH 2017
  • Table 36 : METAL INTERFACE MATERIAL SUPPLIERS
  • Table 37 : GLOBAL METAL THERMAL INTERFACE MATERIAL MARKET BY TYPE, THROUGH 2017
  • Table 38 : GLOBAL METAL THERMAL INTERFACE MATERIAL MARKET BY END USE, THROUGH 2017
  • Table 39 : GLOBAL METAL THERMAL INTERFACE MATERIAL MARKET BY REGION, THROUGH 2017
  • Table 40 : GLOBAL THERMAL MANAGEMENT INTERFACE MARKET LEADERS, 2011

List of Figures

  • Summary Figure : GLOBAL THERMAL INTERFACE MATERIAL MARKET BY TYPE, 2011-2017
  • Figure 1 : GLOBAL PERSONAL COMPUTER SHIPMENTS BY TYPE, 2011-2017
  • Figure 2 : COMPUTER-RELATED MARKET FOR ALL THERMAL MANAGEMENT TECHNOLOGIES, 2011-2017
  • Figure 3 : GLOBAL MOBILE PHONE HANDSET SHIPMENTS, 2011-2017
  • Figure 4 : GLOBAL MOBILE TELECOMMUNICATIONS INFRASTRUCTURE MARKET, 2011-2017
  • Figure 5 : TELECOMMUNICATIONS-RELATED MARKET FOR ALL THERMAL MANAGEMENT TECHNOLOGIES, 2011-2017
  • Figure 6 : GLOBAL MOTOR VEHICLE PRODUCTION, 2011-2017
  • Figure 7 : MOTOR VEHICLE-RELATED MARKET FOR ALL THERMAL MANAGEMENT TECHNOLOGIES, 201-2017
  • Figure 8 : GLOBAL CONSUMER ELECTRONICS MARKET, 2011-2017
  • Figure 9 : CONSUMER PRODUCT-RELATED MARKET FOR ALL THERMAL MANAGEMENT TECHNOLOGIES, 2011-2017
  • Figure 10 : GLOBAL MEDICAL AND OFFICE ELECTRONICS MARKET BY TYPE, 2011-2017
  • Figure 11 : MEDICAL AND OFFICE ELECTRONICS-RELATED MARKET FOR ALL THERMAL MANAGEMENT TECHNOLOGIES, 2011-2017
  • Figure 12 : GLOBAL INDUSTRIAL AND MILITARY ELECTRONICS MARKET BY TYPE, 2011-2017
  • Figure 13 : OTHER INDUSTRIAL AND MILITARY MARKETS FOR ALL THERMAL MANAGEMENT TECHNOLOGIES, 2011-2017
  • Figure 14 : GLOBAL THERMAL INTERFACE PRODUCT MARKET, 2011-2017
  • Figure 15 : GLOBAL THERMAL INTERFACE PRODUCT MARKET BY END USE, 2011-2017
  • Figure 16 : GLOBAL THERMAL INTERFACE PRODUCT MARKET BY END USE, 2011-2017
  • Figure 17 : GLOBAL THERMAL INTERFACE PRODUCT MARKET BY REGION, 2011-2017
  • Figure 18 : CAUSES OF ELECTRONIC FAILURE
  • Figure 19 : GLOBAL THERMAL MANAGEMENT TECHNOLOGY MARKET, 2011-2017
  • Figure 20 : GLOBAL THERMAL MANAGEMENT PRODUCT MARKET SHARE TRENDS, 2011-2017
  • Figure 21 : GLOBAL THERMAL GREASES MARKET, 2011-2017
  • Figure 22 : THERMAL GREASE MARKET BY END USE, 2011
  • Figure 23 : THERMAL GREASE MARKET BY FILLER MATERIAL TYPE, 2011
  • Figure 24 : THERMAL GREASE PRODUCT MARKET BY TYPE, 2011-2017
  • Figure 25 : THERMAL GREASE MARKET BY END USE, 2011-2017
  • Figure 26 : THERMAL GREASE MARKET BY REGION, 2011
  • Figure 27 : GLOBAL THERMAL GREASE MARKET BY REGION, 2011-2017
  • Figure 28 : GLOBAL THERMAL COMPOUND MARKET, 2011-2017
  • Figure 29 : THERMAL COMPOUND MARKET BY END USE, 2011
  • Figure 30 : THERMAL COMPOUND MARKET BY END USE, 2011-2017
  • Figure 31 : THERMAL COMPOUND MARKET BY REGION, 2011
  • Figure 32 : THERMAL COMPOUND MARKET BY REGION, 2011-2017
  • Figure 33 : GLOBAL THERMAL PAD MARKET, 2011-2017
  • Figure 34 : THERMAL PAD MARKET BY END USE, 2011
  • Figure 35 : THERMAL PAD MARKET BY END USE, 2011-2017
  • Figure 36 : GLOBAL THERMAL PAD MARKET BY REGION, 2010
  • Figure 37 : THERMAL PAD MARKET BY REGION, 2011-2017
  • Figure 38 : GLOBAL THERMAL ADHESIVE TAPE MARKET, 2011-2017
  • Figure 39 : THERMAL ADHESIVE FILM AND TAPE MARKET BY END USE, 2011
  • Figure 40 : THERMAL ADHESIVE FILM AND TAPE MARKET BY END USE, 2011-2017
  • Figure 41 : GLOBAL THERMAL ADHESIVE FILM AND TAPE MARKET BY REGION, 2011
  • Figure 42 : THERMAL ADHESIVE FILM AND TAPE MARKET BY REGION, 2011-2017
  • Figure 43 : GLOBAL EPOXY THERMAL INTERFACE MATERIAL MARKET, 2011-2017
  • Figure 44 : THERMAL ADHESIVE FILM AND TAPE MARKET BY END USE SEGMENTS 2010
  • Figure 45 : THERMAL EPOXY MARKET BY END USE, 2011-2017
  • Figure 46 : GLOBAL THERMAL EPOXY MARKET BY REGION, 2011
  • Figure 47 : THERMAL EPOXY MARKET BY REGION, 2011-2017
  • Figure 48 : GLOBAL PHASE-CHANGE THERMAL INTERFACE MATERIAL MARKET, 2011-2017
  • Figure 49 : PHASE-CHANGE THERMAL INTERFACE MATERIAL MARKET BY END USE, 2011
  • Figure 50 : PHASE-CHANGE THERMAL INTERFACE MATERIAL MARKET BY END USE, 2011-2017
  • Figure 51 : PHASE-CHANGE THERMAL INTERFACE MATERIALS MARKET BY REGION, 2011
  • Figure 52 : PHASE-CHANGE THERMAL INTERFACE MATERIAL MARKET BY REGION, 2011-2017
  • Figure 53 : GLOBAL METAL THERMAL INTERFACE MATERIAL MARKET, 2011-2017
  • Figure 54 : METALLIC THERMAL INTERFACE MATERIAL MARKET BY END USE, 2011
  • Figure 55 : GLOBAL METAL THERMAL INTERFACE MATERIALS MARKET BY TYPE, 2011-2017
  • Figure 56 : METAL THERMAL INTERFACE MATERIAL MARKET BY END USE, 2011-2017
  • Figure 57 : METAL THERMAL INTERFACE MATERIALS MARKET BY REGION, 2011
  • Figure 58 : METAL THERMAL INTERFACE MATERIALS MARKET BY REGION, 2011-2017
  • Figure 59 : GLOBAL THERMAL MANAGEMENT INTERFACE MARKET, 2010
  • Figure 60 : U.S. THERMAL INTERFACE MATERIAL PATENTS BY MATERIAL TYPE, THROUGH FEBRUARY 25, 2013
  • Figure 61 : U.S. THERMAL INTERFACE MATERIAL PATENTS BY TECHNOLOGY TYPE, THROUGH FEBRUARY 25, 2013
  • Figure 62 : U.S. THERMAL INTERFACE MATERIAL PATENT TRENDS OVER TIME, 2006-2012
  • Figure 63 : U.S. THERMAL INTERFACE MATERIAL PATENTS BY INVENTOR AND ASSIGNEE NATIONALITY, THROUGH FEBRUARY 25, 2013
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