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市場調查報告書

覆晶的全球市場:封裝技術(3D IC,2.5D IC,2D IC),各凸塊技術(銅柱,錫鉛凸塊,共晶錫鉛焊料,無鉛焊料,金凸塊),各產業:機會分析,產業預測

Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, 2D IC), Bumping Technology (Copper Pillar, Solder Bumping, Tin-lead eutectic solder, Lead-free solder, Gold Bumping), Industry - Global Opportunity Analysis and Industry Forecast, 2014 - 2022

出版商 Allied Market Research 商品編碼 374550
出版日期 內容資訊 英文 204 Pages
商品交期: 最快1-2個工作天內
價格
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覆晶的全球市場:封裝技術(3D IC,2.5D IC,2D IC),各凸塊技術(銅柱,錫鉛凸塊,共晶錫鉛焊料,無鉛焊料,金凸塊),各產業:機會分析,產業預測 Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, 2D IC), Bumping Technology (Copper Pillar, Solder Bumping, Tin-lead eutectic solder, Lead-free solder, Gold Bumping), Industry - Global Opportunity Analysis and Industry Forecast, 2014 - 2022
出版日期: 2016年09月01日 內容資訊: 英文 204 Pages
簡介

本報告提供全球覆晶市場相關調查分析,彙整市場概要,封裝技術,各凸塊技術,各產業,各地區考察,主要企業簡介等相關資訊。

第1章 簡介

第2章 摘要整理

第3章 市場概要

  • 市場定義和範圍
  • 主要調查結果
  • 波特的五力分析
  • 價值鏈分析
  • 市場佔有率分析
  • 推動市場的要素
  • 市場抑制因素
  • 市場機會

第4章 全球覆晶市場:封裝技術別

  • 概要
  • 3D IC
  • 2.5D IC
  • 2D IC

第5章 全球覆晶市場:產業

  • 概要
  • 電子產品
  • 工業
  • 汽車·運輸
  • 醫療
  • IT·通訊
  • 航空·防衛
  • 其他

第6章 全球覆晶市場:各凸塊技術

  • 概要
  • 銅柱
  • 錫鉛凸塊
  • 金凸塊
  • 其他

第7章 全球覆晶市場:各地區

  • 概要
  • 北美
  • 歐洲
  • 亞太地區
  • 南美/中東/非洲

第7章 企業簡介

目錄
Product Code: SE 161691

Flip chip, also known as controlled collapse chip connection (C4), consist of conductive bumps deposited on the chip pads on the top side of the wafer and then semiconductor devices are mounted by flipping the chip. It is an advanced semiconductor interconnecting device extensively used in different electronic products such as smartphones, PCs, and medical devices among others due to its advantages such as lower cost, increased packaging density, improved performance and reduced size & thickness of the chip. Further, flip chip has enabled the dramatic improvement of portable electronics and electric vehicles by providing better means for electrical interconnections.

Flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity. In addition, its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative. However, the technology is still in mutation. The rate of flip chip is propelled by bumping cost and assembly process cost.

The market is segmented on the basis of flip chip packaging technology, bumping technology, industry vertical, and geography. Based on bumping technology, the market comprises copper pillar, solder bumping, gold bumping and others including aluminum & conductive polymer bumping. The copper pillar segment dominates the market as it is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future electronic device requirements. It is an excellent interconnect choice for applications such as transceivers, embedded processors, and application processors.

Based on packaging technology, the market is segmented into 3D IC, 2.5D IC, and 2D IC. Among the three, 2.5D IC packaging dominated the market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. Based on industry vertical, the market is segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. The market is analyzed on the basis of four regions-North America, Europe, Asia-Pacific, and LAMEA.

The key players operating in flip chip market are IBM Corporation, Intel Corporation, Fujitsu Ltd, 3M, Samsung electronics Co., Ltd, Amkor Technology, Inc., TSMC, Ltd, Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.

POTENTIAL BENEFITS FOR STAKEHOLDERS:

  • This report provides an in-depth analysis of the world flip chip market along with current trends and future estimations to identify lucrative investment opportunities.
  • This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis.
  • Porter's Five Forces analysis highlights the potency of buyers and suppliers participating in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks.
  • Market estimation of geographical regions is based on the current market scenario and future trends.

FLIP CHIP MARKET SEGMENTATION

The market is segmented on the basis of packaging technology, bumping technology, industry vertical, and geography.

BY PACKAGING TECHNOLOGY

  • 3D IC
  • 2.5D IC
  • 2D IC

BY BUMPING TECHNOLOGY

  • Copper Pillar
  • Solder Bumping
  • Tin-Lead Eutectic Solder
  • Lead-Free Solder
  • Gold Bumping
  • Others (Aluminum & Conductive Polymer)

BY INDUSTRY

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace and Defense
  • Others (Renewable Energy and Media & Entertainment )

BY GEOGRAPHY

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • Korea
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Table of Contents

CHAPTER 1: Introduction

  • 1.1. Report Description
  • 1.2. Key benefits
  • 1.3. Key Market Segments
  • 1.4. Research Methodology
    • 1.4.1. Secondary research
    • 1.4.2. Primary research
    • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

  • 2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

  • 3.1. Market Definition and Scope
  • 3.2. Key findings
    • 3.2.1. Top investment pockets
    • 3.2.2. Top winning strategies
  • 3.3. Porters five force analysis
    • 3.3.1. Bargaining power of suppliers
    • 3.3.2. Bargaining power of buyers
    • 3.3.3. Threats from the new entrants
    • 3.3.4. Threats of substitutes
    • 3.3.5. Competitive rivalry
  • 3.4. Value chain analysis
  • 3.5. Market share analysis
  • 3.6. Drivers
    • 3.6.1. Thriving portable electronic market and increasing popularity of internet of things (IoT)
    • 3.6.2. Usage in graphic cards and processors used in real world gaming
    • 3.6.3. Impending need for circuit miniaturization in microelectronic devices
    • 3.6.4. Technological superiority over wire bonding
  • 3.7. Restraints
    • 3.7.1. Higher cost and less customization options available in comparison to wire bonding
  • 3.8. Opportunities
    • 3.8.1. Impending need of high frequency in electronic gadgets

CHAPTER 4: WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY

  • 4.1. Overview
  • 4.2. 3D IC
    • 4.2.1. Key market trends
    • 4.2.2. Key growth factors and opportunities
    • 4.2.3. Market size and forecast
  • 4.3. 5D IC
    • 4.3.1. Key market trends
    • 4.3.2. Key growth factors and opportunities
    • 4.3.3. Market size and forecast
  • 4.4. 2D IC
    • 4.4.1. Key market trends
    • 4.4.2. Key growth factors and opportunities
    • 4.4.3. Market size and forecast

CHAPTER 5: WORLD FLIP CHIP MARKET, BY INDUSTRY

  • 5.1. Overview
  • 5.2. Electronics
    • 5.2.1. Key market trends
    • 5.2.2. Key growth factors and opportunities
    • 5.2.3. Market size and forecast
  • 5.3. Industrial
    • 5.3.1. Key market trends
    • 5.3.2. Key growth factors and opportunities
    • 5.3.3. Market size and forecast
  • 5.4. Automotive & Transport
    • 5.4.1. Key market trends
    • 5.4.2. Key growth factors and opportunities
    • 5.4.3. Market size and forecast
  • 5.5. Healthcare
    • 5.5.1. Key market trends
    • 5.5.2. Key growth factors and opportunities
    • 5.5.3. Market size and forecast
  • 5.6. IT & Telecommunication
    • 5.6.1. Key market trends occupied
    • 5.6.2. Key growth factors and opportunities
    • 5.6.3. Market size and forecast
  • 5.7. Aerospace & Defense
    • 5.7.1. Key market trends
    • 5.7.2. Key growth factors and opportunities
    • 5.7.3. Market size and forecast
  • 5.8. Others
    • 5.8.1. Key market trends
    • 5.8.2. Key growth factors and opportunities
    • 5.8.3. Market size and forecast

CHAPTER 6: WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY

  • 6.1. Overview
  • 6.2. Copper pillar
    • 6.2.1. Key market trends
    • 6.2.2. Key growth factors and opportunities
    • 6.2.3. Market size and forecast
  • 6.3. Solder bumping
    • 6.3.1. Market size and forecast
    • 6.3.2. Tin-Lead solder
      • 6.3.2.1. Key market trends
      • 6.3.2.2. Key growth factors and opportunities
      • 6.3.2.3. Market size and forecast
    • 6.3.3. Lead free solder
      • 6.3.3.1. Key market trends
      • 6.3.3.2. Key growth factors and opportunities
      • 6.3.3.3. Market size and forecast
  • 6.4. Gold bumping
    • 6.4.1. Key market trends
    • 6.4.2. Key growth factors and opportunities
    • 6.4.3. Market size and forecast
  • 6.5. Others
    • 6.5.1. Key market trends
    • 6.5.2. Key growth factors and opportunities
    • 6.5.3. Market size and forecast

CHAPTER 7: WORLD FLIP CHIP MARKET BY GEOGRAPHY

  • 7.1. Overview
  • 7.2. North America
    • 7.2.1. Key market trends
    • 7.2.2. Market size and forecast
    • 7.2.3. U.S.
    • 7.2.4. Canada
    • 7.2.5. Mexico
  • 7.3. Europe
    • 7.3.1. Key market trends
    • 7.3.2. Market size and forecast
    • 7.3.3. U.K.
    • 7.3.4. Germany
    • 7.3.5. Turkey
    • 7.3.6. Spain
    • 7.3.7. Rest of Europe
  • 7.4. Asia-Pacific
    • 7.4.1. Key market trends
    • 7.4.2. Market size and forecast
    • 7.4.3. Australia
    • 7.4.4. China
    • 7.4.5. Japan
    • 7.4.6. India
    • 7.4.7. Rest of Asia-Pacific
  • 7.5. LAMEA
    • 7.5.1. Key market trends
    • 7.5.2. Market size and forecast
    • 7.5.3. Africa
    • 7.5.4. Middle East
    • 7.5.5. Latin America

CHAPTER 8: COMPANY PROFILES

  • 8.1. International Business Machines Corporation (IBM)
    • 8.1.1. Company overview
    • 8.1.2. Company snapshot
    • 8.1.3. Operating business segments
    • 8.1.4. Business performance
    • 8.1.5. Key strategic moves and developments
  • 8.2. 3M
    • 8.2.1. Company overview
    • 8.2.2. Company snapshot
    • 8.2.3. Operating business segments
    • 8.2.4. Business performance
    • 8.2.5. Key strategic moves and developments
  • 8.3. Texas Instruments, Inc.
    • 8.3.1. Company overview
    • 8.3.2. Company snapshot
    • 8.3.3. Operating business segments
    • 8.3.4. Business performance
    • 8.3.5. Key strategic moves and developments
  • 8.4. Taiwan Semiconductor Manufacturing Company Ltd.
    • 8.4.1. Company overview
    • 8.4.2. Company snapshot
    • 8.4.3. Operating business segments
    • 8.4.4. Business performance
    • 8.4.5. Key strategic moves and developments
  • 8.5. Apple Inc.
    • 8.5.1. Company overview
    • 8.5.2. Company snapshot
    • 8.5.3. Operating business segments
    • 8.5.4. Business performance
    • 8.5.5. Key strategic moves and developments
  • 8.6. Fujitsu
    • 8.6.1. Company overview
    • 8.6.2. Company snapshot
    • 8.6.3. Operating business segments
    • 8.6.4. Business performance
    • 8.6.5. Key strategic moves and developments
  • 8.7. Intel Corporation
    • 8.7.1. Company overview
    • 8.7.2. Company snapshot
    • 8.7.3. Operating Business Segments:-
    • 8.7.4. Business performance
    • 8.7.5. Key strategic moves and developments
  • 8.8. Advanced Micro Devices, Inc.
    • 8.8.1. Company overview
    • 8.8.2. Company snapshot
    • 8.8.3. Operating business segments
    • 8.8.4. Business performance
    • 8.8.5. Key strategic moves and developments
  • 8.9. Amkor Technology, Inc.
    • 8.9.1. Company overview
    • 8.9.2. Company snapshot
    • 8.9.3. Operating business segments
    • 8.9.4. Business performance
    • 8.9.5. Key strategic moves and developments
  • 8.10. Samsung Electronics Co. Ltd.
    • 8.10.1. Company overview
    • 8.10.2. Operating Business Segments
    • 8.10.3. Business performance
    • 8.10.4. Key Strategic Moves and Developments

LIST OF TABLES

  • TABLE 1: WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY, 2014 - 2022 ($MILLION)
  • TABLE 2: WORLD FLIP CHIP 3D IC MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 3: WORLD FLIP CHIP 2.5D IC MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 4: WORLD FLIP CHIP 2D IC MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 5: WORLD FLIP CHIP MARKET, BY INDUSTRY, 2014 - 2022 ($MILLION)
  • TABLE 6: WORLD FLIP CHIP CONSUMER ELECTRONICS MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 7: WORLD FLIP CHIP INDUSTRIAL MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 8: WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 9: WORLD FLIP CHIP HEALTHCARE MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 10: WORLD FLIP CHIP TELECOMMUNICATION MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 11: WORLD FLIP CHIP AEROSPACE & DEFENCE MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 12: WORLD FLIP CHIP OTHERS MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 13: WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY, 2014 - 2022 ($MILLION)
  • TABLE 14: WORLD FLIP CHIP COPPER PILLAR MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 15: WORLD FLIP CHIP SOLDER BUMPING MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 16: WORLD FLIP CHIP TIN LEAD SOLDER MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 17: WORLD FLIP CHIP LEAD FREE SOLDER MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 18: WORLD FLIP CHIP GOLD BUMPING MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 19: WORLD FLIP CHIP OTHERS MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
  • TABLE 20: NORTH AMERICA: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
  • TABLE 21: NORTH AMERICA: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
  • TABLE 22: NORTH AMERICA: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
  • TABLE 23: EUROPE: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
  • TABLE 24: EUROPE: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
  • TABLE 25: EUROPE: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
  • TABLE 26: ASIA-PACIFIC: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
  • TABLE 27: ASIA PACIFIC: FLIP CHIP MARKET, BY INDUSTRY, 2014 - 2022 ($MILLION)
  • TABLE 28: ASIA-PACIFIC: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
  • TABLE 29: LAMEA: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
  • TABLE 30: ASIA PACIFIC: FLIP CHIP MARKET, BY INDUSTRY, 2014 - 2022 ($MILLION)
  • TABLE 31: LAMEA: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
  • TABLE 32: IBM CORPORATION - COMPANY SNAPSHOT
  • TABLE 33: IBM CORPORATION COMPANY OPERATING BUSINESS SEGMENTS
  • TABLE 34: 3M - COMPANY SNAPSHOT
  • TABLE 35: 3M COMPANY OPERATING BUSINESS SEGMENTS
  • TABLE 36: TEXAS INSTRUMENTS - COMPANY SNAPSHOT
  • TABLE 37: TEXAS INSTRUMENTS COMPANY OPERATING BUSINESS SEGMENTS
  • TABLE 38: TSMC - COMPANY SNAPSHOT
  • TABLE 39: TSMC COMPANY OPERATING BUSINESS SEGMENTS
  • TABLE 40: APPLE - COMPANY SNAPSHOT
  • TABLE 41: APPLE COMPANY OPERATING BUSINESS SEGMENTS
  • TABLE 42: FUJITSU: COMPANY SNAPSHOT
  • TABLE 43: FUJITSU - OPERATING SEGMENTS:-
  • TABLE 44: SNAPSHOT OF INTEL CORPORATION
  • TABLE 45: INTEL CORPORATION - OPERATING SEGMENTS:-
  • TABLE 46: AMD: COMPANY SNAPSHOT
  • TABLE 47: AMD - OPERATING SEGMENTS:-
  • TABLE 48: AMKOR TECHNOLOGY - COMPANY SNAPSHOT
  • TABLE 49: AMKOR TECHNOLOGY COMPANY OPERATING BUSINESS SEGMENTS
  • TABLE 50: BUSINESS SNAPSHOT OF SAMSUNG ELECTRONICS CO. LTD.
  • TABLE 51: SAMSUNG ELECTRONICS COMPANY OPERATING BUSINESS SEGMENTS

LIST OF FIGURES

  • FIG. 1: WORLD FLIP CHIP MARKET, RESEARCH METHODOLOGY
  • FIG. 2: WORLD FLIP CHIP MARKET, SEGMENTATION REVENUE & CAGR (2016-2022)
  • FIG. 3: WORLD FLIP CHIP MARKET, COMPARATIVE ANALYSIS, 2015 & 2022 (%)
  • FIG. 4: TOP IMPACTING FACTORS
  • FIG. 5: WORLDWIDE SMARTPHONE USERS, MILLION (2014-2019)
  • FIG. 6: TOP INVESTMENT POCKETS
  • FIG. 7: TOP WINNING STRATEGIES
  • FIG. 8: PORTERS FIVE FORCE ANALYSIS
  • FIG. 9: VALUE CHAIN ANALYSIS
  • FIG. 10: COMPANIES/INSTITUTES INVOLED IN DIFFERENT ACTIVITIES IN THE VALUE CHAIN
  • FIG. 11: MARKET SHARE ANALYSIS, 2015
  • FIG. 12: GLOBAL PORTABLE ELECTRONICS MARKET REVENUE (2010 - 2015)
  • FIG. 13: COMPARISON BETWEEN THE PROPERTIES OF WIRE BONDING AND FLIP CHIPS
  • FIG. 14: COMPARATIVE MARKET SHARE ANALYSIS OF WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (% SHARE)
  • FIG. 15: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP 3D IC MARKET, 2015 & 2022 (% SHARE)
  • FIG. 16: WORLD FLIP CHIP 3D IC MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 17: WORLD FLIP CHIP 3D IC MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 18: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP 2.5D IC MARKET, 2015 & 2022 (% SHARE)
  • FIG. 19: WORLD FLIP CHIP 2.5D IC MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 20: WORLD FLIP CHIP 2.5D IC MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 21: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP 2D IC MARKET, 2015 & 2022 (% SHARE)
  • FIG. 22: WORLD FLIP CHIP 2D IC MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 23: WORLD FLIP CHIP 2D IC MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 24: COMPARATIVE MARKET SHARE ANALYSIS OF WORLD FLIP CHIP MARKET, BY INDUSTRY, 2015 & 2022 (% SHARE)
  • FIG. 25: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP CONSUMER ELECTRONICS MARKET, 2015 & 2022 (% SHARE)
  • FIG. 26: WORLD FLIP CHIP ELECTRONICS MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 27: WORLD FLIP CHIP ELECTRONICS MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 28: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP INDUSTRIAL MARKET, 2015 & 2022 (% SHARE)
  • FIG. 29: WORLD FLIP CHIP INDUSTRIAL MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 30: WORLD FLIP CHIP INDUSTRIAL MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 31: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET, 2015 & 2022 (% SHARE)
  • FIG. 32: WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 33: 1WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 34: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP HEALTHCARE MARKET, 2015 & 2022 (% SHARE)
  • FIG. 35: WORLD FLIP CHIP HEALTHCARE MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 36: WORLD FLIP CHIP HEALTHCARE MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 37: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP TELECOMMUNICATION MARKET, 2015 & 2022 (% SHARE)
  • FIG. 38: WORLD FLIP CHIP TELECOMMUNICATION MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 39: WORLD FLIP CHIP TELECOMMUNICATION MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 40: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP AEROSPACE & DEFENCE MARKET, 2015 & 2022 (% SHARE)
  • FIG. 41: WORLD FLIP CHIP AEROSPACE & DEFENSE MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 42: WORLD FLIP CHIP AEROSPACE & DEFENSE MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 43: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP OTHERS MARKET, 2015 & 2022 (% SHARE)
  • FIG. 44: WORLD FLIP CHIP OTHERS MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 45: WORLD FLIP CHIP OTHERS MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 46: COMPARATIVE MARKET SHARE ANALYSIS OF WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY, 2015 & 2022 (% SHARE)
  • FIG. 47: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP COPPER PILLAR MARKET, 2015 & 2022 (% SHARE)
  • FIG. 48: WORLD FLIP CHIP COPPER PILLAR MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 49: WORLD FLIP CHIP COPPER PILLAR MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 50: WORLD FLIP CHIP SOLDER BUMPING MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 51: WORLD FLIP CHIP SOLDER BUMPING MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 52: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP TIN LEAD SOLDER MARKET, 2015 & 2022 (% SHARE)
  • FIG. 53: WORLD FLIP CHIP TIN-LEAD EUTECTIC SOLDER MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 54: WORLD FLIP CHIP TIN-LEAD EUTECTIC SOLDER MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 55: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP LEAD-FREE SOLDER MARKET, 2015 & 2022 (% SHARE)
  • FIG. 56: WORLD FLIP CHIP LEAD-FREE SOLDER MARKET REVENUE, 2015 - 2022 ($MILLION)
  • FIG. 57: WORLD FLIP CHIP LEAD-FREE SOLDER MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 58: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP GOLD BUMPING MARKET, 2015 & 2022 (% SHARE)
  • FIG. 59: WORLD FLIP CHIP GOLD BUMPING MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 60: WORLD FLIP CHIP GOLD BUMPING MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 61: COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP OTHERS MARKET, 2015 & 2022 (% SHARE)
  • FIG. 62: WORLD FLIP CHIP OTHERS MARKET REVENUE, 2014 - 2022 ($MILLION)
  • FIG. 63: WORLD FLIP CHIP OTHERS MARKET REVENUE, 2015 - 2022 (%)
  • FIG. 64: NORTH AMERICA: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
  • FIG. 65: COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF NORTH AMERICAN MARKET, BY TYPE, 2015 & 2022 (%)
  • FIG. 66: COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF NORTH AMERICAN MARKET, BY INDUSTRY, 2015 & 2022 (%)
  • FIG. 67: NORTH AMERICA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 68: NORTH AMERICA: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
  • FIG. 69: NORTH AMERICA: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
  • FIG. 70: U.S.: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 71: CANADA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 72: EUROPE: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
  • FIG. 73: COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF EUROPEAN MARKET,BY TYPE, 2015 & 2022 (%)
  • FIG. 74: COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF EUROPEAN MARKET, BY INDUSTRY, 2015 & 2022 (%)
  • FIG. 75: EUROPE: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 76: EUROPE: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
  • FIG. 77: EUROPE: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
  • FIG. 78: U.K.: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 79: GERMANY: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 80: TURKEY: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 81: SPAIN: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 82: REST OF EUROPE: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 83: ASIA PACIFIC: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
  • FIG. 84: COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF ASIA-PACIFIC MARKET, BY TYPE, 2015 & 2022 (%)
  • FIG. 85: COMPARATIVE GRAPHENE BATTERY MARKET SHARE ANALYSIS OF ASIA-PACIFIC MARKET, BY INDUSTRY, 2015 & 2022 (%)
  • FIG. 86: ASIA-PACIFIC: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 87: ASIA-PACIFIC: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
  • FIG. 88: ASIA-PACIFIC: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
  • FIG. 89: AUSTRALIA: FLIP CHIP MAREKT, 2014 - 2022 ($MILLION)
  • FIG. 90: CHINA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 91: JAPAN: FLIP CHIP SYSTEM MARKET, 2014 - 2022 ($MILLION)
  • FIG. 92: INDIA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 93: REST OF ASIA-PACIFIC: FLIP CHIP MARKET, 2014-222 ($MILLION)
  • FIG. 94: LAMEA: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
  • FIG. 95: COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF LAMEA MARKET, BY TYPE 2015 & 2022 (%)
  • FIG. 96: COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF LAMEA MARKET, BY INDUSTRY, 2015 & 2022 (%)
  • FIG. 97: LAMEA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 98: LAMEA: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
  • FIG. 99: LAMEA: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
  • FIG. 100: AFRICA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 101: MIDDLE EAST: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
  • FIG. 102: IBM CORPORATION: REVENUE, 20132015 ($MILLION)
  • FIG. 103: IBM CORPORATION: REVENUE BY SEGMENT, 2015 (%)
  • FIG. 104: IBM CORPORATION: REVENUE BY REGION, 2015 (%)
  • FIG. 105: 3M: NET SALES, 20132015 ($MILLION)
  • FIG. 106: 3M: REVENUE BY SEGMENT, 2015 (%)
  • FIG. 107: 3M: REVENUE BYREGION, 2015 (%)
  • FIG. 108: TEXAS INSTRUMENTS: REVENUE, 20132015 ($MILLION)
  • FIG. 109: TEXAS INSTRUMENTS: REVENUE BY SEGMENT, 2015 (%)
  • FIG. 110: TEXAS INSTRUMENTS: REVENUE BY REGION, 2015 (%)
  • FIG. 111: TSMC: REVENUE, 20132015 ($MILLION)
  • FIG. 112: TSMC: REVENUE BY SEGMENT, 2015 (%)
  • FIG. 113: TSMC: REVENUE BY REGION, 2015 (%)
  • FIG. 114: APPLE: REVENUE, 20132015 ($MILLION)
  • FIG. 115: APPLE: REVENUE BY PRODUCTS & SERVICES, 2015 (%)
  • FIG. 116: APPLE: REVENUE BYREGION, 2015 (%)
  • FIG. 117: FUJITSU, REVENUE, 20132015 ($MILLION)
  • FIG. 118: FUJITSU, REVENUE, BY SEGMENT (%), 2015
  • FIG. 119: FUJITSU, REVENUE, BY REGION (%), 2015
  • FIG. 120: REVENUE OF INTEL CORPORATION, 2013-2015 ($MILLION)
  • FIG. 121: REVENUE OF INTEL CORPORATION BY SEGMENT (%), 2015
  • FIG. 122: REVENUE OF INTEL CORPORATION BY REGION (%), 2015
  • FIG. 123: AMD, REVENUE, 20132015 ($MILLION)
  • FIG. 124: AMD, REVENUE, BY SEGMENT (%), 2015
  • FIG. 125: REVENUE OF AMD BY REGION (%), 2015
  • FIG. 126: AMKOR TECHNOLOGY: REVENUE, 20132015 ($MILLION)
  • FIG. 127: AMKOR TECHNOLOGY: REVENUE BY GEOGRAPHY, 2015 (%)
  • FIG. 128: AMKOR TECHNOLOGY: REVENUE BY SEGMENT, 2015 (%)
  • FIG. 129: REVENUE OF SAMSUNG ELECTRONICS CO. LTD. 2013 -2015, $MILLION
  • FIG. 130: SAMSUNG ELECTRONICS CO. LTD: REVENUE BY GEOGRAPHY, 2015 (%)
  • FIG. 131: SAMSUNG ELECTRONICS: REVENUE BY SEGMENT, 2015 (%)
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