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Report
[英文調查報告書]

全球嵌入式整合電腦系統市場(第5版):第3卷 運輸・基礎建設部門

EMBEDDED INTEGRATED COMPUTER SYSTEMS, 5TH EDITION GLOBAL MARKET ANALYSIS VOLUME 03: TRANSPORTATION, INFRASTRUCTURE APPLICATIONS

商品編碼 : 48147
出版日期 : 2006/12

Price

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此出版品為英文撰寫

Abstract

This report examines present and future markets for Embedded Integrated Computer Systems (EICSs) in transportation applications on a global basis. The study includes:

  • Market sizes and forecasts through the year 2010
  • Analysis of market and technology trends
  • User data on trends, expectations, and product preferences
  • Strategic recommendations

Table of Contents

I EXECUTIVE SUMMARY

  • GENERAL OVERVIEW
  • GEOGRAPHICAL DISTRIBUTION
  • TRANSPORTATION MARKET SEGMENTS
  • SYSTEM ARCHITECTURES
  • USER SURVEY RESULTS
  • SELECTED RECOMMENDATIONS
  • LEADING VENDORS

II SCOPE AND METHODOLOGY

  • SCOPE
  • Definition of Terms
  • Segmentation
  • Other Report Content
  • METHODOLOGY

III INDUSTRY STRUCTURE

  • INDUSTRY PARTICIPANTS
  • SEGMENTATION MODEL
  • SYSTEM CONFIGURATIONS
  • SALES ORGANIZATIONS
  • CUSTOMER CLASSES
  • RoHS

IV MARKET SIZE, SEGMENTATIONS, AND FORECASTS

  • TOTAL EICS TRANSPORTATION MARKET
  • MERCHANT EICS TRANSPORTATION MARKET
  • Unit Volumes & Pricing
  • Geographic Distribution
  • Sales/Distribution Channels
  • Customer Classes
  • Market Segments
  • Applications
  • System Configurations
  • System Architectures
  • Passive Backplane Bus Architectures
  • Active Backplane Motherboard Form Factors
  • Enclosure/Mounting Style
  • CPU Classes
  • CPU Types
  • Number of Processors
  • Services Offered

V USER REQUIREMENTS AND TRENDS

  • INTRODUCTION
  • METHODOLOGY
  • FOCUS ON TRANSPORTATION INFRASTRUCTUE APPLICATIONS
  • SOURCES FOR EMBEDDED INTEGRATED COMPUTER SYSTEMS (EICSS)
  • HARDWARE COMPUTER PLATFORM ARCHITECTURES
  • Passive Backplane Architectures
  • Active Backplane Architectures
  • Stackable Architectures
  • TYPES OF CONFIGURATIONS
  • ENCLOSURES
  • Passive Backplane
  • Active Backplane
  • KEY TECHNOLOGIES
  • MICROPROCESSOR USE
  • SINGLE AND MULTIPLE PROCESSORS
  • SOFTWARE OPERATING SYSTEMS
  • SUBSYSTEM CAPABILITIES
  • SYSTEM FAILURES
  • ETHERNET CONNECTIVITY
  • TYPES OF COOLING
  • SUPPORT SERVICES
  • UPGRADES AND MAINTENANCE
  • PRODUCT FEATURES AND PERFORMANCE
  • COMMERCIAL CONSIDERATIONS
  • SOURCES FOR INFORMATION

VI COMPETITIVE ANALYSIS

  • TRANSPORTATION EICS VENDOR MARKET SHARES
  • TRANSPORTATION EICS GEOGRAPHICAL VENDOR MARKET SHARES
  • TRANSPORTATION EICS SYSTEM ARCHITECTURE VENDOR MARKET SHARES
  • TRANSPORTATION EICS ENCLOSURE TYPE VENDOR MARKET SHARES

VII STRATEGY AND RECOMMENDATIONS

  • GENERAL
  • Specific Recommendations
  • REGIONAL
  • Specific Recommendations
  • SYSTEM ARCHITECTURES
  • Specific Recommendations
  • MICROPROCESSORS
  • Specific Recommendations
  • SERVICES
  • Specific Recommendations

VIII VENDOR PROFILES

  • ADVANTECH CO., LTD.
  • DLOG GMBH
  • DSM COMPUTER AG
  • EUROTECH SPA
  • KONTRON AG
  • NATIONAL INSTRUMENTS
  • XYCOM AUTOMATION

APPENDIX: VENDOR LIST

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此出版品為英文撰寫

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[英文調查報告書]
全球嵌入式整合電腦系統市場(第5版):第3卷 運輸・基礎建設部門
EMBEDDED INTEGRATED COMPUTER SYSTEMS, 5TH EDITION GLOBAL MARKET ANALYSIS VOLUME 03: TRANSPORTATION, INFRASTRUCTURE APPLICATIONS

出版商 : VDC Research Group VDC Research Group
代理商 : Global Information, Inc. Global Information, Inc.

US $ 4,950 (PDF by E-mail (Single User))
商品編碼 : 48147

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