Abstract
This report examines present and future markets for Embedded Integrated Computer Systems (EICSs) in communications applications on a global basis. The study includes:
- Market sizes and forecasts through the year 2010
- Analysis of market and technology trends
- User data on trends, expectations, and product preferences
- Strategic recommendations
Table of Contents
I EXECUTIVE SUMMARY
- GENERAL OVERVIEW
- GEOGRAPHICAL DISTRIBUTION
- COMMUNICATIONS MARKET SEGMENTS
- SYSTEM ARCHITECTURES
- USER SURVEY RESULTS
- SELECTED RECOMMENDATIONS
- LEADING VENDORS
II SCOPE AND METHODOLOGY
- SCOPE
- Definition of Terms
- Segmentation
- Other Report Content
- METHODOLOGY
III INDUSTRY STRUCTURE
- INDUSTRY PARTICIPANTS
- SEGMENTATION MODEL
- SYSTEM CONFIGURATIONS
- SALES ORGANIZATIONS
- CUSTOMER CLASSES
- RoHS
IV MARKET SIZE, SEGMENTATIONS, AND FORECASTS
- TOTAL EICS COMMUNICATIONS MARKET
- MERCHANT EICS COMMUNICATIONS MARKET
- Unit Volumes & Pricing
- Geographic Distribution
- Sales/Distribution Channels
- Customer Classes
- Market Segments
- Applications
- System Configurations
- System Architectures
- Passive Backplane Bus Architectures
- Active Backplane Motherboard Form Factors
- Enclosure/Mounting Style
- CPU Classes
- CPU Types
- Number of Processors
- Services Offered
V USER REQUIREMENTS AND TRENDS
- INTRODUCTION
- METHODOLOGY
- FOCUS ON COMMUNICATIONS APPLICATIONS
- SOURCES FOR EMBEDDED INTEGRATED COMPUTER SYSTEMS (EICSS)
- HARDWARE COMPUTER PLATFORM ARCHITECTURES
- Passive Backplane Architectures
- Active Backplane Architectures
- Stackable Architectures
- TYPES OF CONFIGURATIONS
- ENCLOSURES
- Passive Backplane
- Active Backplane
- KEY TECHNOLOGIES
- MICROPROCESSOR USE
- SINGLE AND MULTIPLE PROCESSORS
- SOFTWARE OPERATING SYSTEMS
- SUBSYSTEM CAPABILITIES
- SYSTEM FAILURES
- ETHERNET CONNECTIVITY
- TYPES OF COOLING
- SUPPORT SERVICES
- UPGRADES AND MAINTENANCE
- PRODUCT FEATURES AND PERFORMANCE
- COMMERCIAL CONSIDERATIONS
- SOURCES FOR INFORMATION
VI COMPETITIVE ANALYSIS
- COMMUNICATIONS EICS VENDOR MARKET SHARES
- COMMUNICATIONS EICS GEOGRAPHICAL VENDOR MARKET SHARES
- COMMUNICATIONS EICS SYSTEM ARCHITECTURE VENDOR MARKET SHARES
- COMMUNICATIONS EICS ENCLOSURE TYPE VENDOR MARKET SHARES
VII STRATEGY AND RECOMMENDATIONS
- GENERAL
- Specific Recommendations
- SYSTEM ARCHITECTURES
- Specific Recommendations
- MICROPROCESSORS
- Specific Recommendations
- SERVICES
- Specific Recommendations
VIII VENDOR PROFILES
- ADVANTECH CO., LTD.
- ALCATEL
- APPRO INTERNATIONAL
- CISCO SYSTEMS, INC.
- CONTINUOUS COMPUTING
- ERICSSON FIXED NETWORKS & MOBILE NETWORKS GROUPS
- GERMANE SYSTEMS
- HEWLETT-PACKARD ENTERPRISE, STORAGE, AND SERVERS GROUP
- HUAWEI TECHNOLOGIES CO., LTD.
- IBM HARDWARE GROUP
- JUNIPER NETWORKS, INC.
- KONTRON AG
- LUCENT NETWORK SOLUTIONS GROUP
- MOTOROLA EMBEDDED COMMUINCATIONS COMPUTING
- MOTOROLA NETWORKS DIVISION
- NATIONAL INSTRUMENTS
- NOKIA SIEMENS NETWORKS
- NORTEL NETWORKS MOBILITY & CONVERGED CORE NETWORKS
- RADISYS CORPORATION
- SUN MICROSYSTEMS, INC
- ZTE CORPORATION
- APPENDIX: VENDOR LIST
