Abstract
The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.
Table of Contents
1 EXECUTIVE SUMMARY
- Scope and Methodology
- Scope
- Methodology
- Research Overview and Key Findings
- Research Overview
- Key Findings
2 CHIP PACKAGING--TECHNOLOGY OUTLOOK
- Technology Evolution in the Silicon IC Industry
- Introduction to Chip Packaging Technologies
- Growth Patterns in the Silicon IC Industry
- Advanced Chip Packaging -- Technology Primer
- System in Package (SiP)
- System on Chip (SoC)
- Stacked Die Packages
- Stacked Packages
- Multi-Chip Module (MCM)
- SoC versus SiP
- Adoption Factors for the Chip Packaging Industry
- Industry Challenges
- Technology Drivers and Restraints
3 TECHNOLOGY ENABLERS FOR CHIP PACKAGING
- Wafer and Surface Mount Technologies
- Trends in the Wafer Industry--Evolution of SOI
- Advances in Surface Mount Devices Placement Technology
- Interconnect Technologies and Signal Integrity
- Interconnects--Technologies and Processes
- Signal Integrity and Modeling--Issues and Challenges
4 TECHNOLOGY DEVELOPMENT AND ADOPTION POSTURES IN CHIP PACKAGING INDUSTRY
- Technology Trends
- 3D Integration--Winning Edges and Technology Gaps
- Evaluation of the Technology Development Chain
- 3D Integration--Adoption Factors
- 3D Integration Industry Trends; Analyst Insights
- Industry Outlook on 3D Integration
- Analyst Insights
5 NOTEWORTHY DEVELOPMENT INITIATIVES IN THE CHIP PACKAGING INDUSTRY
- Innovative Chip and Board Packaging Technologies--World
- Innovative Interconnect Technologies for IC Packaging--USA
- Innovative SiP-Based Multiradio Solution--USA
- Integrated Modular Board Technology-Finland
- Signal Integrity and IP Developments--World
- Advanced High-Speed Metallic Interconnects--USA
- Flexible Modeling Solutions for High-Speed Interconnects--Germany
- High-Speed Field Solutions for Next Generation IC Packages-- USA
- Electromagnetic Band-Gap Technology for Noise Suppression in Packages--USA
- High-Speed Design Tools for Signal Integrity--USA
6 KEY PATENTS AND CONTACTS IN THE CHIP PACKAGING INDUSTRY
- Key Patents Related to this Sector
- Patents I
- Patents II
- Key Contacts
- Corporate Contacts
- Universities and Research Labs
7 DECISION SUPPORT DATABASE
- Decision Support Database Tables
- Electronic Components Contribution to Electronics Industry--World (2002 to 2012)
- Semiconductor and Semiconductor Equipment Market--World (2002 to 2012)
- Manufacturing Enterprises--World (2002 to 2012)
- Contribution of Manufacturing Industry to GDP--World (2002 to 2012)
- Number of Service Enterprises--World (2002 to 2012)
- PCB Sales--World (2002 to 2012)
- Consumer Electronics Contribution to the Electronics Industry (Percentage)--World (2002 to 2012)
