Abstract
Research Overview
This Frost & Sullivan research service titled Emerging Trends in SOI Technology provides analyses of complementary metal-oxide-semiconductor (CMOS)-SOI, novel SOI devices, SOI-MEMS, capacitorless memory, micro-opto-electro-mechanical-system (MOEMS), III-V compound materials-on-insulator and others. It also includes key drivers, challenges, restraints, analysis and forecasts of the technologies may shape the of future semiconductor testing industry. In this study, Frost & Sullivan' s expert analysts thoroughly examine the following markets: semiconductor devices and semiconductor manufacturing.
Table of Contents
1 EXECUTIVE SUMMARY
- Scope and Research Methodology
- Scope
- Research Methodology
- Introduction and Key Findings
- Introduction
- Key Findings
2 PRIMERS ON SOI TECHNOLOGY AND ITS APPLICATIONS
- Introducing SOI Technology
- Why Do We Need SOI?
- Explaining SOI
- Types of Thin Film SOI Wafers
- Techniques Used for Fabricating Thin-Film SOI Wafers
- Applications
- Existing Applications
- Emerging Applications
3 RECENT DEVELOPMENTS
- Industry
- Zero Capacitor RAM-Innovative Silicon
- World' s Thinnest RFID Chip-Hitachi
- SOI Technology Enhances In-Vehicle Networking Performance-Philips Semiconductor
- ITFET and sSOI technologies on SOI Wafers-Freescale Semiconductor
- Fastest SOI Bipolar Devices for High-Speed Analog (HSA) Applications-Zarlink
- Capacitorless Twin-Transistor RAM-Renesas
- Ultralow Off-State Leakage Transistor-Oki Electric
- Thick SOI for MEMS Applications-Tronic Microsystems and ELA Medical
- High-Speed ADC with Ultralow Noise-Analog Device
- First SOI-Based ASIC Devices-Soisic
- First Demonstration of Capacitorless DRAM-Toshiba
- European Partnership to Develop High-Performance SOI IC-SilOnIS
- Development of 300 mm sSOI Wafer-Soitec and ASM
- 65 nm SOI Technology with Enhanced Transistor Strain-IBM + AMD + Sony + Toshiba
- Academia
- Transition from Wire Formation to Island Formation on SOI Wafer-Shizuoka University (Japan)
- Silicon-on-Diamond for Future Electronic Applications-North Carolina State University (US)
- Silicon-Carbon Source/Drain Devices-National University of Singapore (Singapore)
- Sensors and Actuators Based on SOI Materials-Chalmers University of Technology (Sweden)
- Large Grain Polysilicon-On-Insulator with High Temperature Sensing Capability-Hong Kong University (Hong Kong)
- InP on Insulator Substrate-Institute of Materials Research and Engineering (Singapore)
4 ADOPTION FACTORS AND FORECASTS
- Driving Factors
- AMD' s Success
- Improvement in Cost and Supply of SOI Wafers
- Bottleneck in Scaling and Soft-Error Radiation Problem in Memory Devices
- The Push for Strained Silicon
- III-V Materials-on-Insulator Technology
- SOI MEMS Applications and Nanodevices
- Constraints and Challenges of SOI
- Floating Body Potential Effect
- Effects on CMOS Process
- High Cost and Supply of SOI Wafers
- Design SOI IPs
- SOI' s Future
- Supporting Novel Devices
- Complementing Strain Technology
- SOI MEMS
5 KEY CONTACTS AND SELECTED PATENTS
- Key Contacts
- Corporates
- Universities and Institutes
- Selected Patents
- Patents I
- Patents II
6 DECISION SUPPORT DATABASE
- Semiconductor Applications Statistics--World
- Business PC Installed Base (1999-2006)
- PC Installed Base (1999-2006)
- Educational PC Installed Base (1999-2006)
- Laptops Installed Base (1999-2006)
- Portable PC Install Base (1999-2006)
- Consumer Electronic Contribution to Electronics Industry (1999-2006)
- Control and Instrumentation Contribution to Electronics Industry (1999-2006)
- Electronic Components Contribution to Electronics Industry (1999-2006)
- Medical and Industrial Contribution to Electronics Industry (1999-2006)
- Office Equipment Contribution to Electronics Industry (1999-2006)
- Radio Communication and RADAR Contribution to Electronics Industry (1999-2006)
- Telecommunication Contribution to Electronics Industry (1999-2006)
- Semiconductor Industry Statistics
- Global Semiconductor and Semiconductor Equipment Market (1999-2006)
- Number of Semiconductor Plants-USA (1988-2001)
