Abstract
Overview
The SEMI® WWSEMS report provides monthly data from 1991 to 2007 of the global equipment bookings for 22 categories in North America, Japan, Europe, Korea, Taiwan, China and Rest of World. Japanese headquartered companies provide inputs through SEMI' s partner, the Semiconductor Equipment Association of Japan (SEAJ).
Table of Contents
The data includes the following equipment categories:
- Total Equipment
- Mask/Reticle Equipment
- Wafer Manufacturing Equipment
- Wafer Processing Equipment
- Expose & Write Equipment
- Resist Processing Equipment
- Etch Equipment
- Surface Conditioning/Clean & Dry Equipment
- Thermal Processing Equipment
- Ion Implant Equipment
- CVD Equipment
- Sputter Equipment
- Other Deposition Equipment
- Inspection & Measurement Equipment
- CMP Equipment
- Other Wafer Processing Equipment
- Assembly & Packaging Equipment
- Fab Facilities Equipment
- Total Test Equipment
- SOC & Logic Test Equipment
- Memory Test Equipment
- Handlers*
- Test Related
Tabs of spreadsheet
- 2007 Bookings
- 2007 Billings
- 2006 Bookings
- 2006 Billings
- *
- 1996 Shipments
- *
- 1993 Shipments
- 1992 Shipments
- 1991 Shipments
Note: Shipment data are only included for the period of 1991 - 1996
