Abstract
Bluetooth to date has been the single most successful short range wireless technology and therefore Bluetooth is central to this report. However, the wireless communications industry is converging and "wireless coexistence" is now vital to the future success of a large number of companies in this industry.
This is where ICs with multiple wireless functionality come in; whereas once the argument was about which technology will win in which applications, recent announcements from companies who are now combining multiple radios on a single IC, suggest the industry has progressed beyond this.
This report combines detailed unit shipment information, ASPs and revenues for 12 combination ICs including Bluetooth/FM/WLAN, Bluetooth/UWB, Bluetooth/GPS/FM and WiMax/WLAN. In addition there is a comprehensive focus on how various combination ICs will penetrate into 7 end-equipment markets including cellular handsets, notebook PCs and personal media players (PMPs).
The report includes:
- Detailed unit shipments, ASP and revenues for 12 combination ICs from 2006 to 2011.
- Bluetooth is central to this report therefore there is a specific focus on Bluetooth end-equipment and IC shipments.
- Comprehensive focus on 7 end-equipment markets including cellular handsets, notebooks and PMPs.
- Detailed technology review for 7 technologies including technical specification, standards evolution and current markets served.
- 36 supplier profiles consider wireless products, markets served and public announcements on combination ICs.
- A competitive environment provides an independent overview on which companies are well placed to proceed with combination ICs.
Table of Contents
Executive Summary
Chapter 1 - Introduction, Scope & Methodology
- 1.0 Introduction
- 1.1 Scope
- 1.2 Methodology
- 1.3 Report Content
Chapter 2 - Technology Review
- 2.0 Introduction
- 2.1 Bluetooth
- 2.1.1 Introduction
- 2.1.2 Technical Specification
- 2.1.3 Standards Evolution
- 2.1.4 Markets Served
- 2.2 UWB
- 2.2.1 Introduction
- 2.2.2 Technical Specification
- 2.2.3 Standards Evolution
- 2.2.4 Markets Served
- 2.3 WLAN
- 2.3.1 Introduction
- 2.3.2 Technical Specification
- 2.3.3 Standards Evolution
- 2.3.4 Markets Served
- 2.4 WiMax
- 2.4.1 Introduction
- 2.4.2 Technical Specification
- 2.4.3 Standards Evolution
- 2.4.4 Markets Served
- 2.5 GPS
- 2.5.1 Introduction
- 2.5.2 Technical Specification
- 2.5.3 Standards Evolution
- 2.5.4 Markets Served
- 2.6 NFC
- 2.6.1 Introduction
- 2.6.2 Technical Specification
- 2.6.3 Standards Evolution
- 2.6.4 Markets Served
- 2.7 Wibree
- 2.7.1 Introduction
- 2.7.2 Technical Specification
- 2.7.3 Standards Evolution
- 2.7.4 Markets Served
- 2.8 Technical Advantages of Combination ICs
Chapter 3 - The Supplier Industry and Competitive Environment
- 3.0 Introduction
- 3.1 Competitive Environment
- 3.1.1 Bluetooth & FM
- 3.1.2 UWB (Bluetooth 3.0 and Wireless USB)
- 3.1.3 WLAN & WiMax
- 3.1.4 GPS
- 3.1.5 NFC
- 3.1.6 Wibree
- 3.2 Summary of Technologies Addressed
- 3.3 Summary of Industry Body Involvement
- 3.4 Alereon
- 3.5 Artimi
- 3.6 Atheros
- 3.7 Atmel Corporation
- 3.8 Beceem Communications
- 3.9 Broadcom
- 3.10 Cambridge Silicon Radio (CSR)
- 3.11 Ezurio
- 3.12 Fujitsu Microelectronics
- 3.13 Infineon
- 3.14 Intel
- 3.15 Marvell
- 3.16 National Semiconductors
- 3.17 NemeriX
- 3.18 NXP (formerly Philips Semiconductor)
- 3.19 Omron Advanced Systems
- 3.20 Qualcomm
- 3.21 RedDot Wireless
- 3.22 Renesas
- 3.23 RF Magic
- 3.24 RF Micro Devices
- 3.25 Runcom Technologies
- 3.26 Sequans Communications
- 3.27 Sierre Monolithics
- 3.28 SIGe Semiconductor
- 3.29 SiRF Technology
- 3.30 Staccato Communications
- 3.31 STMicroelectronics
- 3.32 TDK Electronics Ireland Ltd.
- 3.33 TeleCIS Wireless
- 3.34 Texas Instruments (TI)
- 3.35 WaveSat
- 3.36 Wipro
- 3.37 WiQuest
- 3.38 Wisair
- 3.39 Zoran
Chapter 4 - Market Forecasts and Analysis
- 4.0 Introduction
- 4.1 Combination IC Forecasts
- 4.1.1 Introduction
- 4.1.2 Bluetooth Shipment Volumes
- 4.1.3 Total Combination IC Shipments
- 4.1.4 ASPs and Revenues
- 4.2 Secondary Combination ICs
- 4.3 Combination IC Forecasts by Application
- 4.3.1 Cellular Handsets
- 4.3.1.1 Individual Technologies
- 4.3.1.2 Key Drivers for Combined ICs
- 4.3.1.3 Market Forecasts and Assumptions
- 4.3.2 PDAs
- 4.3.2.1 Individual Technologies
- 4.3.2.2 Key Drivers for Combined ICs
- 4.3.2.3 Market Forecasts and Assumptions
- 4.3.3 Notebook PCs
- 4.3.3.1 Individual Technologies
- 4.3.3.2 Key Drivers for Combined ICs
- 4.3.3.3 Market Forecasts and Assumptions
- 4.3.4 Add-in Cards and Dongles
- 4.3.4.1 Individual Technologies
- 4.3.5.2 Key Drivers for Combined ICs
- 4.3.4.3 Market Forecasts and Assumptions
- 4.3.5 Personal Media Players (PMPs)
- 4.3.5.1 Individual Technologies
- 4.3.5.2 Key Drivers for Combined ICs
- 4.3.5.3 Market Forecasts and Assumptions
- 4.3.6 Digital Cameras
- 4.3.6.1 Individual Technologies
- 4.3.6.2 Key Drivers for Combined ICs
- 4.3.6.3 Market Forecasts and Assumptions
- 4.3.7 Light Vehicles
- 4.3.7.1 Individual Technologies
- 4.3.7.2 Key Drivers for Combined ICs
- 4.3.7.3 Market Forecasts and Assumptions
- 4.3.1 Cellular Handsets
List of Tables
- 4.1 WW Market for Bluetooth ICs and Bluetooth-enabled End-equipment Shipped
- 4.2 WW Market for ICs with Multiple Wireless Functionality
- 4.3 WW Market for Combination IC ASPs
- 4.4 WW Market for Combination IC Revenues
- 4.5 WW Market for ICs with Multiple Wireless Functionality for Cellular Handsets
- 4.6 WW Market for Cellular Handsets using ICs with Multiple Wireless Functionality
- 4.7 Handsets with Bluetooth ICs vs. Handsets with Combination Bluetooth ICs
- 4.8 WW Market for WiMax/WLAN ICs for Cellular Handsets
- 4.9 WW Market for ICs with Multiple Wireless Functionality for PDAs
- 4.10 WW Market for PDAs using ICs with Multiple Wireless Functionality
- 4.11 WW Market for ICs with Multiple Wireless Functionality for Notebooks
- 4.12 WW Market for Notebooks using ICs with Multiple Wireless Functionality
- 4.13 Notebook PCs with WLAN ICs vs. Notebook PCs with Combination WLAN ICs
- 4.14 WW Market for WiMax/WLAN ICs for Notebook PCs
- 4.15 WW Market for ICs with Multiple Wireless Functionality for Add-in Cards & Dongles
- 4.16 WW Market for Add-in Cards & Dongles using ICs with Multiple Wireless Functionality
- 4.17 WW Market for WiMax/WLAN ICs for Add-in Cards & Dongles
- 4.18 WW Market for ICs with Multiple Wireless Functionality for PMPs
- 4.19 WW Market for PMPs using ICs with Multiple Wireless Functionality
- 4.20 WW Market for ICs with Multiple Wireless Functionality for Digital Cameras
- 4.21 WW Market for Digital Cameras using ICs with Multiple Wireless Functionality
- 4.22 WW Market for ICs with Multiple Wireless Functionality for Light Vehicles
- 4.23 WW Market for Light Vehicles using ICs with Multiple Wireless Functionality
List of Figures
- 4.1 WW Market for Bluetooth ICs and Bluetooth-enabled End-equipment Shipped
- 4.2 WW Market for ICs with Multiple Wireless Functionality
- 4.3 WW Market for ICs with Multiple Wireless Functionality
- 4.4 WW Market for ICs with Multiple Wireless Functionality for Cellular Handsets
- 4.5 Handsets with Bluetooth ICs vs. Hansets with Combination Bluetooth ICs
- 4.6 WW Market for ICs with Multiple Wireless Functionality for PDAs
- 4.7 WW Market for ICs with Multiple Wireless Functionality for Notebooks
- 4.8 Notebook PCs with WLAN ICs vs. Notebook PCs with Combination WLAN ICs
- 4.9 WW Market for ICs with Multiple Wireless Functionality for Add-in Cards & Dongles
- 4.10 WW Market for ICs with Multiple Wireless Functionality for PMPs
- 4.11 WW Market for ICs with Multiple Wireless Functionality for Digital Cameras
- 4.12 WW Market for ICs with Multiple Wireless Functionality for Light Vehicles
