印刷電子介紹

Abstract

Printed electronics is a term that encompasses thin film transistor circuits (TFTCs), displays, interconnects, power, sensors and even actuators. Thousands of companies have now entered this market. The printing companies today will be the new electronic giants tomorrow. This report is vital reading to understand the opportunity of the technology, players, needs and timelines, giving global coverage from the biggest printing companies in East Asia to paper and packaging companies in Scandinavia to applications of the technology in the Americas.

All significant developments in printed electronics are closely analysed in this report. Unusually, we also look at the many printed electronic devices and displays - electrochromic, electroluminescent, etc. - that are already a commercial reality even on flexible substrates. Today' s successes also employ conductors, batteries, inductors, antennas, capacitors and electrically active materials that are printed. The moving colour billboard and gift card that are printed on flexible plastic are a reality today but rarely reported - there are lessons to be learned. Other advances are close behind, including printed thin film fuel cells and solar cells. Later will come self-adjusting ' use by' dates, printed microprocessors and other wonders. This report describes technical and market development and the range of new applications and new suppliers being spawned as a result.

Table of Contents

EXECUTIVE SUMMARY AND CONCLUSIONS

1. INTRODUCTION

• 1.1. Definition and destination
  • 1.1.1. Background
  • 1.1.2. New concepts - rollable, origami and edible electronics
  • 1.1.3. Origami electronics
  • 1.1.4. Ubiquitous Sensor Networks
  • 1.1.5. Electronic packaging
  • 1.1.6. Conformal electronics/ electronic wallpaper
  • 1.1.7. Wearable and very portable electronics
  • 1.1.8. Old concepts revisited - fault tolerant electronics, hard programmed electronics
  • 1.1.9. Electronics without circuits
• 1.2. The technical needs for printed electronics
  • 1.2.1. Replacing and enhancing conventional print
  • 1.2.2. Replacing the silicon chip
  • 1.2.3. Replacing conventional displays
  • 1.2.4. Replacing conventional lighting
  • 1.2.5. Transforming the human interface and new forms of safety and security
  • 1.2.6. New forms of amusement and merchandising
  • 1.2.7. New forms of drug delivery
  • 1.2.8. Products that are light, rugged and extremely low cost
• 1.3. Smart locations
• 1.4. Industries that need to collaborate
• 1.5. Value chain and life beyond plastic electronics
• 1.6. Interim products with silicon chips
• 1.7. Impediments to printed electronics

2. PRINTABLE CIRCUIT ELEMENTS

• 2.1. Substrates
• 2.2. Conductors
  • 2.2.1. Choice of conductors
  • 2.2.2. Printing with inks - the options
  • 2.2.3. Progress with conductive inks
• 2.3. Semiconductors

3. COMPONENTS - LOGIC AND MEMORY

• 3.1. Logic
  • 3.1.1. Transistor design
  • 3.1.2. Benefits and applications envisaged for TFTCs in general
  • 3.1.3. Development path
  • 3.1.4. Company strategy and value chain
• 3.2. Memory

4. COMPONENTS - DISPLAYS, SIGNAGE AND LIGHTING

• 4.1. Displays
• 4.2. Non-emissive displays
  • 4.2.1. Thermochromic
  • 4.2.2. Electrochromic
  • 4.2.3. Electrophoretic
  • 4.2.4. Electrowetted displays
  • 4.2.5. Electrochemical displays on paper
• 4.3. Emissive displays
  • 4.3.1. AC Electroluminescent
  • 4.3.2. OLED

5. LIGHTING

• 5.1. AC electroluminescent lighting.
• 5.2. OLED lighting

6. COMPONENTS - POWER

• 6.1. Photovoltaics
• 6.2. Batteries
  • 6.2.1. Button batteries vs laminar batteries
  • 6.2.2. Choices of laminar battery
  • 6.2.3. Applications of laminar batteries
  • 6.2.4. Leeds Lithium Power
  • 6.2.5. Infinite Power Solutions
  • 6.2.6. Solicore, USA
  • 6.2.7. SCI Engineered Materials, USA
  • 6.2.8. Power Paper
  • 6.2.9. Thin Battery Technologies
  • 6.2.10. Printed battery research
• 6.3. Fuel cells

7. SENSORS

• 7.1. General situation and examples
• 7.2. Photodetector arrays
  • 7.2.1. Printed flexible scanners
  • 7.2.2. Nanoident - world' s first printed semiconductor factory

8. CO-DEPOSITED COMPONENTS

9. BROAD OVERVIEW OF TIMELINES AND MARKETS

• 9.1. General scenario to 2025
• 9.2. OLEDs
• 9.3. Ubiquitous Sensor Networks
• 9.4. Photovoltaics
• 9.5. Conductive patterns
• 9.6. Lighting

APPENDIX 1: IDTECHEX PUBLICATIONS

APPENDIX 2: GLOSSARY