生產覆晶晶片用微影及蝕刻技術市場

Abstract

Flip chip packaging is currently growing at a 28% compound annual rate, and the lithography and etch market will be major beneficiaries. Flip chip packaging eliminates the need for wire bonding by placing the contact points of the chip in direct contact with the packaging substrate and requiring the stringent control of the placement of the chip on the substrate. This method of advanced packaging of ICs offers advantages in size, signal speed, cost, and reliability.

This report analyzes the manufacture of flip chips and analyzes the market to 2009. Lithography and wet etch equipment are also analyzed and forecast to 2009.

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Flip Chip Issues and Trends

• 3.1 Introduction
• 3.2 Wafer Bumping
  • 3.2.1 Solder Bumps
    • 3.2.1.1 Metallurgy
    • 3.2.1.2 Deposition Of UBM
    • 3.2.1.3 Sputter Etching
    • 3.2.1.4 Photolithography
    • 3.2.1.5 Solder Deposition
    • 3.2.1.6 Resist Strip
    • 3.2.1.7 UBM Wet Etch
    • 3.2.1.8 Reflow
    • 3.2.1.9 Flux Issues
  • 3.2.2 Gold Bumps
    • 3.2.2.1 Bump Processing
    • 3.2.2.2 Bonding
    • 3.2.2.3 Coplanarity
    • 3.2.2.4 Conductivity
    • 3.2.2.5 Thermal Properties
    • 3.2.2.6 Size
    • 3.2.2.7 Reliability
    • 3.2.2.8 Cost Issues
  • 3.2.3 Copper Pillar Bumps
  • 3.2.4 Copper Stud Bumping
  • 3.2.5 C4NP
• 3.3 Wafer Level Packaging
• 3.4 Pad Redistribution
• 3.5 Wafer Bumping Costs
  • 3.5.1 Wafer Redistribution And Wafer Bumping Costs
  • 3.5.2 WLCSP Hidden Costs
  • 3.5.3 WLCSP Cost Per Good Die
  • 3.5.4 Wafer-Level Underfill Costs

Chapter 4 Lithography Issues And Trends

• 4.1 Issues4-1
  • 4.1.1 Technical Performance
  • 4.1.2 Capital Investment
  • 4.1.3 Cost Of Consumables
  • 4.1.4 Throughput
  • 4.1.5 Ease Of Use
  • 4.1.6 Flexibility
  • 4.1.7 Equipment Support
  • 4.1.8 Resolution
  • 4.1.9 Solder Bumping Capabilities
  • 4.1.10 Gold Bumping Capabilities
• 4.2 Exposure Systems
  • 4.2.1 Introduction
    • 4.2.1.1 Reduction Steppers
    • 4.2.1.2 Full-Field Projection
    • 4.2.1.3 Mask Aligners
    • 4.2.1.4 1x Steppers
• 4.3 Competitive Technologies
  • 4.3.1 Inkjet Printing
  • 4.3.2 Stencil/Screen Printing
  • 4.3.3 Electroless Metal Deposition

Chapter 5 UBM Etch Issues And Trends

• 5.1 Introduction
• 5.2 Technology Issues And Trends
  • 5.2.1 Process Flow
  • 5.2.2 Etch Process
  • 5.2.3 Etch Chemistry
• 5.3 Batch Versus Single-Wafer Etching

Chapter 6 Market Analysis

• 6.1 Market Drivers For Flip Chip And Wlp
  • 6.1.1 WLP For Small Die
  • 6.1.2 WLP For Medium Die
  • 6.1.3 WLP For Large Die
• 6.2 Market Opportunities
• 6.3 Challenges
• 6.4 Flip Chip Market
• 6.5 Lithography Market
  • 6.5.1 Aligners Vs. Steppers
  • 6.5.2 Market Analysis
• 6.6 Wet Etch Market