Abstract
This IDC study includes market forecast data and analysis on a worldwide basis for connectivity in the mobile phone semiconductor market for 2007-2012. This document provides detail on eight emerging technologies: Bluetooth, FM radio, WiFi, GPS, WiMAX, mobile TV, UWB, and NFC. It provides an analysis on the adoption of these technologies into mobile phones and identifies variations between 2G/2.5G and 3G/3.5G penetration. Our forecast assumptions are outlined, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast to the prior forecast is also noted.
"Connectivity is a primary driver in transforming mobile phones into a broader class of mobile communication devices, and a variety of emerging connectivities are gaining visibility and influence in the mobile phone semiconductor market. Connectivity semiconductor revenues in mobile phones will increase from $2.1 billion in 2007 to $4.6 billion in 2012, almost 17% CAGR over this period." - Flint Pulskamp, program manager, Wireless Semiconductors
Table of Contents
- Table of Contents
- IDC Opinion
- In This Study
- Scope
- Methodology
- Situation Overview
- Connectivity is Changing the Way Mobile Phones are Used
- Future Outlook
- Forecast and Assumptions
- Connectivity is a Key Revenue Driver for Mobile Phone Semiconductors
- Figure: Worldwide Mobile Phone Connectivity Chipset All Technologies Attach Rate, 2007-2012
- Figure: Worldwide Mobile Phone Connectivity Chipset Shipments, 2007 and 2012
- Figure: Worldwide Mobile Phone Connectivity Discrete Chipset ASPs, 2007-2012
- Figure: Worldwide Mobile Phone Connectivity Chipset Revenue, 2007-2012
- Connectivity Attach Rates will vary by Cellular Air Interface
- Figure: Worldwide Mobile Phone Connectivity Chipset Attach Rate for 3G/3.5G, 2007-2012
- Table: Worldwide Mobile Phone Connectivity Chipset Shipments for 3G/3.5G, 2007-2012 (M)
- Figure: Worldwide Mobile Phone Connectivity Chipset Attach Rate for 2G/2.5G, 2007-2012
- Table: Worldwide Mobile Phone Connectivity Chipset Shipments for 2G/2.5G, 2007-2012 (M)
- Integration of Mobile Phone Connectivity into Combo Chips
- Integration Trend #1-Integrate the non-cellular Connectivity
- Figure: Integration Trends in Mobile Phone Connectivity Chipsets
- Integration Trend #2-Integrate the Cellular system with the Connectivity
- Figure: Worldwide Stand-Alone and Combo Mobile Phone Connectivity Chipset Share, 2007-2012
- Mobile Phone Combo Chip Detail by Connectivity
- Figure: Worldwide Mobile Phone FM Radio Combo Chipset Shipments and Share, 2007-2012
- Figure: Worldwide Mobile Phone Bluetooth Combo Chipset Shipments and Share, 2007-2012
- Figure: Worldwide Mobile Phone GPS Combo Chipset Shipments and Share, 2007-2012
- Figure: Worldwide Mobile Phone WiFi Combo Chipset Shipments and Share, 2007-2012
- Figure: Worldwide Mobile Phone WiMAX Combo Chipset Shipments and Share, 2007-2012
- Figure: Worldwide Mobile Phone UWB Combo Chipset Shipments and Share, 2007-2012
- Figure: Worldwide Mobile Phone Mobile TV Combo Chipset Shipments and Share, 2007-2012
- Figure: Worldwide Mobile Phone NFC Combo Chipset Shipments and Share, 2007-2012
- Assumptions
- Table: Key Forecast Assumptions for the Worldwide Mobile Phone Connectivity Chipset Market, 2008-2012
- Market Context
- Table: Worldwide Mobile Phone Connectivity Chipset Revenue, 2007-2012: Comparison of October 2007 and January 2008 Forecasts ($M)
- Figure: Worldwide Mobile Phone Connectivity Chipset Revenue, 2007-2012: Comparison of October 2007 and January 2008 Forecasts
- Forecast and Assumptions
- Essential Guidance
- Applications Processor and Multimedia coprocessor vendors
- Transceiver/Radio vendors
- Platform Chipset vendors
- Mobile memory vendors
- Learn More
- Related Research
- Definitions
- Systems
- Subsystems
- Semiconductor Components
- Cellular Air Interface Standards
- Table: Worldwide Cellular Air Interface Standards
- Synopsis
