Abstract
REPORT DESCRIPTION
This report covers the design analysis of an Ericsson W-CDMA 2100MHz power
amplifier unit. This unit is an integral part of an Ericsson W-CDMA base
transmitting station (BTS). The unit was manufactured in early 2003.
A complete bill of materials of all active semiconductors and passive
components is presented with the following information:
- Complete Part Number/Marking
- Component Manufacturer Identification
- Functional Component Description
- Package Type
THERE IS NO COMPONENT PRICING INFORMATION CONTAINED WITHIN THE REPORT.
TARGETED USERS
- Mobile Operators
- Base Station Equipment OEMs
- RF Subsystems Manufacturers
- Semiconductor Manufacturers
BENEFITS
- Proprietary Data
- Comprehensive Bill of Materials Analysis
- Mechanical Design Analysis
FEATURES
- Total Pages: 49
- Total Tables: 10
- Total Exhibits: 42
- Full Color Pictures of PCB and Modules
- Mechanical Drawings and Dimensions
- Complete Part Number Identification
- Complete Component PCB Placement Identification
SUPPPLIERS
The following semiconductor & passive component suppliers are included in
this report:
Ace Technology, Analog Devices, Anaren AVX, Freescale Semiconductor,
Huber+Suhner, Intel, International Rectifier, Kemet, Maxim
Integrated,Merrimac, Murata Electronics, National Semiconductor,ON
Semiconductors, RF Microdevices, Samsung,Skyworks Solutions,
STMicroelectronics, Texas Instruments,Tyco Electronics M/A-COM.
Table of Contents
- EXECUTIVE SUMMARY
- Active/Passive Component Summary
- Important Note:
CHAPTER 1: ERICSSON W-CDMA RBS TECHNOLOGY
- 1.1 Overview of Ericsson W-CDMA RBS Technology
CHAPTER 2: W-CDMA POWER AMPLIFIER PRODUCT
- 2.1 Mechanical Analysis
- 2.2 System Architecture Analysis
- 2.3 Digital Control Section
- 2.4 DC/DC Power Supply Module Section
- 2.5 RF Cavity Filter Section
- 2.6 Small Signal RF Section
- 2.7 High Power RF Section
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE
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